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Effect of Material Property Uncertainty on Warpage during Fan Out Wafer-Level Packaging Process (팬아웃 웨이퍼 레벨 패키지 공정 중 재료 물성의 불확실성이 휨 현상에 미치는 영향)

  • Kim, Geumtaek;Kang, Gihoon;Kwon, Daeil
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.1
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    • pp.29-33
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    • 2019
  • With shrinking form factor and improving performance of electronic packages, high input/output (I/O) density is considered as an important factor. Fan out wafer-level packaging (FO-WLP) has been paid great attention as an alternative. However, FO-WLP is vulnerable to warpage during its manufacturing process. Minimizing warpage is essential for controlling production yield, and in turn, package reliability. While many studies investigated the effect of process and design parameters on warpage using finite element analysis, they did not take uncertainty into consideration. As parameters, including material properties, chip positions, have uncertainty from the point of manufacturing view, the uncertainty should be considered to reduce the gap between the results from the field and the finite element analysis. This paper focuses on the effect of uncertainty of Young's modulus of chip on fan-out wafer level packaging warpage using finite element analysis. It is assumed that Young's modulus of each chip follows the normal distribution. Simulation results show that the uncertainty of Young's modulus affects the maximum von Mises stress. As a result, it is necessary to control the uncertainty of Young's modulus of silicon chip since the maximum von Mises stress is a parameter related to the package reliability.

$CO_2$ Refrigeration, Air Conditioning and Heat Pump Technology Development in Europe

  • Pettersen, Jostein;Neksa, Petter
    • The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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    • v.31 no.7
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    • pp.53-64
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    • 2002
  • $CO_2$ 20세기 초 천연 냉매 $CO_2$는 광범위하게 사용되었지만 프레온계 냉매의 출현으로 1940년경부터 $CO_2$냉매는 사용이 제한되었다. 그러나 반 세기 동안 사라졌던 $CO_2$냉매는 1980년 후반에 노르웨이 과학 기술대학 (NTNU)과 북구 최대 민간연구소 (SINTEF)의 Lorentzen 교수에 의해 $CO_2$천연 냉매 사용을 재고하게 되었다. 프레온계 냉매의 환경적 논쟁이 쟁점이 되면서 천연 냉매 사용을 재고하게 되었다. 특히 비가연성과 비유독성으로 인한 $CO_2$냉매가 주목을 받고 있다. 초월임계 사이클레서의 고압 제어에 대한 새로운 개념은 Lorentzen 교수와 동료 연구원에 의해서 특허로 제안되었다. 이에 대한 상업적 권리를 Norsk Hydro사는 1990년에 얻었고,1990년대 초반에 NTNU/SINTEF의 공동 연구개발 프로그램을 통해 기술 경쟁력과 실현 가능성이 검증되었다. 현재 연구소에서는 최초로 초월임계 $CO_2$사이클을 이용한 상업용 온수 열펌프 시스템, 2003년 시작할 연료전지 전기 자동차에 대한 연구를 수행하고 있다. NTNU/SINTEF에서 개발된 $CO_2$기술은 Hydro-SINTEF 공동 벤처 기업인 Shecco기술회사를 통해 제조업자에게 허가된다. 본 고에서는 NTNU/SINTEF에서 수행하였거나 수 중인 과제들을 중심으로 유럽의 $CO_2$시스템의 결과와 주요 개발 범위를 정리하였으며, 특히 작동유체로서의 $CO_2$냉매의 특징을 간단히 설명하고, 온 수 열 펌프, 자동차용 공조기 및 열 펌프, 상업 냉동기 등이 기술되었다. 그 외 압축기 위주의 요소기술 개발에 관한 내용도 기술되었고, 차세대 기술 경향과 전망에 대해서도 제시되었다. 제시되었다.성균 350$\times$$10^4$ CFU균, 방선균 434$\times$$10^4$ CFU균, 진균 676$\times$$10^4$ CFU균으로 진균의 개체수가 비교적 높게 나타났으며, 비산불지역에서는 호기성균 328$\times$$10^4$ CFU균, 방선균 319$\times$$10^4$ CFU균, 진균 461$\times$$10^4$ CFU균으로 진균의 개체수가 높게 나타났다. 토양미생물은 호기성균, 방선균, 진균 모두 비산불지역 보다 산불지역에서 많이 나타났다. 본 조사지역에서 호기성균은 활엽수림보다 침엽수림에서 많게 나타났으며, 방선균과 진균은 침엽수림보다 활엽수림에서 많이 나타났다.효과와 이를 이용한 자기냉동의 방법 그리고 최근에 이루어진 새로운 진전에 대해 소개하고 공기조화 및 냉동분야에의 적용 가능성을 전망해 보고자 한다.및 도입 등 선주들에게 다양한 선박건조자금을 제공하여 내수기반 확충에도 노력해야 할 것 이다.있었다., 인삼이 성장될 때 부분적인 영양상태의 불충분이나 기후 등에 따른 영향을 받을 수 있기 때문에 앞으로 이에 대한 많은 연구가 이루어져야할 것으로 판단된다.태에도 불구하고 [-wh]의미의 겹의문사는 병렬적 관계의 합성어가 아니라 내부구조를 지니지 않은 단순한 단어(minimal $X^{0}$ elements)로 가정한다. 즉, [+wh] 의미의 겹의문사는 동일한 구성요 소를 지닌 병렬적 합성어([$[W1]_{XO-}$ $[W1]_{XO}$ ]$_{XO}$)로 그리고 [-wh] 의미의 겹의문사는 중복된 발은을 지닌 한 단어로 ([W]$_{XO}$ )

