• Proceedings of the Korean Operations and Management Science Society Conference
• /
• 1992.04b
• /
• pp.29-38
• /
• 1992

무인화된 대량생산 체제에서는 transfer line을 이용하게되며, cycle time의 단축을 위하여 측정 및 검사기능이 별도의 station으로 있어 가공후에 부품의 불량여부를 감지한다. 그러나 다품종소량생산체제에서는 FMC 또는 FMS가 적합하며, 이 시스템에 바람직한 감시기능으로서는 기내측정(inter-process)방식을 많이 이용한다. 여기서는 CNC선반과 머시닝센터에 접촉식 센서인 터치프로브(touch probe)를 설치하여 개발한 무인 FMC용 인터프로세스 3차원 측정 및 검사시스템을 소개한다.

• Journal of the Korean Society for Precision Engineering
• /
• v.20 no.12
• /
• pp.34-41
• /
• 2003

This paper suggests a methodology fur improving the machining accuracy by compensating for the machining errors based on on-machine measurement process. Probing errors and machine tool errors included in the measurement data were calibrated or compensated to obtain the actual machining errors. Machine tool errors were modeled in forward and backward directions according to the axis movement direction to consider the effects of backlash errors on the measurement data, and model parameters were determined by measuring a cube array artifact. A rectangular workpiece was machined and then measured with a touch probe as a verification experiment. Machining experiments showed that the machining errors were reduced to within the designated tolerance after compensating for the actual machining errors by modifying the original footpath for the next-step machining.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.10a
• /
• pp.650-653
• /
• 2002

In this paper, a methodology to assess machine tool errors quickly is suggested using a touch probe and a cube array artifact. Parameterized error models derived are expressed of model coefficient vectors and backlash errors to be determined. To determine the unknown model coefficient vectors, a cube array artifact is proposed. Considering CMM measurement data of cube vertex coordinates. error vectors for all axes ate obtained and used to complete the error model. Some simulation results show that the suggested error model can follow the true values within 10$\mu\textrm{m}$. To verify the error model, a circular part with two concentric circles is measured and simulated. The results show that the differences between CMM and OMM radius errors are smaller than 15$\mu\textrm{m}$.

• Journal of the Korean Society for Precision Engineering
• /
• v.17 no.9
• /
• pp.158-165
• /
• 2000

Reverse engineering is reproducing products by directly extracting geometric information from physical objects such as clay model wooden mock-up etc. The fundamental work in the reverse engineering is to acquire the geometric data for modeling the objects. This research proposes a novel method for data acquisition aiming at unmanned fast and precise measurement. This is come true by the sensor fusion with CCD camera using structured light beam and touch trigger sensor. The vision system provides global information of the objects data. In this case the number of data and position allocation for touch sensor is critical in terms of the productivity since the number of vision data is very huge. So we applied wavelet transform to reduce the number of data and to allocate the position of the touch probe. The simulated and experimental results show this method is good enough for data reduction.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.7
• /
• pp.145-152
• /
• 2004

This paper proposed efficient manufacturing system using the OMM (on-machine measurement) system. The OMM system is software based 3D modeler for inspection on machine and it is interfaced tool machine with RS232C. The software is composed of two inspection modules that one is touch probe operating module and the other is laser displacement sensor operating module. The module for touch probe has need of inspection feature that extracted it from CAD data. Touch probe moves to workpiece by three operating modes as follows: manual, general and automatic mode. The operating module of laser displacement sensor is used inspection for profile and very small hole. An Advantage of this inspection method is to be able to execute on-line inspection during machining or after it. The efficiency of proposed system which can predict and definite the machining errors of each process is verified, so the developed system is applied to inspect the mold-base(cavity, core).

• Journal of the Korean Society for Precision Engineering
• /
• v.29 no.2
• /
• pp.170-177
• /
• 2012

A force/torque sensor using carbon fiber plate was designed and developed to make the sensor be able to measure a wide range of multi degree of force and torque. Using carbon fiber plate of 0.3 mm thickness, the sensor was designed and developed, which has a ${\mu}N$ level order of resolution and about 0.01 N ~ 390 N of wide measurement range. The elastic deformation part has a tripod plate structure and strain gauges are attached on the part to detect the force/torque. The coefficient of determination for the sensor is over 0.955 by the calibration experiment so that the linearity of the sensor is confirmed to be good. Also, experiments on applying 0.005 ~ 40 kg (0.05 ~ 390 N) to each axis were implemented and the sensor is proved to be safe under a high load. Finally, to verify the function calculating the direction of load vector, the directions of various load vectors which have the same magnitude but different directions and the directions of the calculated load vectors are compared and analyzed to accord well.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2002.10a
• /
• pp.158-163
• /
• 2002

