• 제목/요약/키워드: 캐리어 농도

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Characteristics of Hydrogen Generation from Methanol and Ethanol using Cylindrical Barrier Discharge (실린더형 무성방전을 이용하여 메탄올과 에탄올로부터 수소발생 특성)

  • Park, Jae-Youn
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.8
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    • pp.32-39
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    • 2010
  • Hydrogen is sustainable energy without environment pollution. In this study, experiments and analysis of hydrogen generation from gases methanol and ethanol using cylindrical barrier discharge reactor was carried out. The discharge reactor to generate hydrogen molecules used in this work is one type of Non-thermal Plasma (NTP) reactors and neon-transformer as power source to make a plasma was used. Hydrogen concentrations were measured as parameters of applied voltage, concentrations of methanol and ethanol, and flow rates of carrier gases($N_2$). Hydrogen generation increased according to applied voltage and produced largely in case of methanol compared with ethanol. It is thought that the reason is deeply related with those different chemical structures. Energy yield of hydrogen generation in case of ethanol decreases according to increasing applied voltage, but that in case of methanol has a peak at applied voltage of 22[kV] and decreased. Specifically, hydrogen generation increased with increasing applied voltage, but low voltage was better, which is the best parameter in the aspects of energy efficiency.

Effects of oxygen partial pressure on the properties of indium tin oxide film on PET substrates by RF magnetron sputtering (RF 마그네트론 스퍼터링법에 의해 PET 기판 위에 증착된 ITO 박막의 특성에 대한 산소 분압의 영향)

  • Kim, Seon Tae;Kim, Tae Gyu;Cho, Hyun;Kim, Jin Kon
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.24 no.6
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    • pp.252-255
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    • 2014
  • Indium tin oxide (ITO) films with various oxygen partial pressure from 0 to $6{\times}10^{-5}$ Pa were prepared onto polyethylene terephthalate (PET) using RF magnetron sputtering at room temperature. The structural, electrical and optical properties of the grown ITO films were investigated as a function of the oxygen partial pressure. The amorphous nature of the ITO films was dominant at the partial pressure below $1{\times}10^{-5}$ Pa and the degree of crystallinity increased as the oxygen concentration increased further. This structural change comes with the increased carrier concentration and reduction of the electrical resistivity down to $9.8{\times}10^{-4}{\Omega}{\cdot}cm$. The average transmittance (at 400~800 nm) of the ITO deposited on the PET substrates increased as the oxygen partial pressure increased and transmittance above 80 % was achieved with the partial pressure of $4{\times}10^{-5}$ Pa. The results show that the choice of optimal oxygen partial pressure can present improved film crystallinity, the increased carrier concentration, and the enhancement in the electrical conductivity.

Thermoelectric properties of SiC prepared by refined diatomite (정제 규조토로 합성한 탄화규소의 열전특성)

  • Pai, Chul-Hoon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.4
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    • pp.596-601
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    • 2020
  • Silicon carbide is considered a potentially useful material for high-temperature electronic devices because of its large band gap energy and p-type or n-type conduction that can be controlled by impurity doping. Accordingly, the thermoelectric properties of -SiC powder prepared by refined diatomite were investigated for high value-added applications of natural diatomite. -SiC powder was synthesized by a carbothermal reduction of the SiO2 in refined diatomite using carbon black. An acid-treatment process was then performed to eliminate the remaining impurities (Fe, Ca, etc.). n-Type semiconductors were fabricated by sintering the pressed powder at 2000℃ for 1~5h in an N2 atmosphere. The electrical conductivity increased with increasing sintering time, which might be due to an increase in carrier concentration and improvement in grain-to-grain connectivity. The carrier compensation effect caused by the remaining acceptor impurities (Al, etc.) in the obtained -SiC had a deleterious influence on the electrical conductivity. The absolute value of the Seebeck coefficient increased with increasing sintering time, which might be due to a decrease in the stacking fault density accompanied by grain or crystallite growth. On the other hand, the power factor, which reflects the thermoelectric conversion efficiency of the present work, was slightly lower than that of the porous SiC semiconductors fabricated by conventional high-purity -SiC powder, it can be stated that the thermoelectric properties could be improved further by precise control of an acid-treatment process.

