• Title/Summary/Keyword: 파이렉스 유리

Search Result 14, Processing Time 0.045 seconds

Micromachining of Pyrex Class for Accelerometer (가속도 센서용 파이렉스 유리의 미세가공)

  • 김광현;최영현;최종순;박동삼;유우식
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • 2002.10a
    • /
    • pp.268-273
    • /
    • 2002
  • The mechanical etching technique has recently been developed to a powder blasting technique for various materials, capable of producing micro structures larger than 100$\mu\textrm{m}$. This paper describes the performance of powder blasting technique in micromachining of pyrex for the accelerometer sensor and the effect of the number of nozzle scanning and the stand-off distance on the erosion depth.

  • PDF

회원사탐방 - 특수유리의 '토털 서비스 전문회사'를 향한 고집스런 한 우물파기, (주)제이엠씨글라스

  • Park, Ji-Yeon
    • The Optical Journal
    • /
    • s.124
    • /
    • pp.20-22
    • /
    • 2009
  • 1997년 설립되어 광학원자재 중심으로 국내시장에 비즈니스를 시작한 (주)제이엠씨글라스(대표 안한철, www.jmcglass.com)는 오직 특수유리산업 한 분야만을 고집하며 전 세계 유수한 특수유리 제조사들과 연계하여 약 3000여종의 다양한 특수유리를 원스톱(One-Stop) 방식으로 국내 및 세계로 공급하고 있다. 2007년부터는 중국 성도에 합작공장을 통해 특수광학에서 수요가 많은 원자재인 파이렉스(Pyrex)를 직접 가공 생산하고 있으며, 국내에는 최근 핸드폰에 들어가는 광학윈도우 생산에 들어가는 등 종합특수유리회사를 지향하며 힘찬 행보를 보이고 있다.

  • PDF

The Experimental Study in the Micro Drilling of Excimer Laser on Pyrex Glass (엑시머 레이저를 이용한 파이렉스 유리의 미세 구멍 가공)

  • Lee, Chul-Jae;Kim, Ha-Na;Jeong, Yun-Sang;Jun, Chan-Bong;Park, Young-Chul;Kang, Jung-Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.11 no.5
    • /
    • pp.99-103
    • /
    • 2012
  • Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

MEMS용 MLCA와 Si기판의 양극접합 특성

  • 정귀상;김재민
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
    • /
    • 2003.12a
    • /
    • pp.105-108
    • /
    • 2003
  • 본 논문은 파이렉스 #7740 유리박막을 이용한 MEMS용 MLCA와 Si기판의 양극접합 특성에 관한 것이다. 최적의 RF 마그네트론 스퍼터링 조건(Ar 100 %, input power $1W/\textrm{cm}^2$)하에서 MLCA 기판위에 파이렉스 #7740 유리의 특성을 갖는 박막을 증착한 후 600 V, $400^{\circ}C$에서 1시간동안 양극접합했다. 그 다음에 Si 다이어프램을 제조한 후, MLCA/Si 접합계면과 MLCA 구동을 통한 Si 다이어프램 변위특성을 분석 및 평가하였다. 다이어프램 형상에 따라 정밀한 변위 제어가 가능했으며 0.05-0.08 %FS의 우수한 선형성을 나타내었다. 또한, 측정동안 접합계면 균열이나 계면분리가 일어나지 않았다. 따라서, MLCA/Si기판 양극접합기술은 고성능 압전 MEMS 소자 제작공정에 유용하게 사용가능할 것이다.

  • PDF

Anodic bonding Characteristics of MLCA to Si-wafer Using Evaporated Pyrex #7740 Glass Thin-Films for MEMS Applications (파이렉스 #7740 유리박막을 이용한 MEMS용 MLCA와 Si기판의 양극접합 특성)

  • Chung, Gwiy-Sang;Kim, Jae-Min;Yoon, Suk-Jin
    • Journal of Sensor Science and Technology
    • /
    • v.12 no.6
    • /
    • pp.265-272
    • /
    • 2003
  • This paper describes anodic bonding characteristics of MLCA (Multi Layer Ceramic Actuator) to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with same properties were deposited on MLCA under optimum RF magneto conditions(Ar 100%, input power $1\;W/cm^2$). After annealing in $450^{\circ}C$ for 1 hr, the anodic bonding of MLCA and Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in - 760 mmHg. Then, the MLCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity is 0.05-0.08 %FS. Moreover, any damages or separation of MLCA/Si bonded interfaces do not occur during actuation test. Therefore, it is expected that anodic bonding technology of MLCA/Si wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

Fabrication of the Acceleration Sensor Body of Glass by Powder Blasting (미립분사가공을 이용한 유리 소재의 가속도 센서 구조물 성형)

