• Journal of Science and Technology Studies
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• v.6 no.1 s.11
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• pp.119-152
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• 2006

This paper deals with the historical development of research community in Korea. As the former studies of the korean scientific community show, the government supported institutes played an important role in the formation of research community. Therefore the theme of this study is concerned with the historical development of the government supported institutes and the features of their researcher group. In this paper following questions will be answered: How the social status of these researcher group is changed, what kind of response on social problems or national politics they had, and which characteristic they showed with regards to the identity problem. After the korean liberation the government institutes, such as the Chungang Kongop Yonguso(industrial research center)and the Korean Atomic Energy Research Institute, contributed to the development of the first generation of research group. However this research group could hardly identify themselves as researcher, because they spent much time on testing, evaluation or education. The identity problem is also resulted from the deficiency of authority as research institute. The status of researcher had no difference from that of civil servant. With the establishment of KIST the korean research community came into blossom. The government supported institutes, which were founded after the model of KIST, allowed quantitative and qualitative growth of research community. Thanks to the guarantee of institutional authority and the new reward system, the researcher could get respect and improve its social status. During this period the researcher volunteered to help the government policies. We can find often the nationalistic statements in the research community. During 1990s the research group demonstrated different behaviors and attitude toward the government. The nationalistic ideology disappeared. Instead of that, the research group criticized the government policies and took actions against the government. Those changes are related with the lowered position of government supported institutes.

• Journal of the Mineralogical Society of Korea
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• v.23 no.1
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• pp.51-61
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• 2010

Ettringite $(Ca_6[Al(OH)_6]_2(SO_4)_3{\cdot}26H_2O)$ is a sulfate mineral that shows a complicate property in concrete. It is often called as "a cancer of concrete" because secondary ettringite formation in hardened concrete often cause expansion and cracking of concrete due to its expansive crystal structure. In the present study, we tested the possibility for crystal growth inhibition of secondary ettringite by crystallization inhibitors that are commercially used for scaling inhibitors in Korea. For the test, we developed a method of ettringite solution synthesis. Three types of crystallization inhibitors were selected and examined the effects On ettringite growth inhibition. The experimental results of ettringite solution synthesis indicated that ettringite was successfully synthesized under condition that the mass balance between calcium hydroxide saturated solution and aluminum sulfate solution was attained. Monosulfate and semisulfate were synthesized when the ratio of $Ca^{2+}$ ions to ${SO_4}^{2+}$ ions was increased. The induction time of ettringite crystallization was less than 2 min. and crystallization was almost completed within an hour. The experimental results of ettringite crystallization inhibition showed that organic PBCT (2-Phosphonobutane-1,2,4-Tricarboxylic Acid) and inorganic SHMP (Sodium Hexametaphosphate) were relatively less effective on ettringite crystallization inhibition under experimental conditions. However, organic HEDP (1-Hydoxyethylidene-1,1-Diphosphonic Acid) effectively prevented ettringite growth with producing amorphous gel phase materials up to inhibitor concentration 0.1 vol.% of aluminum sulfate solution.

• Journal of the Economic Geographical Society of Korea
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• v.13 no.2
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• pp.270-295
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• 2010

This thesis is to examine natural environments and the change of socio-economic conditions in the clan villages of Kyongbuk region through the case study of Sanggok and Suchon one. The results of the study is summarized in the followings. Firstly, after the early 1990s Sanggok clan village located in Dasan-myeon was not influenced by its natural environmets, but by the relative location near a large city, Taegu. On the contrary, after the 1980s Suchon clan village in Byeokjin-myeon has been grown as an agricultural area of commercially producing water melon due to mountain and its related climate. Secondly, the total population of Sanggok and Suchon clan village have been continuously declined after the 1970s. Particularly the numbers of children per household were declined to 2.4 in the late 2000s. Consequently it is suspected whether or not the clan villages will be existed in spite of their declining population in the future. Thirdly, people in the Sanggok and Suchon clan village were generally poor due to the small agricultural land. After the 1970s, however, the villages have been largely influenced by the industrialization and urbanization of Korea. Sanggok clan village was influenced by the outside expansion of Taegu metropolitan city due to its relative location while Suchon village by the commercial cultivation of water melon under a good condition of natural environments. Fourthly, there are differences between people's cognition to the agricultural conditions of the Sanggok and Suchon clan village. Such a difference is closely related to the socio-economic conditions of the two different clan villages.

• Journal of the Korea Concrete Institute
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• v.25 no.4
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• pp.371-379
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• 2013

This paper investigates the cracking and tension-stiffening behavior of 100 MPa shrinkage-compensated strain-hardening cement composite (SHCC) and conventional concrete tie elements in monotonic and cyclic tension. Strain and surface crack formation of tension ties were monitored with two strain displacement transducers and a photo microscope with a lens of magnification 50 times. Three different cement composites such as conventional concrete, shrinkage-compensated SHCC, and normal SHCC were used in the tie specimens to investigate the influence of the cement composite type on the tension stiffening and cracking behavior. Test results indicated that initial shrinkage of the ultra high-strength cement composites is greatly reduced as the 10% replacement of cement by the shrinkage-compensating admixture based on calcium sulfo-aluminate (CSA). The test results on the SHCC tension ties showed that the first cracking load decreases proportionally to the initial shrinkage strain. Reinforced ultra high-strength SHCC ties with the initial shrinkage compensation exhibited improved tension stiffening and smaller crack spacings, i.e. the reduction in crack width. Cyclic loading did not have a significant effect on tension stiffening and cracking behavior of tension ties with normal concrete and SHCC materials.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.1-7
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• 2004