Effects of Annealing on Ni/Au Ohmic Contact to Nonpolar p-type GaN

  • Lee, Dong-Min;Kim, Jae-Gwan;Yang, Su-Hwan;Kim, Jun-Yeong;Lee, Seong-Nam;Lee, Ji-Myeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.358-359
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    • 2012
  • 최근 분극 특성이 상이한 무분극 GaN 에피성장에 관한 심도 있는 연구와 함께 전자-전공 캐리어의 주입 및 캐리어의 거동, 방출되는 편광 특성 및 다양한 물리적 특성들에 대해 보고되고 있으며, 광학적 특성 및 물리적 특성의 확보를 위한 많은 연구가 활발히 진행 중이다 [1]. GaN의 ohmic 접촉(ohmic contact)의 형성은 발광 다이오드(light emitting diode), 레이저 다이오드(Laser), 태양전지(solar cell)와 같은 고신뢰도, 고효율 광전자 소자를 제조하기 위해서는 매우 중요하다 [2]. 그러나 이와 함께 병행 되어야 할 무분극 p-GaN 의 ohmic contact에 관한 연구는 많이 이루어지고 있지 않는 실정이다. 따라서 본 논문에서는 r-plane 사파이어 기판 상에 성장된 p-GaN에서의 ohmic 접촉 형성 연구를 위하여 Ni/Au ohmic 전극의 접촉저항 특성을 연구하였다. 본 실험에서는 성장된 a-plane GaN의 Hole농도가 $3.09{\times}1017cm3$ 인 시편을 사용하였다. E-beam evaporation 장비를 이용하여 Ni/Au를 각각 20 nm 그리고80 nm 증착 하였으며 비접촉저항을 측정하기 위해 Circle-Transfer Length Method (C-TLM) 패턴을 사용하였다. 샘플은 RTA (Rapid Thermal Annealing)를 사용하여 $300^{\circ}C$에서 $700^{\circ}C$까지 온도를 변화시키며 전기적 특성을 비교하여 그림 1(a) 나타내었다. 그림에서 알 수 있듯이 $400^{\circ}C$에서 가장 낮은 비접촉저항 값인 $6.95{\times}10-3{\Omega}cm2$를 얻을 수 있음을 발견하였다. 이 때의 I-V curve 도 그림1(b)에 나타낸 바와 같이 열처리에 의해 크게 향상됨을 알 수 있다. 그러나, $500^{\circ}C$ 이상 온도를 증가시키면 다시 비접촉 저항이 증가하는 것을 관찰하였다. XRD (x-Ray Diffraction) 분석을 통하여 $400^{\circ}C$ 이상열처리 온도가 증가하면 금속 표면에 $NiO_2$가 형성되며, 이에 따라 오믹특성이 저하 된다고 사료된다. 또한 $Ni_3N$의 존재를 확인 하였으며 이는 nonpolar surface의 특성으로 인해 nitrogen out diffusion 현상이 동시에 발생하여 계면에는 dopant로 작용하는 질소 공공을 남기고 표면에 $Ni_3N$을 형성하여 ohmic contact의 특성이 저하되기 때문인 것으로 사료된다.

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The Structural, Electrical, and Optical Properties of ZnO Ultra-thin Films Dependent on Film Thickness (ZnO 초박막의 두께 변화에 따른 구조적, 전기적, 광학적 특성 변화 연구)

  • Kang, Kyung-Mun;Wang, Yue;Kim, Minjae;Lee, Hong-Sub;Park, Hyung-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.2
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    • pp.15-21
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    • 2019
  • We investigated the structural, electrical and optical properties of zinc oxide (ZnO) ultra-thin films grown at $150^{\circ}C$ by atomic layer deposition (ALD). Diethylzinc and deionized water were used as metal precursors and reactants, respectively, for the deposition of ZnO thin films. The growth rate per ALD cycle was a constant 0.21 nm/cycle at $150^{\circ}C$, and samples below 50 cycles had amorphous properties due to the relatively thin thickness at the initial ALD growth stage. With the increase of the thickness from 100 cycles to 200 cycles, the crystallinity of ZnO thin films was increased and hexagonal wurtzite structure was observed. In addition, the particle size of the ZnO thin film increased with increasing number of ALD cycles. Electrical properties analysis showed that the resistivity value decreased with the increase of the thin film thickness, which is correlated with the decrease of the grain boundary concentration in the thicker ZnO thin film due to the increase of grain size and the improvement of the crystallinity. Optical characterization results showed that the band edge absorption in the near ultraviolet region (300 nm~400 nm) was increased and shifted. This phenomenon is due to the increase of the carrier concentration with the increase of the ZnO thin film thickness. This result agrees well with the decrease of the resistivity with the increase of the thin film thickness. Consequently, as the thickness of the thin film increases, the stress on the film surface is relaxed, the band gap decreases, and the crystallinity and conductivity are improved.

