• Polymer(Korea)
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• v.39 no.2
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• pp.219-224
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• 2015

In this work, the effect of fiber array direction including $0^{\circ}$, $0^{\circ}/90^{\circ}$, $0^{\circ}/45^{\circ}/-45^{\circ}$ was investigated for mechanical properties of basalt fiber-reinforced composites. Mechanical properties of the composites were studied using interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$) measurements. The cross-section morphologies of basalt fiber-reinforced epoxy composites were observed by scanning electron microscope (SEM). Also, the surface properties of basalt fibers were determined by Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS). From the results, it was observed that acid treated basalt fiber-reinforced composites showed significantly higher mechanical interfacial properties than those of untreated basalt fiber-reinforced composites. These results indicated that the hydroxyl functional groups of basalt fibers lead to the improvement of the mechanical interfacial properties of basalt fibers/epoxy composites in the all array direction.

• Journal of the Korea Concrete Institute
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• v.23 no.6
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• pp.781-790
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• 2011

This paper contains the experimental results on strengthening effect of RC beams strengthened with NSM CFRP reinforcement and various strengthening details. A total of 14 beams have been tested to analyze strengthening effects of NSMR with various reinforcement details. Variables were cross-sectional shape of CFRP reinforcements, strengthening areas, grooves the number and location etc. Test results revealed that failure modes of NSMR showed two types. One was bond failure at interface between concrete and filler and the other was CFRP rupture. Also, failure mode of specimens with two grooves occurred premature bond failure because of superposition of failure surfaces at concrete around grooves. failure mode of MI specimens considered the equivalent section have changed bond failure to CFRP rupture and CFRP efficiency has improved 83% to 100%.

• Polymer(Korea)
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• v.33 no.6
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• pp.530-536
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• 2009

A cycloaliphatic epoxy/acidic anhydride system incorporating short carbon fibers (SCF) and short glass fibers (SGF) was fabricated and thermal/mechanical properties were characterized. At low filler content both SCF- and SGF-reinforced composites showed a similar decrease in coefficient of thermal expansion (CTE), measured by a thermomechanical analyzer, with increasing loadings, above which SCF became more effective than SGF at reducing the CTE. Experimental CTE data for the SCF-reinforced composites is best described by the rule of mixtures at lower SCF contents and by the Craft-Christensen model at higher SCF contents. Storage modulus (E') at $30^{\circ}C$ and $180^{\circ}C$ was greatly enhanced for short fiber-filled composites compared to unfilled specimens, Scanning electron microscopy of the fracture surfaces indicated that the decreased CTE and the increased E' of the short fiber-reinforced composites resulted from good interfacial adhesion between the fibers and epoxy matrix.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.9
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• pp.5743-5747
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• 2015

In this study, Fe-based bulk amorphous alloy powder manufactured using gas atomization fabrication was used for laser welding. the fracture behavior of welding layer were analyzed. Tensile test results show that the destruction occurred immediately after the elastic deformation, After plastic deformation of the substrate, the destruction occurred. The actual maximum tensile strength of the welding layer and the substrate are 959.9MPa and 220.4MPa. welding layer were each $485.5{\pm}21$ and $197.4{\pm}14$ to the substrate and the actual microhardness, The welding layer has very high hardness. The welding layer showed a very weak fine acicular structure. The base material was shown in the micro structure appear a coarse grain. SEM observations of the fracture after the tensile test. Fracture morphology of the base metal and the welding layer showed ductile fracture and brittle fracture, respectively.

• Applied Chemistry for Engineering
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• v.22 no.3
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• pp.266-271
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• 2011

Single-walled carbon nanotube (SWCNT)/Epoxy composites were prepared for improving thermal conductivities and dispersion of SWCNTs in the epoxy matrix. Composites obtained different types of SWCNTs which are pristine and functionalized of the SWCNTs by acid and amine treatments. Three types of SWCNTs were dispersed in diglycidyl ether of bisphenol A (DGEBA) and bisphenol F (DGEBF). Enhanced interaction between functional groups on SWCNT and epoxy resins was evidenced by an improvement in the dispersion of the SWCNTs in the epoxy matrix. Thermal conductivity of composites containing acid SWCNTs were found to be much better than those containing pristine and amine treated SWCNTs.

• Clean Technology
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• v.21 no.1
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• pp.76-82
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• 2015

Volatile organic compounds (VOC) free adhesives have been interested by many scientists and engineers due to environmental regulations and the safety of industrial workers. In this work, a series of composites composed with bisphenol A epoxy resin used as solvent, dicyandiamide, and promoter were prepared to investigate the most appropriate molar ratio for steel-steel adhesion. The cured test specimen of each composite were measured with universal testing machine (UTM) to figure out mechanical properties such as tensile strength, Young’s modulus, and elongation. Furthermore, the lap shear strength of the specimen was tested with UTM while impact resistance was measured with Izod impact tester. The composite whose molar ratio of epoxy resin to curing agent is 1 : 0.9 (sample 3), showed better tensile strength, coefficient of elastic modulus, elongation, and impact strength than other composites did. The highest tanδ from dynamic mechanical analysis (DMA) was observed from sample 2 (epoxy resin: dicy = 1 : 0.7) while sample 3 showed slightly lower tanδ than that of 2. The morphology of the fracture surface of the cured composites from SEM showed that the number of subtle lines on the surface caused by impact increase as the contents of amine curing agent accrete. Furthermore, the viscosity change of sample 5 (epoxy resin: dicy = 1 : 1.3) was observed to confirm its storage stability.

