• Title/Summary/Keyword: 펠티어 소자

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Temperature Control of the Aluminum Plate with Pottier Module by PWM Current Control (PWM 전류제어와 펠티어 소자를 이용한 알루미늄 판의 온도 제어)

  • Pang Du-Yeol;Kwon Tae-Kyu;Lee Seong-Cheol
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.897-900
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    • 2005
  • This paper presents temperature control of aluminum plate using Peltier module. As one of the thermoelectric effect, Peltier effect is heat pumping phenomena by electric energy. So if current is charged to Peltier module, it absorbs heat from low temperature side and emits heat to high temperature side. In this experiment, Peltier module is used to control the temperature of small aluminum plate with heating and cooling ability of Peltier module with current control and fan On/OFF control. And current control of Peltier module was accomplished by PWM method. As a results of experiments, it takes about 125sec to control temperature of aluminium plate between $30^{\circ}C\;and\;70^{\circ}C$ and about 70sec between $40^{\circ}C\;and\;60^{\circ}C$, in ambient temperature $29^{\circ}C$ while operating cooling fan only while cooling duration. Future aim is to realize more rapid temperature control and develop SMHA(special metal hydride actuator) by using Peltier module as a heating and cooling source.

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Performance Analysis of Cooling Module using Peltier Elements (펠티어 소자를 이용한 냉방모듈 성능해석)

  • Han, Cheolheui
    • Journal of Institute of Convergence Technology
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    • v.1 no.1
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    • pp.5-8
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    • 2011
  • Thermal analysis of a cooling module using Peltier elements are performed using a commercial software, CFD-ACE+. A standard k-e two-equation turbulent model is applied in order to represent the turbulent shear stress. Computed values are compared with the theoretical values for the validation. The effect of mass flow rates and transferred heat amounts on the temperature distributions inside the cooling system is analyzed. It was found that the increase in the mass flow rates causes the exit temperature rise. The increase in the absorbed heat amount diminished the overall temperature on the fin surfaces. In the present analysis, the material characteristics of the Peltier element itself are not considered. In the future, the effect of the turbulence models and material characteristics will be studied in detail.

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Temperature Control of the Aluminum Plate using Peltier Element (펠티어 소자를 이용한 알루미늄 판의 온도 제어)

  • 전원석;방두열;최광훈;권대규;김남균;이성철
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.764-767
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    • 2004
  • This paper present the temperature control of aluminum plate using Peltier element. Peltier effect is heat pumping phenomena by electric energy as one of the thermoelectric effect. So if current is asserted to Peltier element, it absorbs heat from low temperature side and emits to high temperature side. In this experiment, Peltier element is used to control the temperature of small aluminum plate with ON/OFF control scheme and fan ON/OFF. As the result of experiments, it is proper to act fan only while cooling duration and there exist a proper cooling current to drop temperature rapidly. It takes about 100sec to increase to 7$0^{\circ}C$ and drop to 35$^{\circ}C$ of aluminium plate temperature and about 90sec to increase to 7$0^{\circ}C$ and drop to 4$0^{\circ}C$ in ambient temperature 3$0^{\circ}C$ while fan is on only in cooling duration. Future aim is to realize more rapid temperature control and develop SMHA(special metal hydride actuator) by using Peltier element to heating and cooling.

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Active Control of Injection Mold Temperature using the Peltier Device (펠티어 소자를 이용한 사출 금형의 온도제어)

  • Cho, C.Y.;Shin, H.G.;Park, D.Y.;Hong, N.P.;Kim, B.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.05a
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    • pp.183-186
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    • 2007
  • The injection molding process has high accuracy and good reproducibility that are essential for mass production at low cost. Conventional molding processes typically use the water-based mold heating and air cooling methods. However, in the nano injection molding processes, this semi-active mold temperature control results in the several defects such as air-flow mark, non-fill, sticking and tearing, etc. Therefore, in order to control temperature of the molds actively and improve the quality of the molded products, the novel nano injection molding system, which uses active heating and cooling method, has been introduced. By using the Peltier devices, the temperature of locally adiabatic molds can be controlled dramatically and the quality of the molded patterns can be improved.

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A study on an experimental basis a special character of insulating oil the use of a transformers (변압기용 절연유의 특성에 관한 실험적 연구)

  • Kim, Sung-Dae;Park, Il-Soo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.11
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    • pp.5188-5193
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    • 2011
  • This research is for temperature control of insulating oil inside the transformer. After I designed and manufactured various systems using Peltier element, which was thermal element, and Heat pipe, which was a cooling system, without electric power. The optimum system could be made by applying them to the temperature control for the insulating oil. I could verify that the combination type of Heat pipe 100 W+ Peltier 100W has a more outstanding capacity than pure Heat pipe 300 W within 60 degrees Celsius through experiments. Through this, I verify that the method of a proper design is prominent, and make an attempt at contribution to power saving effect and more effective control of Distributing board by using this combination type.

Research on Heat-Sink of 40Watt LED Lighting using Peltier Module (펠티어 소자를 이용한 40[W]급 LED 조명기구의 방열에 관한 연구)

  • Eo, Ik-Soo;Yang, Hae-Sool;Choi, Se-Ill;HwangBo, Seung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.8 no.4
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    • pp.733-737
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    • 2007
  • The object of this paper is to propose a method to solve resulting heat in using numerous modulized watt-class LEDs in MCPCB as lighting device. To use LED for lighting, the chip needs to have a large capacity, resulting in extra heat in P-N connection area. To solve this problem, a Pottier Module, heat-sink panel and a fan was installed to measure variations in the temperature. Additionally, temperature variation characteristics were observed according to the heat conductor panel connecting cooling module and heat-sink panel, insulator and thermal grease. As a result, the type and amount of heat-sink panel was the most important facto. The fan would effect the temperature by max. $18[^{\circ}C]$ while other materials affected the temperature by $2{\sim}3[^{\circ}C]$, showing significant difference.

