Board Level Drop Simulations and Modal Analysis in the Flip Chips with Solder Balls of Sn-1.0Ag-0.5Cu Considering Underfill (언더필을 고려한 Sn-1.0Ag-0.5Cu 조성의 솔더볼을 갖는 플립칩에서의 보드레벨 낙하 및 진동해석)
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- Journal of the Korean Society of Manufacturing Technology Engineers
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- 제21권2호
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- pp.225-231
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- 2012