This paper presents a multiple sensor system for rapid and high-precision coordinate data acquisition in the OMM (On-machine measurement) process. In this research, three sensors (touch probe, laser, and vision sensor) are integrated to obtain more accurate measuring results. The touch-type probe has high accuracy, but is time-consuming. Vision sensor can acquire many point data rapidly over a spatial range but its accuracy is less than other sensors. Also, it is not possible to acquire data for invisible areas. Laser sensor has medium accuracy and measuring speed among the sensors, and can acquire data for sharp or rounded edge and the features with very small holes and/or grooves. However, it has range- constraints to use because of its system structure. In this research, a new optimum sensor integration method for OMM is proposed by integrating the multiple-sensor to accomplish mote effective inspection planning. To verify the effectiveness of the proposed method, simulation and experimental works are performed, and the results are analyzed.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.199-199
• /
• 2012

최근 그래핀의 대면적 합성 및 롤투롤 전사 공정의 개발로 그래핀의 상용화가 가시화 되고 있다. 하지만, 그래핀의 독특한 특성인 선형적이고 밴드갭이 없는 에너지 띠 분포 때문에 반도체 소자로서의 직접적인 적용에는 한계가 있다. 이러한 문제를 해결하기 위한 돌파구로써, 그래핀 복합체의 연구와 개발이 활발히 진행되고 있으며 본 연구에서는 그래핀 복합 적층 구조를 다룬다. 이는 디스플레이, 초고속 반도체 소자, 고성능 광전자소자 및 초고감도 센서 등 다양한 분야에 대한 그래핀의 실용화 가능성이 높아진 것을 의미한다. 특히, 높은 가시광 투과도와 낮은 면저항으로 기존 투명 전극에 대표적으로 사용되고 있는 ITO (Indium Tin Oxide)를 그래핀으로 대체하는 것에 관한 연구가 활발히 진행되고 있다. 하지만 그래핀이 높은 전자이동도를 가지는 것에 비하여 비저항과 투과도 측면에 있어서는 ITO의 성능을 뛰어넘지 못하는 실정이다. 따라서 본 연구에서는 ITO가 가지는 취약점인 기판과의 약한 접착력, 높은 취성, 기판과의 열팽창률 차이 등의 공정상 문제점을 극복하고자 하였다. 그래핀 복합 적층 필름은 플라스틱 기판 (PET) 위에 열 화학기상증착법(Chemical Vapor Deposition, CVD)을 이용하여 합성한 그래핀을 전사하고, ITO 용액을 도포한 다음 다시 그래핀을 씌워 제작하여 샌드위치 구조(sandwich structure)를 형성하였다. 완성된 필름은 광학적, 전기적 특성 분석을 수행하였다. 광학적 분석으로는 라만 분광을 이용한 그래핀 품질평가와 파장대에 따른 광 투과도, 그리고 반사도 측정을 하였으며, 전기적 특성은 면저항을 측정함으로써 분석한다. 결함이 적고, 대면적에 걸쳐 한 층을 이루어야 하는 고품질 그래핀의 요구사항에 따라 라만 분광의 G, 2D, D 띠를 분석하였다. G와 2D 띠의 비율을 통해 그래핀의 층 수를, D 띠의 강도를 통해 결함의 유무를 판단하였다. 또한, 가시광 영역에서 90% 이상의 광 투과도를 보여야 하는 투명 소자의 요구사항 달성 정도를 UV-VIS를 이용하여 확인하였다. 마지막으로, 제작한 필름의 면저항 또한 4-프로브 멀티미터를 이용하여 측정하고, 일반적인 터치스크린의 면저항인 $500{\Omega}/sq$를 만족하는지 평가하였다.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.41 no.9
• /
• pp.1108-1119
• /
• 2016

This paper presents the spectral analysis and radiation pattern of low-frequency electromagnetic(EM) leakage signals according to the fundamental operations of smartphones. The EM leakage signals generated by the activation of four I/O sensor modules such as a touch-screen, a camera, a microphone and a speaker are captured by the commercial near-field magnetic probe with 1cm spatial resolution. The analysis results show that the leakage of the EM wave occurs strongly around the activated I/O sensor modules, AP(Application Processor) and memory modules. Also, the distinguishable frequency characteristic is shown in each spectrum of EM leakage signals.