• Restorative Dentistry and Endodontics
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• v.35 no.2
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• pp.69-79
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• 2010

The purpose of this study was to evaluate the effect of film thickness of various resin cements on bonding efficiency in indirect composite restoration by measurement of microtensile bond strength, polymerization shrinkage, flexural strength and modulus, fractographic FE-SEM analysis. Experimental groups were divided according to film thickness (< $50\;{\mu}m$-control, $50\;{\mu}m$-T50, $100\;{\mu}m$-T100, $150\;{\mu}m$-T150) using composite- based resin cements (Variolink II, Duo-Link) and adhesive-based resin cements (Panavia F, Rely X Unicem). The data was analyzed using ANOVA and Duncan's multiple comparison test (p < 0.05). The results were as follows ; 1. Variolink II showed higher microtensile bond strength than that of adhesive-based resin cements in all film thickness (p < 0.05) but Duo-Link did not show significant difference except control group (p > 0.05). 2. Microtensile bond strength of composite-based resin cements were decreased significantly according to increasing film thickness (p < 0.05) but adhesive-based resin cements did not show significant difference among film thickness (p > 0.05). 3. Panavia F showed significantly lower polymerization shrinkage than other resin cements (p < 0.05). 4. Composite-based resin cements showed significantly higher flexural strength and modulus than adhesive-based resin cements (p < 0.05). 5. FE-SEM examination showed uniform adhesive layer and well developed resin tags in composite-based resin cements but unclear adhesive layer and poorly developed resin tags in adhesive-based resin cements. In debonded surface examination, composite-based resin cements showed mixed failures but adhesive-based resin cements showed adhesive failures.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.4
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• pp.558-567
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• 2020

This study examined the defect characteristics of fuel flow proportioner-mounted structures to analyze the causes of structural defects during aircraft operation. System vibrations and single component vibrations that occur during aircraft operations are usually the cause of structural defects. The fuel flow proportioner causes a defect in the support structure due to the vibration caused by the pressure change caused by the sudden increase in the flow rate. Defects in the support structure of the fuel flow proportioner are not correlated directly with the cracking of the maneuver, and flight time according to aircraft operation analysis is related to the use of A/B. The structural reinforcement configuration was confirmed through static and life analysis of the cracks of the bracket mounted under the fuel flow proportioner for improvement of the defect. An analysis of the reinforcement revealed a minimum structural strength of +0.15. Structural life analysis confirmed that the stress acted on the site under 15Ksi. The fatigue life was confirmed to be more than 7,700 Cycles.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.1-6
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• 2014

Flip chip bonded LED packages possess lower thermal resistance than wire bonded LED packages because of short thermal path. In this study, thermal and bonding properties of flip chip bonded high brightness LED were evaluated for Au-Sn thermo-compression bonded LEDs and Sn-Ag-Cu reflow bonded LEDs. For the Au-Sn thermo-compression bonding, bonding pressure and bonding temperature were 50 N and 300oC, respectively. For the SAC solder reflow bonding, peak temperature was $255^{\circ}C$ for 30 sec. The shear strength of the Au-Sn thermo-compression joint was $3508.5gf/mm^2$ and that of the SAC reflow joint was 5798.5 gf/mm. After the shear test, the fracture occurred at the isolation layer in the LED chip for both Au-Sn and SAC joints. Thermal resistance of Au-Sn sample was lower than that of SAC bonded sample due to the void formation in the SAC solder.

• Applied Chemistry for Engineering
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• v.24 no.6
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• pp.593-598
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• 2013

In this study, we have evaluated the water absorption phenomenon of photoresist dry film, which is commonly used to build circuits on PCB (Printed Circuit Board) by photolithography, by using ATR-FTIR (Attenuated Total Reflectance-Fourier Transform Infrared). We have firstly observed significant change in fracture mode of dry film with respect to temperature and humidity, which we assumed the material transition from ductile to brittle. Secondly, we have established the process of absorption test for determining the diffusion coefficients of water into the dry film both with gravimeter and ATR-FTIR. We have successfully calculated the diffusion coefficients for each environmental conditions from the results which we achieved by gravimeter and ATR-FTIR. Compared to the gravimeter which is a conventional method for absorption test, the ATR-FTIR method in this study has been found to be very easy to use and have the same accuracy as gravimeter. Moreover, we are expecting to use the ATR-FTIR as an appropriate method to study the absorption phenomena related to any kinds of solvent and polymer system.