Crystallinity and electrical properties of 6H-SiC wafers (6H-SiC wafer의 결정성 및 전기적 특성)

  • 김화목;임창성;오근호
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.7 no.3
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    • pp.393-399
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    • 1997
  • H-SiC single crystals were successfully grown by the sublimation method and the optimum growth conditions were established. The grown SiC crystals were about 33 mm in diameter and 11 mm in length. The micropipe density of the polished SiC wafers was 400/$\textrm{cm}^2$, and the planar defect density was 50/$\textrm{cm}^2$. Raman spectroscopy and DCXRD analysis were used to examine the crystallinity of Acheson seeds and the 6H-SiC wafers. As a result, the crystallinity of the 6H-SiC wafers was better than that of Acheson seeds. For examination of the electrical properties of the undopped 6H-SiC wafers Hall measurements were applied. According to the measurements the carrier concentration was estimated to be $3.91{\times}10^{15}/\textrm {cm}^3$ and doping type of the undopped. 6H-SiC wafers was n-type.

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유도 결합 플라즈마를 이용한 ITO박막의 특성 연구

  • Wi, Jae-Hyeong;U, Jong-Chang;Eom, Du-Seung;Yang, Seol;Ju, Yeong-Hui;Park, Jeong-Su;Heo, Gyeong-Mu;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.209-209
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    • 2009
  • ITO 박막은 박막 태양전지, 유기 태양전지뿐만 아니라 유연한 디스플레이, 발광다이오드와 같은 광학적 장치에 투명한 전극으로써 널리 사용된다. 글라스나 플라스틱 기판위에 형성된 투명 전극은 식각을 통하여 전기회로를 구성한다. 또한 식각 특성을 개선할 필요가 있다. 이 연구에서 우리는 유리 기판위에 코팅된 ITO 박막을 유도결합 $BCl_3/Ar$ 플라즈마를 이용하여 식각하였다. ITO 박막은 RF 마그네트론 스퍼터링을 사용해 200 $^{\circ}C$에서 비알칼리 글라스 위에 증착하였고 ITO 박막의 총 두께는 약 250 nm 이었다. 또한 전기 전도성은 $4.483{\times}10^{-4}{\Omega}cm$, 캐리어 농도는 $3.923{\times}10^{20}cm^{-3}$이고, 홀 이동도는 $3.545{\times}10cm^{-2}/Vs$이었다. Ar 플라즈마에 $BCl_3$ 가스를 첨가시키면서 가스 비율에 따른 ITO의 식각 속도와 ITO와 PR과의 선택비를 측정하였다. 최대 식각 속도는 $BCl_3$(25%)/Ar(75%), 500 W의 RF power, -200 V의 DC-bias voltage, 그리고 2 pa의 공정압력일 때 588 nm/min이었고 선택비는 0.43으로 다소 낮게 측정되었다. 식각된 표면의 화학적 반응은 엑스선 광전자 분광법 (X-ray Photoelectron Spectroscopy)을 사용해 조사되었다. 그리고 식각된 표면의 거칠기는 원자현미경 (Atomic Force Microscopy)을 사용해 측정하였다.

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Effects of heat-treatment on the properties of ITO films on transparent polyimide substrates by RF magnetron sputtering (RF 마그네트론 스퍼터링법으로 투명 PI 기판에 증착된 ITO 박막의 특성에 미치는 열처리의 영향)

  • Kim, Hae-Chan;Cho, Hyun;Kim, Jin-Kon
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.30 no.1
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    • pp.12-16
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    • 2020
  • Indium tin oxide (ITO) films were prepared onto transparent polyimide (PI) substrates by RF magnetron sputtering at room temperature. The deposited ITO films were heat-treated at various temperatures (50, 100, 150, and 200℃). The effect of post heat-treatment temperature on structural, electrical and optical properties of ITO films were investigated. It was found that the as-deposited ITO films were amorphous and the degree of crystallinity and the grain size increased with an increasing heat-treatment temperature, which led to the increase in carrier concentration and mobility. The electrical resistivity of as-deposited ITO films was 2.73 × 10-3 Ω·cm. With the heat-treatment temperature increasing from 50 to 200℃, the electrical resistivity decreased from 2.93 × 10-3 to 1.21 × 10-4 Ω·cm. The average transmittance (400~800 nm) of the ITO deposited PI substrates was decreasing with post heat-treatment temperature and was above 81 % for the temperatures 50~150℃ and decreased considerably to 78 % at 200℃.

