• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1645-1650
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• 2003

A numerical and experimental study is made of thermal behavior of a hot chuck which is specially designed for flip-chip bonders. The hot chuck consists of radiant heat sources and a heated plate of very high conductivity, which is for achievement of high-speed heat-up. A simplified numerical model is developed to simulate unsteady thermal behavior of the heated plate. Parallel experimental work is also conducted for a prototype of the hot chuck. Based on the experimental data, the numerical model is tuned to improve the reliability and accuracy. Design analysis using the numerical model is conducted. The results of numerical computations illustrate that the radiant heater system adopted in this study satisfies the key design requirements for a high-performance hot chuck.