• Title/Summary/Keyword: 플라즈마 가진

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RF-Magnetron Sputtering방법을 이용한 ETFE 친수 특성

  • Choe, Myeong-Gyu;Kim, Dong-Yeong;Bae, Gang;Baek, Cheol-Heum;Kim, Hwa-Min
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.149.2-149.2
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    • 2013
  • 친 환경적 소재인 ETFE (Ethylene Tetra Fluoro Ethylene)는 내화학성과 단열성을 가지며 탁월한 빛투과성, 자정효과 및 초경량 소재의 특성을 가진 열가소성 불소수지로서 서울시 신청사, Water Cube라고 많이 알려진 베이징 올림픽 수영 경기장 같은 대형 건축물의 외벽에 사용될 만큼 최근 세계 각국의 건축가들에게 각광을 받고 있다. 본 실험에서는 영구자석을 이용한 고밀도 플라즈마로 높은 점착성과, 균일한 박막 및 대면적 공정이 가능한 RF-magnetron sputtering방법으로 기판인 Slide glass위에 ETFE를 증착하여 접촉각의 변화와 구조적 및 광학적 특성에 대하여 측정하였다. 접촉각 측정결과 35w에서 $15^{\circ}$ 이하의 친수 특성을 나타내었고, 자외선 파장에서의 투과율 측정 결과 87% 이상의 높은 투과율을 나타내었다. AFM (Atomic Force Microscope) 측정결과 35 W에서 1.6 nm의 RMS (Root mean square)값이 측정 되었다. ETFE 특성은 비가 오면 자동으로 이물질이 씻겨 내려 주기적으로 청소를 해줘야하는 유리보다 유지관리비가 적게 될 것으로 사료되고, 높은 자외선 투과율을 보임으로 온실에서 균형 잡힌 식물 성장을 위한 화학약품의 소모를 줄여 줄 것으로 사료된다.

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Study on the Optical Characteristics of the Green Phosphor for PDP Application (PDP용 녹색 형광체의 광 특성 개선에 관한 연구)

  • Han, Bo Yong;Yoo, Jae Soo
    • Korean Chemical Engineering Research
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    • v.47 no.2
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    • pp.150-156
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    • 2009
  • Plasma Display Panels(PDPs) require to have improved luminous efficiency, low manufacturing cost, and high image quality to compete with other flat display devices such as Liquid Crystal Displays(LCDs) and organic light-emitting diodes(OLEDs). In addition, the diversity of product line-up may be needed for high market share. In this paper, the optical characteristics of typical green phosphor for PDP application are reviewed and the problem-based solution will be proposed. We also shortly describe the principle of 3D-PDPs which are promising. Then, the requirement of green phosphor for 3D-PDP application is summarized and research achievement, as of now, is described. The typical problems of $Zn_2SiO_4:Mn$ phosphor, which is the most well-known, are the negatively charged surface property and the long decay time, which leads to unstable discharge in green cell and afterimage. These problems were solved by coating the phosphor surface with metallic oxide. It was found that $Al_2O_3$ would be the best material for $Zn_2SiO_4:Mn$ phosphor. It gives longevity as well as low operating voltage due to the charging effect in green cells. Also, new phosphors, $(Y,\;Gd)Al_3(BO_3)_4:Tb$ and $(Mg,\;Zn)Al_2O_4:Mn$ phosphor are proposed for increasing the luminance and reducing the decay time, which are capable to apply for 3D-PDP application.

Tunnel Magnetoresistance with Top Layer Plasma Oxidation Time in Doubly Oxidized Barrier Process (이중 절연층 공정에서 상부절연층의 산화시간에 따른 터널자기저항 특성연구)

  • Lee, Ki-Yung;Song, Oh-Sung
    • Journal of the Korean Magnetics Society
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    • v.12 no.3
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    • pp.99-102
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    • 2002
  • We fabricated TMR devices which have doubly oxidized tunnel barrier using plasma oxidation method to form homogeneously oxidized AlO tunnel barrier. We sputtered 10 $\AA$-bottom Al layer and oxidized it with oxidation time of 10 sec. Subsequent sputtering of 13 $\AA$-Al was performed and the metallic layer was oxidized for 50, 80, and 120 sec., respectively. The electrical resistance changed from 500 Ω to 2000 Ω with increase of oxidation time, while variation of MR ratio was little spreading 27∼31 % which is larger than that of TMR device of ordinary single tunnel barrier. We calculated effective barrier height and width by measuring I-V curves, from which we found the barrier height was 1.3∼1.8 eV sufficient for tunnel barrier, and the barrier width (<15.0 $\AA$) was smaller than physical thickness. Our results may be caused by insufficient oxidation of Al precursor into A1$_2$O$_3$. However, doubly oxidized tunnel barriers were superior to conventional single tunnel barrier in uniformity and density. Our results imply that we were able to improve MR ratio and tune resistance by employing doubly oxidized tunnel barrier process.