Effect of Si grinding on electrical properties of sputtered tin oxide thin films (Si 기판의 연삭 공정이 산화주석 박막의 전기적 성질에 미치는 영향 연구)

  • Cho, Seungbum;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.2
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    • pp.49-53
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    • 2018
  • Recently, technologies for integrating various devices such as a flexible device, a transparent device, and a MEMS device have been developed. The key processes of heterogeneous device manufacturing technology are chip or wafer-level bonding process, substrate grinding process, and thin substrate handling process. In this study, the effect of Si substrate grinding process on the electrical properties of tin oxide thin films applied as transparent thin film transistor or flexible electrode material was investigated. As the Si substrate thickness became thinner, the Si d-spacing decreased and strains occurred in the Si lattice. Also, as the Si substrate thickness became thinner, the electric conductivity of tin oxide thin film decreased due to the lower carrier concentration. In the case of the thinner tin oxide thin film, the electrical conductivity was lower than that of the thicker tin oxide thin film and did not change much by the thickness of Si substrate.

Characteristics of ZnO:Al thin films deposited with differentworking pressures (증착 압력에 따른 ZnO:Al 박막의 특성)

  • Kim, Seong-Yeon;Sin, Beom-Gi;Kim, Du-Su;Choe, Yun-Seong;Park, Gang-Il;An, Gyeong-Jun;Myeong, Jae-Min
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.11a
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    • pp.49.2-49.2
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    • 2009
  • 투명전극은 디스플레이, 태양전지와 같은 광전자 소자에 필수적이며, 지금까지 개발된 재료 중에는 ITO가 가장 투명하면서 전기전도도가 높고 생산성도 좋기 때문에 투명전극의 재료로 사용하고 있다. ITO는 낮은 비저항(${\sim}10^{-4}{\Omega}cm$) 과 높은 투과율 (~85 %), 상대적으로 넓은 밴드갭 에너지 (3.5 eV) 의특성과 같이 뛰어난 전기적 광학적 특성에 반해서 높은 원자재 가격, 불안정한 공급량 등으로 인한 문제점이꾸준히 제기되고 있다. 따라서 $In_2O_3$:Sn, ZnO:Al, ZnO:Ga, ZnO:F, ZnO:B, TiN 등과 같은 물질들로대체하려는 연구가 활발하게 진행되고 있다. ZnO는 ITO보다원자재의 수급이 원활하기 때문에 원가가 낮으며, 상대적으로 낮은 온도에서도 제작이 가능하다. 또한 화학적으로 안정적이므로 ZnO에 Al, Ga 등의 3족 원소를 도핑함으로써 낮은 비저항의 박막 제작이 가능하고, ITO 박막과 비교하여 etching이 쉬우며 기판과의 접착성이 좋으며, sputtering 공정시 plasma 분위기에서의 안정성이 뛰어나고 박막증착율이 높기 때문에 투명전극으로 적합한 재료이다. 본 연구에서는 cylindrical type의 Aldoping된 ZnO single target을 사용하여 박막 증착 압력의 변화를 주어 유리기판 위에 DC sputtering을 하였다. Fieldemission scanning electron microscope (FESEM)을 통해 ZnO:Al 박막의 표면의 형상과 두께를 확인하였으며, X-ray diffraction (XRD) 분석을 통해 박막의 결정학적 특성을 관찰하였다. 투명전극용 물질로서 ZnO:Al 박막의 적합성 여부를 확인하기 위하여 Van der Pauw 방법을 이용하여 박막의 비저항, 전자 이동도, 캐리어 농도를 측정하였으며, 박막의 기계적 성질 및 표면 접착성을 확인하기 위하여 nano-indentaion 분석을 하였다. 또한 UV-vis spectrophotometer를 이용하여 ZnO:Al 박막의 투과율을 분석하여 투명전극으로의 응용 가능성을 확인하였다.

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