• Journal of the Korean Institute of Gas
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• v.25 no.6
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• pp.35-44
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• 2021

The PR (Photo Resist) process in the semiconductor process is a process that uses a mixture of flammable substances. Due to the process equipment is installed in a clean room and when flammable substances leak, there is a high risk of suffocation, fire, and explosion. It is necessary to analyze the impact of accidents that may occur during operation and to evaluate whether the safety of workers can be guaranteed. In this study, the value of radiant heat and temperature change at the monitor point set up virtual inside the clean room was confirmed through CFD simulation of 10 leak and fire scenarios using the FLACS CFD - Fire Module. A fire that occurs inside a clean room transfers high radiant heat to the inter-story structure, but its scope is quite limited, and it is unlikely that it will collapse in a single fire accident. There was no scenario in which two stairs leading to the exit were exposed to high radiant heat at the same time due to a fire accident, therefore workers were able to escape in case of a fire. In addition, it was confirmed that the level of radiant heat and temperature rise rapidly decreased as they moved downstairs. According to the API 520 standard, workers exposed to 6.31 kW/m² of radiant heat that workers can withstand for 30 seconds were confirmed that it was possible to sufficiently escape from the inside.