• 제목/요약/키워드: 틸레-스몰 매개변수

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10 mm급 원형 마이크로스피커의 가상 스피커 TS 매개변수 규명 (Thiele Small Parameters Estimation for Pseudo Loudspeaker within 10 mm Grade Circular-type Microspeaker)

  • 박석태
    • 한국소음진동공학회논문집
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    • 제17권11호
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    • pp.1112-1118
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    • 2007
  • It was discussed to identify Thiele Small Parameters for Pseudo loudspeaker within 10mm grade microspeaker attached to closed-box using known dynamic mass of moving parts. Also, enhanced circuit model for vented-box micro speaker system was used to more accurately simulate electrical impedance curves for real vented-box microspeaker system and compared to test results. Consequently, it showed that micro speaker could be modeled by pseudo loudspeaker TS parameters similar to general loudspeaker. Vented-box microspeaker model with pseudo loudspeaker TS parameters was well suited to describe real microspeaker. Also, it was proposed to estimate volume of rear closed-box of microspeaker without design specifications.

조립과정이 스피커의 전기 및 음향특성에 미치는 영향 (Effects of Electrical and Acoustical Variations for Loudspeaker due to Fabrication Processes)

  • 박석태
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2004년도 추계학술대회논문집
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    • pp.155-159
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    • 2004
  • In this paper, it was analyzed the characteristics of electrical and acoustical variations for loudspeaker due to fabrication processes. First, mass of each components of loudspeaker was measured by electric precision scale and performed statistical analysis. Second. Thiele-Small parameters of sample loudspeakers produced by unskilled students were identified by known mass parameter identification method using electrical impedance method and investigated on the variations of each parameter. Electrical impedance tests and acoustic frequency responses were measured on sample loudspeakers and variations were examined to grasp relationship between components variation and fabrication processes. Main factors to effect the changes of electrical impedance were concluded by fabrication processes errors not by components of loudspeaker.

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자동차 오디오용 서브우퍼 개발 (Development of Subwoofer for Car Audio System)

  • 박석태
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2004년도 추계학술대회논문집
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    • pp.166-169
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    • 2004
  • In this paper, computational analysis and experiments of subwoofer for car audio speaker system were performed and discussed to analyze acoustical phenomena for subwoofer. Ported enclosure system with subwoofer were manufactured and provided for test and simulation purposes. Subwoofer with single voice coil and double voice coil were identified by linear and nonlinear parameter identification method for loudspeaker parameters. For high power inputs to subwoofer, sound pressure levels were compared according to input powers with linear and nonlinear loudspeaker models. For subwoofer system with high power nonlinear speaker model was showed to be adequate to describe the behaviour of loudspeaker.

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홈 오디오 용 하이파이 스피커 시스템 개발 (Development of HiFi Speaker System for Home Audio)

  • 박석태
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2004년도 추계학술대회논문집
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    • pp.317-322
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    • 2004
  • In this paper, It was describe the processes of development of HiFi speaker system. Woofer and tweeter were fabricated by unskilled students and their 1.5 parameters were identified by known mass method. Based on T-S parameters port enclosure was designed and built by means of software. Acoustic radiation phenomena of port enclosure were simulated and compared to test result. Acoustic pressure difference between lower frequency and higher frequency was flattened by adopting optimal crossover network. Finally, built HiFi speaker system was showed good sound quality and sound pressure and electrical impedance was well agreed with test results each other.

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모바일 폰용 마이크로스피커의 음향 및 전기 해석 (Acoustic and Electrical Analysis of Microspeaker for Mobile Phones)

  • 박석태
    • 한국소음진동공학회논문집
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    • 제24권7호
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    • pp.525-536
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    • 2014
  • In this paper, GUI program for microspeaker system simulation program was developed and verified through closed box, vent box and 6th order bandpass enclosure system. By using the pseudo loudspeaker model concept, TS parameters and rear volume of microspeaker were identified. Their suitabilities were proved by comparing test results with simulations of electrical impedance and sound pressure response curves for the three box types; closed box, vent box and 6th order bandpass box. Also, MSSP was found to be effective regardless of the microspeaker's shape, either circular or rectangular shape. MSSP can be used for the microspeaker system simulation, and can give a general prediction of such as; sound pressure level curve, electrical impedance, diaphragm velocity and displacement curve according to multiple design parameters; diaphragm mass, compliance, force factor, front and rear volume, front and rear port's diameter and length.