• Composites Research
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• v.30 no.5
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• pp.288-296
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• 2017

The focus of this study is to experimentally investigate the heat dissipation characteristics of poly (methyl methacrylate) (PMMA) composite films with phase change materials (PCM) to resolve heat build-up problems encountered in various electronic devices. In this study, two different types of phase change materials were used to fabricate the composite films by compression molding method and PCM paste sealing method then compared. It was observed in this study that the heat dissipation capability of PCM/PMMA composite films was remarkably enhanced by applying graphite sheet or graphene film into the composite due to their high thermal conductivity. These PCM/ PMMA composite films were attached on the hot spot inside smart phone and tested its surface temperature change according to time. The heat dissipation capability of PCM/PMMA composite film incorporated smart phone was increased 154% and hybrid PCM/PMMA composite film incorporated smart phone was increased 286% over the reference, respectively.