• Title/Summary/Keyword: 초음파 트랜스듀서 혼

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Vibration Characteristics of a Wire-Bonding Transducer Horn (와이어 본딩용 트랜스듀서 혼의 진동 특성)

  • Yim, Vit;Han, Dae-Ung;Lee, Seung-Yeop;An, Geun-Sik;Gang, Gyeong-Wan;Kim, Guk-Hwan
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2007.11a
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    • pp.583-588
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    • 2007
  • This paper investigates the vibration characteristics of a wire-bonding transducer horn for high speed welding devices. The sample wire-bonder uses the input frequency of 136 kHz. The ultrasonic excitation causes the various vibrations of transducer horn and capillary. The vibration modes and frequencies close to the exciting frequency are identified using ANSYS. The nodal lines and amplification ratio of the ultrasonic horn are also obtained in order to evaluate the bonding performance of the sample wire-bonder system. The FEM results and experimental results show that the sample wire-bonder system uses the bending mode of 136 kHz as principal motion for bonding. The major longitudinal mode exists at 119 kHz below the excitation frequency. It is recommeded that the sample system is to set the excitation frequency at 119 kHz to improve bonding performance.

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Vibration Characteristics of a Wire-Bonding Ultrasonic Horn (와이어 본딩용 초음파 혼의 진동 특성)

  • Kim, Young Woo;Yim, Vit;Han, Daewoong;Lee, Seung-Yop
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.2
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    • pp.227-233
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    • 2014
  • This study investigates the vibration characteristics of a wire-bonding piezoelectric transducer and ultrasonic horn for high-speed and precise welding. A ring-type piezoelectric stack actuator is excited at 136 kHz to vibrate a conical-type horn and capillary system. The nodal lines and amplification ratio of the ultrasonic horn are obtained using a theoretical analysis and FEM simulation. The vibration modes and frequencies close to the driving frequency are identified to evaluate the bonding performance of the current wire-bonder system. The FEM and experimental results show that the current wire-bonder system uses the bending mode of 136 kHz as the principal motion for bonding and that the transverse vibration of the capillary causes the bonding failure. Because the major longitudinal mode exists at 119 kHz, it is recommended that the design of the current wire-bonding system be modified to use the major longitudinal mode at the excitation frequency and to minimize the transverse vibration of capillary in order to improve the bonding performance.

Contact Analysis on a Born-Holder Assembly for Wire Bonding (와이어 본더용 Horn-Holder Assembly의 접촉 해석)

  • Jang, Chang-Soo;Ahn, Geun-Sik;Kim, Young-Joon;Kwak, Dong-Ok;Boo, Seong-Woon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.10
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    • pp.2008-2017
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    • 2002
  • Joint structure of a transducer horn-holder assembly fur a wire bonder was examined through FEM contact analysis. A three dimensional modeling and analysis was carried out to survey the internal physics of this structure and to prove the accuracy of a computation compared to a measurement. After validation, a simple two dimensional model was built fur various parametric study considering the efficiency and speed of the computation. Several factors such as boundary conditions, a modeling boundary, mesh density and so on, were considered to obtain consistency with three dimensional analysis. An arc angle and a position of each holder boss were chosen as design parameters. A design of experiment was applied to find out an optimized design of the holder geometry. As a result, a guideline for holder boss design was suggested and main factors and their influence on stress concentration in the transducer horn were surveyed.