• 한국정보통신설비학회:학술대회논문집
• /
• 한국정보통신설비학회 2002년도 제3회 세미나 : 광통신설비
• /
• pp.147-163
• /
• 2002

• 대한기계학회논문집B
• /
• 제20권7호
• /
• pp.2356-2366
• /
• 1996

High-power electronic chips have been advanced to such an extent that the heat dissipation capability of a system design has become one of the primary limiting factors. Therefore, thermal design must be considered in the early stage of the electronic system development. In present paper, the results of an experimental study on the forced convection cooling are presented to evaluate cooling performance of an electronic cabinet which in generally used for telecommunication system. Temperatures and thermal resistances are applied to compare the heat transfer characteristics for various locations of a fan unit as well as various configuration of non-uniform powering modules. As a result, the optimal configuration of a fan unit and powering configuration is suggested for the effective thermal design of telecommunication system.