• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.273-275
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• 2003

본 실험은 고출력 반도체 레이저의 p-side-down 마운팅용 솔더로서 AuSn 합금 솔더(80wt%:20wt%)의 적합성에 대해 연구하였다. $1{\mu}m$이하의 균일도로 폴리싱 된 Cu heat sink의 표면에 두께 $1{\mu}m$의 Ni로 코팅을 한다음, AuSn 다층박막은 e-beam 증착기로 AuSn 합금 솔더는 열증착기로 각각 증착하였다. 열처리는 산화 방지를 위해 $N_2$ 분위기에서 행하였으며, 동일한 압력으로 마운팅을 하였다. 표면의 거칠기와 형상은 AFM(Atomic Force Microscope)과 SEM(Scanning Electron Microscopy)으로 그리고 Au와 Sn의 성분비는 AES(Auger Electron Spectroscopy) 로 비교하였다. 또한 CW(연속발진)을 통한 L-I(Light-Current)측정을 통해 본딩상태를 비교하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.2
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• pp.26-32
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• 2010

This paper reports some experimental result in grinding and polishing of silicon cathodes used in semiconductor manufacturing process. Cup shape diamond core wheels were used in experiments and the radial and tangential grinding forces were measured with surface roughness. In polishing experiments, flat type and donut type wool polishing tools were tested. The experimental results indicate that the grinding forces are proportional to the material removal rates and the surface roughness are inversely proportional to the spindle speed. The surface roughness of polished Si decreases with polishing time and higher spindle speed.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.7B
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• pp.1215-1225
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• 2000

본 논문에서느 윈도우에 기반을 둔 지능적인 폴리싱 메커니즘을 제안하다. 이전의 메커니즘들이 소스 파라메터만을 인수로 삼은 반면에, 제안 알고리즘은 링크의 현재 상태를 고려할 수 있도록 망으로부터 얻어진 추가 파라메터를 이용한다. ATM 교환기 노드에서 링크이 점유율을 나타내는 버퍼점유율을 추가 파라메터로 제안하였다. 또한, 소스 트래픽의 효과적인 제어를 위해서 퍼지 논리에 따라 다음 윈도우의 셀 허용치를 결정한다. 제안 알고리즘으 모의실험 결과는 본 알고리즘이 기존 퍼지 알고리즘과 같이 기본 요구사항을 잘 수행함을 보여준다. 그리고, 제안한 버퍼정유율을 포함시킴으로서 다중화기의 셀량에 따른 분산치가 다른 알고리즘에 비해 훨씬 안정되어 감을 보이고 있다. 이러한 점에서, 제안 알고리즘이 귀한 정보인 버퍼점유율을 이용해 폭주를 피하는 등의 더 좋은 망 상태를 추가적인 장점으로 확인할 수 있다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.55-56
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• 2006

This research was carried out to observe the structure and characteristics of SUBA pad for silicon wafer polishing. As the diamond size is smaller and shape is rounder, the pad cut rate becomes smaller. From the experimental results, we suggests that the diamond grade should be over 680 when the diamond mesh is between #100 and #170 for SUBA pad.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.950-955
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• 2001

For the development of an ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We analyze and test the unit removal profiles for a ball type polishing tool. Using these results we calculate dwell time distributions and residual errors for a target removal shape. We use the polishing simulation method and feed rate calculation method for the dwell time calculation. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.783-786
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• 2000

For the development of a ultra-precision CMC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We got good dwell time distributions and small residual when we used the FFT calculation method. This results will be used for the optimization of corrective polishing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.1009-1014
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• 1997

The small material removal rate of elastic emission machinong (EEM) becomes a serious problem due to using fine powder particles for obtaining finished of high quality. If a cylindrical polyurethane-wheel is used as a tool for accelerating powder particles, the efficiency of machining may be increased through enlarging the machining regionand increasing the surface velocity of the wheel. If these analyicl results are compared with experimental ones, characteristics of EEM using polyurethan-wheel can be clarified. In this study, effects of EEM using cylindrical polyurethane-wheel on the surface roughness and the material removal rate were verified through polishing of the brittle material under various conditions. The high-efficient polishing of silicon wafer has been also carried out using this method.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.1
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• pp.77-82
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• 2009

This paper reports a kinematic analysis and experimental results for the polishing process of G7 LCD glass. A kinematic analysis for the relative motion of the upper plate and lower plate has been done and computer simulation has been programmed. A series of polishing experiments has also been carried out and compared with analytical data. The experimental results agreed well with analytical ones. The experimental results indicate that the polishing removal is proportional to the relative speed and pressure.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.1
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• pp.86-95
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• 2011

Ultra-precision machining technology is the essential core technology in today's micro-electronics and electro-optical industries. The needs for processing systems to manufacture products to nanometer(nm) accuracy and sub-nanometer resolutions are increased recently. By using ion beam, it is possible to fabricate ultra-precision and ultra-fine products with nm accuracy and sub-nm resolution. In this paper, the basic research trends of ultra precision machining technology in domestic are surveyed, and the ways to reach to the world-leading level of basic research capabilities in the field of ultra-precision machining technology in domestic is suggested.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.850-853
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• 2000

It is well-known that Electro-rheological(ER) fluid is a material(suspension) which shows the dramatic change of rheological properties under an electric field. Using these properties, the concept that variable apparent viscosity of ER fluid could be applicable to the polishing for micro parts was introduced. It was investigated that how it works for polishing and how it affects ER effect when abrasives were mixed with an ER fluid. Therefore a few structures for polishing using ER fluid was suggested and evaluated by means of experiments. In this paper, fundamental mechanism and experimental results are described.