• Journal of the Korean Chemical Society
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• v.66 no.6
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• pp.436-441
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• 2022

Because the nanoporous electrodes has large electrochemical surface areas, extensive studies have been focused on their fabrication methods. In this paper, a method for introducing a nanoporous gold (NPG) structure on the surface of an ultramicroelectrode (UME) using potentiostatic anodization was investigated. A well-defined NPG structure was introduced on the surface of the UME when a potential of 1.3 V was applied in 0.1 M phosphate buffer solution (pH 8) containing 1 M KCl. The anodic oxidation efficiency was investigated by observing the effect of the applied potential, the reaction time, and the size of the electrode on the roughness factor (R_f) of the prepared NPG-UMEs. In a short time of about 10 minutes, NPG-UME with a large R_f value of about 2000 could be prepared, which could be effectively used for electrochemical glucose detection. The results shown in this work are expected to have great applicability when performing electrochemical analysis with a small sample volume.

• Proceedings of the KIEE Conference
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• 2003.07d
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• pp.2807-2808
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• 2003

말초 신경계에서 손상된 신경은 그 손상된 정도에 따라 재생의 정도가 달라진다. 이러한 신경 재생의 정도를 확인할 수 있는 방법으로 초미세 전극 어레이 기술이 연구되고 있는데 이것은 전기신호경로(via hole)를 초미세 전극어레이를 제작하여, 손상된 신경의 근위부(proximal stump)와 원위부(distal stump) 사이에 직접 삽입하여 선경으로부터 재생되어온 신경 섬유의 전기적 전도 선호를 측정 및 기록하는 것이다. 이는 신경 재생을 관찰하는 방법으로서 신경보철(neural prostheses) 기술에 이용된다. 따라서, 본 논문에서는 손상된 신경의 재생을 관찰하기 위한 implantable microelectrode array system을 설계하고, 원 신호인 선경 전도 신호의 특성과 제작된 이식형 초미세전극(implantable microelectrode)의 특성을 고찰하며, 동물 실험을 통하여 그 성능을 검증하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 1996.06a
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• pp.89-90
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• 1996

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.167-168
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• 1998

• Proceedings of the Korean Vacuum Society Conference
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• 1997.02a
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• pp.197-198
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• 1997

• Proceedings of the Korean Vacuum Society Conference
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• 2003.08a
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• pp.212-212
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• 2003

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.83-84
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• 2007

Damascene 공정을 이용하여 80nm급의 trench 패턴 내에 구리 배선 형성을 위해 무전해 구리 도금법을 이용하였다. 화학 반응으로 진행되는 무전해 도금법에 의한 구리이온의 초미세 패턴 내 환원 과정에 구리 이온의 물질 전달과정이 구리 도금층의 표면 특성과 superconformality에 미치는 영향을 살펴보았다. 회전 전극에 고정된 칩의 회전 속도가 증가함에 따라 구리 도금층의 비저항이 감소하고, trench 내 균일 도금성이 향상되는 것으로 나타났다.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.11
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• pp.969-974
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• 2014

Previously fabricated electronic devices were used for vacuum manufacturing processes such as conventional semiconductor manufacturing. However, they are difficult to apply to continuous processes such as roll-to-roll printing, which results in very high device manufacturing and processing costs. Therefore, many developers have been interested in applying continuous processes to contact printing or noncontact printing technologies and they proposed various continuous printing techniques instead of conventional batch coating. In this paper, we proposed improved gravure offset printing process as one of the contact printing technique. We used etching pattern geometry with soft core blanket roll for printing of ultra fine line below the 10um.Using this technique we obtained flexible metal grid mesh film as transparent conductive film.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.508-512
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• 2004

An ultra-sharp tungsten electrode for field emission was manufactured by using an electrochemical etching method, and its beam characteristics were investigated. KOH and NaOH were the electrolytes used in this research, and the taper length of the tip varied form 150 $\mu\textrm{m}$ to 250 $\mu\textrm{m}$ according to the applied voltage and the concentration of the electrolyte. The electron-beam stability was measured to be within 5% for a total emission current of 5 ${\mu}\textrm{A}$ during 4 hours of operation, and the Ignition voltages were found to be ∼300 V. The tip radius was experimentally found to be 250${\AA}$ from a linear fitting of Fowler-Nordheim plots, which was in remarkably good agreement with that of the image size from scanning ion-microscopy.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.449-452
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• 2004

To obtain the ultra-sharp tungsten tip, an analog to digital converter circuit aided by a personal computer has been setup. At the moment the lower part of the needle drops off during the etching process, a maximum current change across the reference resistor is detected by the PC interface card and the applied voltage is then cut off within a few milliseconds. Out experiment has been able to fabricate an ultra-sharp tungsten tip ~200 $\AA$ radius with a higher reproduction rate and reliability than the conventional method.