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Evaluation of Single and Stacked MFC Performances under Different Dissolved Oxygen Concentrations in Cathode Chamber (환원전극 DO 농도에 따른 단일 및 직렬연결 미생물연료전지 전기발생량 평가)

  • Yu, Jae-Cheul;Lee, Tae-Ho
    • Journal of Korean Society of Environmental Engineers
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    • v.31 no.4
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    • pp.249-255
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    • 2009
  • The performance of microbial fuel cell (MFC) can be affected by many factors including the rate of organic matter oxidation, the electron transfer to electrode by electrochemical bacteria, proton diffusion, the concentration of electron acceptor, the rate of electron acceptor reduction and internal resistance. the performance of MFC using oxygen as electron acceptor can be influenced by oxygen concentration as limit factors in cathode compartment. Many studies have been performed to enhance electricity production from MFC. The series or parallel stacked MFC connected several MFC units can use to increase voltages and currents produced from MFCs. In this study, a single MFC (S-MFC) and a stacked MFC (ST-MFC) using acetate as electron donor and oxygen as electron acceptor were used to investigate the influence of dissolved oxygen (DO) concentrations in cathode compartment on MFC performance. The power density (W/$m^3$) of S-MFC was in order DO 5 > 3 > 7 > 9 mg/L, the maximum power density (W/$m^3$) of S-MFC was 42 W/$m^3$ at DO 5 mg/L. The power density (W/$m^3$) of ST-MFC was in order DO 5 > 7 > 9 > 3 mg/L and the maximum power density (W/$m^3$) of STMFC was 20 W/$m^3$ at DO 5 mg/L. These results suggest that the DO concentration of cathode chamber should be considered as important limit factor of MFC operation and design for stacked MFC as well as single MFC. The results of ST-MFC operation showed the voltage decrease of some MFC units by salt formation on the surface of anode, resulting in decrease total voltage of ST-MFC. Therefore, connecting MFC units in parallel might be more appropriate way than series connections to enhance power production of stacked MFC.

A Study on Implementation and Performance of the Power Control High Power Amplifier for Satellite Mobile Communication System (위성통신용 전력제어 고출력증폭기의 구현 및 성능평가에 관한 연구)

  • 전중성;김동일;배정철
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.4 no.1
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    • pp.77-88
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    • 2000
  • In this paper, the 3-mode variable gain high power amplifier for a transmitter of INMARSAT-B operating at L-band(1626.5-1646.5 MHz) was developed. This SSPA can amplify 42 dBm in high power mode, 38 dBm in medium power mode and 36 dBm in low power mode for INMARSAT-B. The allowable errol sets +1 dBm as the upper limit and -2 dBm as the lower limit, respectively. To simplify the fabrication process, the whole system is designed by two parts composed of a driving amplifier and a high power amplifier. The HP's MGA-64135 and Motorola's MRF-6401 were used for driving amplifier, and the ERICSSON's PTE-10114 and PTF-10021 for the high power amplifier. The SSPA was fabricated by the RP circuits, the temperature compensation circuits and 3-mode variable gain control circuits and 20 dB parallel coupled-line directional coupler in aluminum housing. In addition, the gain control method was proposed by digital attenuator for 3-mode amplifier. Then il has been experimentally verified that the gain is controlled for single tone signal as well as two tone signals. In this case, the SSPA detects the output power by 20 dB parallel coupled-line directional coupler and phase non-splitter amplifier. The realized SSPA has 41.6 dB, 37.6 dB and 33.2 dB for small signal gain within 20 MHz bandwidth, and the VSWR of input and output port is less than 1.3:1. The minimum value of the 1 dB compression point gets more than 12 dBm for 3-mode variable gain high power amplifier. A typical two tone intermodulation point has 36.5 dBc maximum which is single carrier backed off 3 dB from 1 dB compression point. The maximum output power of 43 dBm was achieved at the 1636.5 MHz. These results reveal a high power of 20 Watt, which was the design target.

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