Tin plating on component finishes may grow whiskers under certain conditions, which may cause failures in electronics equipment. To protect the environment, 'lead-free' among component finishes is being promoted worldwide. This paper presents the evaluation results of whiskers on two kinds of lead-free plating materials at the plating temperature and under the reliability test. The rising plating temperature caused increasing the size of plating grain and shorting the growth of whisker. The whisker was grown under the temperature cycling the bent type in matt Sn plating and striated type in malt Sn-Bi. The whisker growth in Sn-Bi plating was shorter than that in Sn plating. In FeNi42 leadframe, the $7.0{\~}10.0{\mu}m$ diameter and the $25.0{\~}45.0{\mu}m$ long whisker was grown under 300 cycles. In the 300 cycles of Cu leadframe, only the nodule(nuclear state) grew on the surface, and in the 600 cycles, a $3.0{\~}4.0{\mu}m$ short whisker grew. After 600 cycles, the ${\~}0.34{\mu}m$ thin $Ni_3Sn_4$ formed on the Sn-plated FeNi42. However, we observed the amount of $0.76{\~}1.14{\mu}m$ thick $Cu_6Sn_5$ and ${\~}0.27{\mu}m$ thin $Cu_3Sn$ intermetallics were observed between the Sn and Cu interfaces. Therefore, the main growth factor of a whisker is the intermetallic compound in the Cu leadframe, and the coefficient of thermal expansion mismatch in FeNi42.

• Korean Journal of Materials Research
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• v.10 no.3
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• pp.184-190
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• 2000

We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Journal of the Korea Concrete Institute
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• v.19 no.5
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• pp.549-555
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• 2007

Although blast furnace slag has been widely used in concrete as a cementitious admixture or aggregate for many years, the slowly cooled steel slag is not used in concrete but mainly in road. Its use in concrete operates problem such as the lack of volume stability due to high free CaO content, which can be potentially hazardous in concrete. However, the rapidly cooled steel slag by atomization has a low free CaO content, a high density, and a spherical shape, so it is expected to use in concrete so much. This paper is to understand the probability that the rapid cooled steel slag can replace the silica sand used as aggregate in the epoxy mortar. We did the experimental study on the properties of the epoxy mortar having various replacement proportion of rapidly cooled steel slag. This study shown that increasing content of the rapidly cooled steel slag in epoxy mortar lead to increase largely the passing time of nozzle by O-lot, compressive strength and flexural strength. However except the flow is almost same level. So we understand that the rapidly cooled steel slag has positive effect on increasing of properties in epoxy mortar.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.1
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• pp.649-662
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• 2017

Since 1980, the number of universities have increased dramatically. However, compared to the quantitative growth, the lack of qualitative growth has often been criticized. Students entering university are estimated to decrease by half in 2025 compared to 2014. In swift response to challenges with decreasing student enrollment, the first University Reform Evaluation (URE) for innovating universities, was conducted and resulted in controversy. Opposition is based on distrust of the overall system, questioning the reliability of the evaluation process utilized for the URE evaluation index. Meta-evaluation is required to improve the quality of evaluation, and standards developed prior to conducting the URE. Therefore, an interdisciplinary approach is necessary for the evaluation of human resource development. This research uses the interdisciplinary approach from the human resources development point of view in attempting to develop meta-evaluation criteria which will enable effective evaluation and analysis of URE. The meta-evaluation standard features the creation of the ERPOU model, by conducting literature review, and considers data from expert symposiums, and surveys. The ERPOU model consists of 5 evaluation fields, 21 evaluation categories, and 42 evaluation standards.

• Journal of the Korean Vacuum Society
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• v.11 no.1
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• pp.50-58
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• 2002

The growth of GaN films on Si substrate has many advantages in that Si is less expensive than sapphire substrate and that integration of GaN-based devices with Si substrate is easier The difference of lattice constant and thermal expansion coefficient between GaN and Si is larger than those between GaN and sapphire. However, which results in many defects into the grown GaN. In order to obtain high duality GaN films on Si substrate, we need to reduce defects using the buffer layer such as AlN. In this study, we prepared three types of AlN buffer layer with various crystallinity on Si (111) substrate using MOCVD, Sputtering and MOMBE methods. GaN was grown by MOCVD on three types of AlN/Si substrate. Using TEM and XRD, we carried out comparative investigation of growth and properties of GaN deposited on the various AlN buffers by characterizing lattice coherency, crystallinity, growth orientation and defects formed (voids, stacking faults, dislocations, etc). It is found that the crystallinity of AlN buffer layer has strong effects on growth of GaN. The AlN buffer layers grown by MOCVD and MOMBE showed the reduction of out-of-plane misorientation of GaN at the initial growth stage.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.65-74
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• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.