• 마이크로전자및패키징학회지
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• 제10권1호
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• pp.7-11
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• 2003

반도체 칩이나 전자제품에 사용되는 부품들은 작동할 때 발열을 하게 되며 발생한 열이 적절히 제거되지 않을 경우 제품 오작동의 원인이 된다. 이러한 열을 제거하기 위해 히트싱크(heatsink)와 냉각 팬 (cooling fan)을 조합한 냉각 구조가 사용된다. 그러나 히트싱크와 냉각 팬의 조합 구조는 복잡한 형상을 취하기 때문에 전기 전자 제품의 소형화 추세에 부응하기에는 어려움이 따른다. 냉각 효율은 히트싱크의 표면적과 히트싱크 제조시 사용된 재료에 따라 달라진다. 일반적인 냉각 구조의 한계를 극복하기 위한 방안으로써, Trach-etched 멤브레인의 표면과 기공(pore)에 무전해 금도금과 구리 도금을 실행하여 크기는 작으면서 표면적을 증가시킨 마이크로 히트싱크를 제조하였다. 제조한 마이크로 히트싱크의 구조는 주사현미경(SEM)과 광학 현미경으로 관찰하였으며, 일반적인 구리보다 열효율이 우수함을 방열 특성 실험을 통해 관찰하였다.

• 한국기계가공학회지
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• 제17권2호
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• pp.103-108
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• 2018

In interrupted cutting, the workpiece has a groove that impacts both the cutting tool and the workpiece. Therefore, cutting tool damage occurs rapidly. In this study, I performed interrupted cutting of carbon steel for machine structures (SM20C) using an uncoated carbide tool (SNMG120404, P20), and observed tool damage, cutting chip shape, and the workpiece surface. Results: Under the specific cutting conditions of feed rate = 0.066 mm/rev, cutting speed = 120 m/min, and depth of cut = 0.1 mm; and feed rate = 0.105 mm/rev, cutting speed = 120 m/min, and depth of cut = 0.2 mm, the observed tool damage was small. Similar chip shape was observed (Expt. No. 1, 3, 7). Workpiece damage was observed (Expt. No. 3, 5, 7, 9).

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.302-307
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• 2002

In end milling process, the undeformed chip section area and cutting forces vary periodically with phase change of the tool. However, the real undeformed chip section area deviates from the geometrically ideal one owing to cutter runout and tool shape error. In this study, a method of estimating the real undeformed chip section area which reflects cutter runout and tool shape error was presented during up-end milling of Inconel 718 using measured cutting forces. The specific cutting resistance, K. and $K_t$ are defined as the radial and tangential cutting forces divided by the modified chip section area. Both of $K_r$, and $K_t$ values become smaller as the helix angle increases from $30^\circ$ to $40^\circ$ Whereas they become larder as the helix angle increases from $40^\circ$ to $50^\circ$. On the other hand, the $K_r$, and $K_t$ values show a tendency to decrease with increase of the modified chip section area and this tendency becomes distinct with smaller helix angle.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.308-313
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• 2002

In end milling process, the undeformed chip section area and cutting forces vary periodically with phase change of the tool. However, the real undeformed chip section area deviates from the geometrically ideal one owing to cutter runout and tool shape error. In this study, a method of estimating the real undeformed chip section area which reflects cutter runout and tool shape error was presented during down end-milling of Inconel 715 using measure cutting forces. Contrary to the up-end milling the value of radial specific cutting resistance, $K_r$, becomes larger as the helix angle increases from $30^{\circ}$ to $40^{\circ}$ and it shows almost same value at $50^{\circ}$ The value of tangential specific cutting resistance, $K_t$ becomes larger as the helix angle increases same as in up-end milling, the $KK_r$, and $K_t$ values show a tendency to decrease with increase of the modified chip section area and this tendency is distinct with helix angle $40^{\circ}$.