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Temperature Control of Aluminum Plate by PWM Current Control of Peltier Module (펠티어 소자의 PWM 전류제어를 이용한 알루미늄 판의 온도제어)

  • Pang, Du-Yeol;Kwon, Tae-Kyu;Lee, Seong-Cheol
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.10
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    • pp.60-67
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    • 2006
  • This paper presents the temperature control in aluminum plate with Peltier module. From the experimental work, Peltier module is used to control the temperature of small aluminum plate for both heating and cooling with the control of current and fan ON/OFF. And current control of Peltier module was accomplished by PWM method. As a result of experiments, it is proper that operate cooling fan only while cooling duration and there exist a proper cooling current to drop temperature rapidly. It takes about 125sec to control temperature of aluminium plate between $30^{\circ}C$ and $70^{\circ}C$ and about 70sec between $40^{\circ}C$ and $60^{\circ}C$, in ambient temperature $28^{\circ}C{\sim}29^{\circ}C$ while cooling fan is operated only cooling duration. With the cooling current, temperature control of aluminum plate was accomplished more rapidly in comparison without cooling current. Future aim is to realize more rapid temperature control and develop SMHA(special metal hydride actuator) by using Peltier module as a heating and cooling source.

Development of Cooling Garment for Extremely Hot Environment Using a Peltier Device and its Comfort Properties (고온환경 작업을 위한 펠티어 소자 냉각복 개발 및 쾌적성 평가)

  • Jung, Ye-Lee;Chae, Young-Jin;Kim, Eun-Ae
    • Journal of the Korean Society of Clothing and Textiles
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    • v.36 no.1
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    • pp.1-11
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    • 2012
  • This paper reports on a prototype cooling garment applying a cooling module. The cooling module was composed of a Peltier device, a cold sink, a heat sink and two fans. A constant box was used to evaluate the cooling effect of the module. Two cooling modules were attached on each side of the garment. The wear trial was conducted using 10 male subjects in an environmental chamber maintained at $30{\pm}0.5^{\circ}C$, $50{\pm}5%$RH. Subjective sensations of thermal, humidity, and comfort were surveyed. Statistical package SPSS12.0 was used for the t-test and the Wilcoxon signed-rank test. The results showed that most effective cooling module decreased the temperature of the constant temperature box by $-4.9^{\circ}C$. The micro-temperature of the cooling garment with a Peltier device was lower than the control garment during the exercise. In particular, the chest skin temperature was $1.5^{\circ}C$ lower with the cooling garment than the control. The maximum temperature difference was $-2.57^{\circ}C$ on the sides of the $1^{st}$ layer. Subjective thermal sensation from wear trials of the Peltier device attached garment was lower than the control garment. Subjects felt more comfortable with the cooling garment in almost all the periods.

A study of thermoelectric Heat Pump device (열전소자를 이용한 히트펌푸에 관한 연구)

  • 박창엽
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.5 no.1
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    • pp.6-12
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    • 1968
  • Experiments have been made on alloys to determine the practicability of using the Peltier effect in a thermoelectric devices. The cooling and heating results of thermoelectrie material coposed of n and p type BiTe are used, whose properties are; , , , , and K: thermal conductivity. The temperature of the cold part has been measured in veccum with respect to the temperature of the hot part. The experiment result agreed fairly with expectation such as was 42 degree C.

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Iodine 도핑에 따른 $Bi_2Te_3$ 열전 성능 변화 연구

  • Kim, Gwang-Cheon;Kim, Seong-Geun;Lee, Deuk-Hui;Kim, Hyeon-Jae;Kim, Jin-Sang
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.695-695
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    • 2013
  • 양단간의 온도차를 이용한 열전 발전 및 펠티어 효과를 이용한 열전냉각 소자는 전기와 열의 직접적인 변환으로 활용도가 높아 차세대 에너지 연구 분야로 각광 받고 있다. 열전 소자의 성능 척도는 성능지수 Z (Figure of Merit)로 나타내며, Seebeck 계수 및 전기전도도, 열전도도의 관계로 주어지게 되고 재료의 물성치가 소자의 성능에 큰 영향을 주게 된다. 따라서, 열전재료의 성능을 높이는 연구가 활발히 진행되어 왔으며, 최근 에너지 밴드 구조를 조절하여 Seebeck계수의 향상을 시도하는 연구가 많이 진행되고 있다. 이는 페르미 레벨근처에 도핑 된 원자들이 Density of states에 추가로 준위를 형성하여 Seebeck 계수 향상을 가능하게 한다. 본 연구에서는 상온용 열전 물질인 $Bi_2Te_3$에 Iodine 도핑을 통한 열전 성능 변화를 고찰하고자 한다. $Bi_2Te_3$는 유기금속 화합물 증착 방법으로 성장하였고 기판으로 $4^{\circ}$기울어진 GaAs를 사용 하였다. 전기적 특성은 Seebeck 측정 및 Van der Pauw법에 의한 Hall measurement 방법으로 분석하였다.

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