  • Park, Dong-Sam;Kang, Dae-Kyu;Kim, Jeong-Keun
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.23 no.2 s.179
    • /
    • pp.146-153
    • /
    • 2006
  • Acceleration sensors have widely been used in the various fields of industry. In recent years, micromachining accelerometers have been developed and commercialized by the micromachining technique or MEMS technique. Typical structure of such sensors consist of a cantilever beam and a vibrating mass fabricated on Si wafers using etching. This study investigates the feasibility of powder blasting technique for microfabrication of sensor structures made of the pyrex glass alternating the existing Si based acceleration sensor. First, as preliminary experiment, effect of blasting pressure, mass flow rate of abrasive and no. of nozzle scanning on erosion depth of pyrex and soda lime glass is studied. Then the optimal blasting conditions are chosen for pyrex sensor. Structure dimensions of designed glass sensor are 2.9mm and 0.7mm for the cantilever beam length and width and 1.7mm for the side of square mass. Mask material is from aluminium sheet of 0.5mm in thickness. Machining results showed that tolerance errors of basic dimensions of glass sensor ranged from 3um in minimum to 20um in maximum. This results imply the powder blasting can be applied for micromachining of glass acceleration sensors alternating the exiting Si based sensors.

Effect of Fillers on High Temperature Shrinkage Reduction of Geopolymers (충전재에 의한 지오폴리머의 고온수축 감소효과)

  • Cho, Young-Hoon;An, Eung-Mo;Chon, Chul-Min;Lee, Sujeong
    • Resources Recycling
    • /
    • v.25 no.6
    • /
    • pp.73-81
    • /
    • 2016
  • Geopolymers produced from aluminosilicate materials such as metakaolin and coal ash react with alkali activators and show higher fire resistance than portland cement, due to amorphous inorganic polymer. The percentage of thermal shrinkage of geopolymers ranges from less than 0.5 % to about 3 % until $600^{\circ}C$, and reaches about 5 ~ 7 % before melting. In this study, geopolymers paste having Si/Al = 1.5 and being mixed with carbon nanofibers, silicon carbide, pyrex glass, and vermiculite, and ISO sand were studied in order to understand the compressive strength and the effects of thermal shrinkage of geopolymers. The compressive strength of geopolymers mixed by carbon nanofibers, silicon carbide, pyrex glass, or vermiculite was similar in the range from 35 to 40 MPa. The average compressive strength of a geopolymers mixed with 30 wt.% of ISO sand was lowest of 28 MPa. Thermal shrinkage of geopolymers mixed with ISO sand decreased to about 25 % of paste. This is because the aggregate particles expanded on firing and to compensate the shrinkage of paste. The densification of the geopolymer matrix and the increase of porosity by sintering at $900^{\circ}C$ were observed regardless of fillers.

A Study on the Deposition of Tin Oxide Resistance Films through the Chemical Vapour Reaction Process (산화석 금속피막저항기에 관한 연구)

  • 정만영;박계영
    • Journal of the Korean Institute of Telematics and Electronics
    • /
    • v.4 no.1
    • /
    • pp.3-12
    • /
    • 1967
  • This study has been endeavored to deposit resistance films of tin oxide on the cylindrical Pyrex glass rods. In this report, at first an outline of the film formation is described and later some electrical properities of the resistance films manufactured through new method is discussed in detail. Because the new method which is called, "Chemical Vapour Reaction Process", is not only easy to get stable resistance films, but also doesn't need vacuum systtem, it seems to be a promising fundamental process to go into flow system mass production. Electrical properties of resistance films made by the new mathod are similar to or surpassing those by provious method (for example splay method). The top data thus obtained shows that surface resistivity is 25ohm/sq. with 12 ppm in temperature coefficient of resistor. resistor.

  • PDF

The transparent and conducting tin oxide thin films by the remote plasma chemical vapor deposition (원격플라즈마화학증착에 의한 투명전도성 산화주석 박막)

  • 이흥수;윤천호;박정일;박광자
    • Journal of the Korean Vacuum Society
    • /
    • v.7 no.1
    • /
    • pp.43-50
    • /
    • 1998
  • Transparent and conducting tin oxide films were prepared on Pyrex glass substrates by the remote plasma chemical vapor deposition (RPCVD). The main control variables of the RPCVD process included the deposition time, the flow rates of tetramethyltin, oxygen and argon, the radio-frequency power, and the substrate temperature. Dependence of the deposition rate, electric resistivity, optical transmittance and crystal structure on these parameters was systematically examined to prepare high qualities of tin oxide films and to better understand RPCVD process. The effect of those parameters on the properties of tin oxide films in complicatedly related on another. A tin oxide film parameters on the protimized deposition conditions exhibited deposition rate of 102 $\AA$/min, electric resistivity of $9.7\times 10^{-3}\Omega$cm and visible transmittance of ~80%.

  • PDF