c-BN 박막의 박리현상에 미치는 공정인자의 영향

  • 이성훈;변응선;이건환;이구현;이응직;이상로
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.148-148
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    • 1999
  • 다이아몬드에 버금가는 높은 경도뿐만 아니라 높은 화학적 안정성 및 열전도성 등 우수한 물리화학적 특성을 가진 입방정 질화붕소(cubic Boron Nitride)는 마찰.마모, 전자, 광학 등의 여러 분야에서의 산업적 응용이 크게 기대되는 자료이다. 특히 탄화물형성원소에 대해 안정하여 철계금속의 가공을 위한 공구재료로의 응용 또한 기대되는 재료이다. 특히 탄화물형성원소에 대해 안정하여 철계금속의 가공을 위한 공구재료로의 응용 또한 크게 기대된다. 이 때문에 각종의 PVD, CVD 공정을 이용하여 c-BN 박막의 합성에 대한 연구가 광범위하게 진행되어 많은 성공사례들이 보고되고 있다. 그러나 이러한 c-BN 박막의 유용성에도 불구하고 아직 실제적인 응용이 이루어지지 못한 것은 증착직후 급격한 박리현상을 보이는 c-BN 박막의 밀착력문제때문이다. 본 연구에서는 평행자기장을 부가한 ME-ARE(Magnetically Enhanced Activated Reactive Evaporation)법을 이용하여 c-BN 박막을 합성하고, 합성된 c-BN 박막의 밀착력에 미치는 공정인자의 영향을 규명하여, 급격한 박리현상을 보이는 c-BN 박막의 밀착력 향상을 위한 최적 공정을 도출하고자 하였다. BN 박막 합성은 전자총에 의해 증발된 보론과 (질소+아르곤) 플라즈마의 활성화반응증착(activated reactive evaporation)에 의해 이루어졌다. 기존의 ARE장치와 달리 열음극(hot cathode)과 양극(anode)사이에 평행자기장을 부여하여 플라즈마를 증대시켜 반응효율을 높혔다. 합성실험용 모재로는 p-type으로 도핑된 (100) Si웨이퍼를 30$\times$40 mm크기로 절단 후, 100%로 희석된 완충불산용액에 10분간 침적하여 표면의 산화층을 제거한후 사용하였다. c-BN 박막을 얻기 위한 주요공정변수는 기판바이어스 전압, discharge 전류, Ar/N가스유량비이었다. 증착공정 인자들을 변화시켜 다양한 조건에서 c-BN 박막의 합성하여 밀착력 변화를 조사하였다. 합성된 박막의 결정성 분석을 FTIR을 이용하였으며, Bn 박막의 상 및 미세구조관찰을 위해 투과전자현미경(TEM;Philips EM400T) 분석을 병행하였고, 박막의 기계적 물성 평가를 위해 미소경도를 측정하였다. 증착된 c-BN 박막은 3~10 GPa의 큰 잔류응력으로 인해 증착직후 급격한 박리현상을 보였다. 이의 개선을 위해 증착중 기판바이어스 제어 및 후열처리를 통해 밀착력을 수~수백배 향상시킬 수 있었다. c-BN 박막의 합성을 위해서는 증착중인 박막표면으로 큰 에너지를 갖는 이온의 충돌이 필요하기 때문에 기판 바이어스가 요구되는데, c-BN의 합성단계를 핵생성 단계와 성장 단계로 구분하여 인가한 기판바이어스를 달리하였다. 이 결과 그림 1에서 나타낸 것처럼 c-BN 박막의 핵생성에 필요한 기판바이어스의 50% 정도만을 인가하였을 때 잔류응력은 크게 경감되었으며, 밀착력이 크게 향상되었다.