• 한국전기전자재료학회논문지
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• 제21권12호
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• pp.1118-1123
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• 2008

High voltage multilayer ceramic capacitors (MLCCs) are classified into two classes-those for temperature compensation (class I) and high dielectric constant materials (class II). We manufactured high voltage MLCC with temperature coefficient characteristics of C0G and X7R and studied the characteristics of electric properties. Also we studied the characteristics of dielectric breakdown voltage (V) as the variation of thickness in the green sheet and how to pattern the internal electrodes. The dielectric breakdown by electric field was caused by defects in the dielectric materials and dielectric/electrode interface, so the dielectric thickness increased, the withstanding voltage per unit (E) thickness decreased. To overcome this problem, we selected the special design like as floating electrode and this design affected the increasing breakdown voltage(V) and realized the constant withstanding voltage per unit thickness(E). From these results, high voltage application of MLCCs can be expanded and the rated voltage can also be develop.

• 한국정밀공학회지
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• 제19권8호
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• pp.63-70
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• 2002

In end milling process, the undeformed chip section area and cutting forces vary periodically with phase change of the tool. However the real undeformed chip section area deviates from the geometrically ideal one owing to cutter runout and tool shape error. In this study, a method of estimating the real undeformed chip section area which reflects cutter runout and tool shape error was presented in up end milling process using measured cutting forces. The average specific cutting resistance, Ka is defined as the main cutting force component divided by the modified chip section area. Ka value becomes smaller as the helix angle increases from $30^circC \;to\;40\circC$. But it becomes larger as the helix angle increases from $40^\circ$to 50 . On one hand, the Ka value shows a tendency to decrease with increase of the modified chip section area and this tendency becomes distinct with smaller helix angle.

• 한국수소및신에너지학회논문집
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• 제31권5호
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• pp.480-488
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• 2020

This study was conducted to improve the flow uniformity inside the chip tester through changing the flow path formation according to the inlet and outlet position of chamber. The internal flow and velocity distributions of the modified chamber models (Cases 1-3) were compared with the reference chamber model through three-dimensional Reynolds-averaged Navier-Stokes equations with k-ε turbulence model. The modified chamber models showed the superior flow uniformity characteristics compared to the reference chamber model. To investigate the flow uniformity in the chip tester, the standard deviation of the velocity was defined and compared. Through the internal flow analysis and assesment of the standard deviation, Case 2 among the test cases including the reference model showed the best flow uniformity generally.

• 대한기계학회논문집
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• 제14권6호
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• pp.1515-1522
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• 1990

본 연구에서는 천연다이아몬드의 인선형상을 R형과 S형으로 구분하여 제작하 고 미세이송과 절삭속도 변화를 주어 이에 얻어지는 표현거칠기, 칩 생성기구 및 경면 성을 검토하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.124-130
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• 2001

The heat transfer and flow measurements were made on a cylindrical pedestal mounted on a flat plate with a turbulent impinging air jet. The heat transfer coefficient distributions on the flat plate were measured using the shroud-transient technique and liquid crystal was used to measure the surface temperature. The jet Reynolds number (Re) is 23,000, the dimensionless nozzle-to-surface distance (L/d) from 2 to 10, the dimensionless pedestal diameter-to-height (H/D) from 0 to 1.5, the dimensionless 2nd pedestal diameter-to-height ($H/D_2$) from 0 to 0.4 and the distance from the stagnation point to 2nd pedestal (p/D). The results show that for H/D = 0.5 to 1.5, the Nusselt number distributions on the plate surface exhibit a maximum between $r/d\;{\cong}\;1.0$ and 1.5. The presence of the pedestal appears to cause the flow separation and reattachment on the plate surface, which results in the maximum heal transfer coefficient. Also, for p/D = 2.5 and $H/D_2$ = 0.3, the local Nusselt number in the region corresponding to $r/d\;{\cong}\;1.1$ was increased up to 50% compared to that for $H/D_2=0$.

• 한국생산제조학회지
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• 제23권4호
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• pp.330-336
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• 2014

The continuous chip generated in cutting process deteriorates workpiece, tool, and machine tool system. It is necessary to treat this continuous chip in ductile material machining condition for stable cutting. This paper deals with the chip control method using acoustic emission(AE) signal in pure copper turning operation. AE raw signals, root mean square(RMS) signals and wavelet transformed signals measured in turning process are introduced to analysis for chip patterns. With analysis of AE signals, it is obtained that the produced chip patterns are correlated with the specified AE signals which are transformed by fuzzy pattern algorithm. By this experimental investigation, the chip patterns can be classified at significant level in pure copper machining process and controlled from continuous chips to reduced-length stable chips.