• Transactions of the Korean Society of Mechanical Engineers
• /
• v.17 no.5
• /
• pp.1041-1053
• /
• 1993

A theoretical model to predict the triangular chip formation in cutting with a self-propelled rotary tool is developed. The model is based on the model of transient chip formation in two dimensional orthogonal cutting. The predicted results are found to be in good agreement with the experimental observations and suggest that transient charcteristics of work material, which depend on both cutting conditions and material properties, have the significant influence on triangulation.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.17 no.8
• /
• pp.1910-1920
• /
• 1993

An experimental study to investigate the unconventional chip formation called triangulation of chip in cutting with a SPRT (self-propelled rotary tool) is performed using acoustic emission (AE) signal analysis. In doing that, a quantitative model of the AE RMS signal in triangulation with a SPRT is first developed. The predicted results from this model show good correlation between the AE RMS signal and the general characteristics of triangular chip formation. Then, effects of various process parameters such as cutting conditions (cutting speed, depth of cut, oblique angle and normal rake angle) and the work material properties on the chip formation in cutting with a SPRT are explored. Special attention is paid to the work material properties which are found to have significant effects on triangulation.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.4
• /
• pp.61-68
• /
• 2023

In this study, Sn-3.5Ag-15.0Fe composite solder was manufactured and applied to TLP bonding to change the entire joint into a Sn-Fe IMC(intermetallic compound), thereby applying it as a high-temperature solder. The FeSn₂ IMC formed during the bonding process has a high melting point of 513℃, so it can be stably applied to power modules for power semiconductors where the temperature rises up to 280℃ during use. As a result of applying ENIG surface treatment to both the chip and substrate, a multi-layer IMC structure of Ni₃Sn₄/FeSn₂/Ni₃Sn₄ was formed at the joint. During the shear test, the fracture path showed that cracks developed at the Ni₃Sn₄/FeSn₂ interface and then propagated into FeSn₂. After 2hours of the TLP joining process, a shear strength of over 30 MPa was obtained, and in particular, there was no decrease in strength at all even in a shear test at 200℃. The results of this study can be expected to lead to materials and processes that can be applied to power modules for electric vehicles, which are being actively researched recently.