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Application of Laser-Induced Breakdown Spectroscopy (LIBS) for In-situ Detection of Heavy Metals in Soil (토양내 중금속 실시간 탐지를 위한 레이저 유도붕괴 분광법의 활용에 대한 소개)

  • Ko, Eun-Joung;Hamm, Se-Yeong;Kim, Kyoung-Woong
    • Economic and Environmental Geology
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    • v.40 no.5
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    • pp.563-574
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    • 2007
  • Laser induced breakdown spectroscopy (LIBS) is a recently developed analytical technique that is based upon the measurement of emission lines generated by atomic species close to the surface of the sample, thus allowing their chemical detection, identification and quantification. With powerful advantages of LIBS compared to the conventional analytical methodology, this technique can be applied in the detection of heavy metals in the field. LIBS allows the rapid analysis by avoiding laborious chemical steps. LES have already been applied for the determination of element concentration in a wide range of materials in the solid, liquid and gaseous phase with simplicity of the instrument and diversity of the analytical application. These feasibility of rapid multi elemental analysis are appealing proprieties for the in-situ analytical technique in geochemical investigation, exploration and environmental analysis. There remain still some limitations to be solved for LIBS to be applied in soil environment as an in-situ analytical technology. We would like to provide the basic principle related to the plasma formation and laser-induced breakdown of sample materials. In addition, the matrix effect, laser properties and the various factors affecting on the analytical signal of LIBS was dealt with to enhance understanding of LIBS through literature review. Ultimately, it was investigated the feasibility of LIBS application in soil environment monitoring by considering the basic idea to enhance the data quality of LIBS including the calibration method for the various effects on the analytical signal of LIBS.

Investigation on the Electrical Characteristics of mc-Si Wafer and Solar Cell with a Textured Surface by RIE (플라즈마기반 표면 Texturing 공정에 따른 다결정 실리콘 웨이퍼 표면물성과 태양전지 동작특성 연구)

  • Park, Kwang-Mook;Jung, Jee-Hee;Bae, So-Ik;Choi, Si-Young;Lee, Myoung-Bok
    • Journal of the Korean Vacuum Society
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    • v.20 no.3
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    • pp.225-232
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    • 2011
  • Reactive ion etching (RIE) technique for maskless surface texturing of mc-silicon solar wafers has been applied and succeed in fabricating a grass-like black-silicon with an average reflectance of $4{\pm}1%$ in a wavelength range of 300~1,200 nm. In order to investigate the optimized texturing conditions for mass production of high quantum efficiency solar cell Surface characteristics such as the spatial distribution of average reflectance, micrscopic surface morphology and minority carrier lifetime were monitored for samples from saw-damaged $15.6{\times}15.6\;cm^2$ bare wafer to key-processed wafers as well as the mc-Si solar cells. We observed that RIE textured wafers reveal lower average reflectance along from center to edges by 1% and referred the origin to the non-uniform surface structures with a depth of 2 times deeper and half-maximum width of 3 times. Samples with anti-reflection coating after forming emitter layer also revealed longer minority carrier lifetime by 40% for the edge compared to wafer center due to size effects. As results, mc-Si solar cells with RIE-textured surface also revealed higher efficiency by 2% and better external quantum efficiency by 15% for edge positions with higher height.

A Study on the Characterisitics of Reactive Ion Etching (Cylindrical Magnetron을 사용한 실리콘의 반응성 이온 건식식각의 특성에 관한 연구)

  • Yeom, Geun-Yeong
    • Korean Journal of Materials Research
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    • v.3 no.4
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    • pp.327-335
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    • 1993
  • Using a RF cylindrical magnetron operated with two electromagnets having a Helmholz configuration, RF magnetron plasma properties and characteristics of reactive ion ething of Si were investigated as a function of applied magnetic field strengths using 3mTorr $CF_4/H_2$ and $CHF_3$. Also, I-V characteristics of Schottky diodes, which were made of silicons etched under different applied magnetic field strengths and gas environments, were measured to investigate the degree of radiation damage during the reactive ion etching. As the magnetic field strent;th increased, ion densities and radical densities of the plasmas were increased linearly, however, the dc self-bias voltages induced on the powered electrode, where the specimen are located, were decreased exponentially. Maximum etch rates, which were 5 times faster than that etched without applied magnetic filed, were obtained using near lOOGauss, and, under these conditions, little or no radiation damages on the etched silicons were found.

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A Study on the Microstructural Characteristics of Tungsten by Boron Addition (붕소의 첨가에 따른 텅스텐의 미세조직 변화에 관한 연구)

  • Yoon, Kook Han;Kim, Young Do;Kim, Hyon Tae;Yoo, Myoung Ki;Choi, Ju
    • Analytical Science and Technology
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    • v.5 no.1
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    • pp.127-134
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    • 1992
  • Effects of boron addition on microstructure and phases of plasma are melted tungsten have been investigated by optical microscopy, scanning electron microscopy, Auger electron spectroscopy, X-ray diffractometer, measurements of grain size and hardness. The change in the microstructure upon boron addition was studied by optical microscopy. It was observed that the grain refinement was induced upon content within the limit of solubility. When the boron content was above the solubility limit, two phases of primary tungsten and eutectic structure were observed and confirmed by AES and XRD analysis. It was also shown that recrystallization temperature was increased and recrystallized grain size was reduced as boron content increased.

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Effects of $C_2F_{6}$ Gas on Via Etching Characteristics ($C_2F_{6}$ 가스가 Via Etching 특성에 미치는 영향)

  • Ryu, Ji-Hyeong;Park, Jae-Don;Yun, Gi-Wan
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.1
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    • pp.31-38
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    • 2002
  • In order to improve the 0.35 $mutextrm{m}$-via hole etching process the etching characteristic of the gas $C_2F_{6}$ has been analyzed. The samples were triple-layer films(TEOS/SOG/TEOS) on 8-inch wafers and the orthogonal array matrix technique was used for the process. The equipment for etching was the transformer coupled plasma (TCP) source which is a type of high density plasma(HDP). This experiment showed the etching rate for $C_2F_{6}$ was 0.8 $mutextrm{m}$/min-1.1 $mutextrm{m}$/min and the measured uniformity was under $pm$6.9% in the matrix window. The CD skew comparison between pre and post-etching was under 10% which is an outstanding results in the window of profile in anisotropic etching. There was no problem in C2F6 with the flow rate of 20sccm, but when 14sccm of $C_2F_{6}$ was supplied there was a recess problem on the inner wall of SOG film. Consequently the etching characteristic of $C_2F_{6}$ shows a fast etching rate and a very wide process window in HDP TCP.

금 나노패턴을 이용한 서브파장구조를 가진 광대역 무반사 글래스의 제작 및 특성

  • Im, Jeong-U;Lee, Su-Hyeon;Guan, Xiang-Yu;Kim, Jeong-Tae;Jeong, Gwan-Su;Yu, Jae-Su
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.279.1-279.1
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    • 2014
  • 글래스(glass), 폴리머 또는 쿼츠와 같은 투명기판은 렌즈, 디스플레이, 광검출기, 광센서, 발광다이오드 및 태양전지와 같은 광 및 광전소자 분야에서 널리 사용되고 있다. 이러한 소자들의 경우, 광추출 또는 광흡수 효율을 향상시키는 것이 매우 중요하다. 그러나 투명기판의 경우, 약 1.5의 굴절율로 인해 표면에서 4% 반사가 발생되는데, 이러한 광학적 손실은 소자의 성능을 저하시키는 원인이 된다. 따라서, 글래스와 공기 경계면에서 발생되는 광손실을 줄이기 위한 효율적인 무반사 코팅이 필요하다. 최근, 우수한 내구성 뿐만 아니라, 광대역 파장 및 다방향성에서 무반사 특성을 보이는 서브파장 주기를 갖는 나노구조(subwavelength structures)의 형성 및 제작 공정에 관한 연구가 보고되고 있다. 이러한 나노구조는 경사 굴절율 분포를 가지는 유효 매질을 형성하기 때문에 투명기판 표면에서의 Fresnel 반사로 인한 광손실을 줄일 수 있다. 또한, 무반사 서브파장구조를 형성하기 위한 패터닝 방법으로, 간단/저렴하고 대면적 제작이 용이한 열적 응집 공정을 이용한 자가정렬된 금속 나노입자 형성 기술이 널리 사용되고 있다. 따라서 본 실험에서는 열적 응집현상에 의해 형성된 비주기적 금 나노입자 식각 마스크 패턴 및 유도결합 플라즈마 장비를 이용하여 글래스 기판 위에 무반사 서브파장 나노구조를 제작하였다. 금 나노패턴 및 제작된 글래스 서브파장 나노구조의 식각 프로파일은 주사전자현미경을 사용하여 관찰하였으며, UV-Vis-NIR 스펙트로미터를 사용하여 빛의 투과율을 측정하였다. 또한, 제작된 샘플들에 대해서, 표면 접촉각 측정 장비를 이용하여 표면 wettability를 조사하였다.

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