• Journal of Welding and Joining
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• v.29 no.4
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• pp.93-99
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• 2011

This study was performed to compare the shear strength of the bondings between stainless steel crown/direct type composite resin and stainless steel crown/indirect type composite resin. Four groups of bonding conditions were prepared. Two groups of bonding conditions were made by the indirect type composite resin system and the other two groups were made by the direct type composite resin system. The shear strength tests were carried out using universal testing machine, Model 4465 of Instron Co.. It was indicated that the bond strength values of the indirect type composite resins were higher than those of the direct type composite resins. TE-SE group was superior to the TE-ONE in indirect type resin system. These results were thought to be the high degree of the polymerization accompanied with temperature and pressure of the resin of indirect type resin. It was also found that indirect composite resin contains less amount of porosity in resin.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.6
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• pp.688-697
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• 2014

In this study, electrode bonding technology needed for high density of rechargeable battery is studied, which is recently researched for electric vehicle, the small leisure vessel. For the alternative overcoming the limit of stacking amount able to be stacked by conventional ultrasonic welding, the low temperature bonding method, eligible for minimum of degeneration of chemical activator on the electrode surface which is generated by thermal effect as well as the increase of conductivity and tension strength caused by electrode bonding using filler metal, not using conventional direct heating on the electrode material method, is studied. Specifically to say, recently used more generally the ultrasonic welding and spot welding method are not usable for satisfying stable electric conductivity and bonding strength when much electrode is stacking bonded. If the electrical power is unreasonably increased for the welding, due to the effect of welding temperature, deformation of electrode and activating material degeneration are caused, and after the last packaging, decline of electrical output and generating heat cause to reduce stability of battery. Therefore, in this study, induction heating system bonding method using high frequency heating and differentiated electrode method using filler metal pre-treatment of hot dipping are introduced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.828-831
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• 2001

A simple and versatile method of manufacturing semiconductor devices with pn-junctions used the silicon direct bonding technology with simultaneous impurity diffusion is suggested . Formation of p- or n- type layers was tried during the bonding procedure by attaching two wafers in the aqueous solutions of Al(NO$_3$)$_3$, Ga(NO$_3$)$_3$, HBO$_3$, or H$_3$PO$_4$. An essential improvement of bonding interface structural quality was detected and a model for the explanation is suggested. Diode, Dynistor, and BGGTO structures were fabricated and examined. Their switching characteristics are presented.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.437-440
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• 2000

Composite material consists of more than two materials and make various kinds of composite materials by combining different single materials. Copper clad aluminum composite material is composed of Al and Cu, and it has already been put to practical use in Europe because of its economic benefits. This paper presents the interface bonding according to the variation of extrusion ratio and semi-angle die by observing the interface between Cu and Al using metal microscope. By that result, we can predict the conditions of the interface bonding according to the extruding conditions.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.229-231
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• 2007

Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.

• Nuclear Engineering and Technology
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• v.5 no.1
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• pp.13-19
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• 1973

The photovoltaic and the electronvoltaic cells have been obtained by forming Sb-implanted n- on p-type and In-implanted p- on n-type silicon p-n junctions Such shallow implantations into silicon wafers due to each dopant were done by the VDH-Implanter. The two types of the silicon p-n junction for these cells have shown special features on their various characteristics to be fitted for the direct energy conversions. The results of the comparative study on both of these cells are described in this article.

• Journal of Welding and Joining
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• v.16 no.3
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• pp.141-147
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• 1998

Design sensitivity analysis of a vehicle system is an essential tool for design optimization and trade-off studies. Most optimization algorithms require the derivatives of cost and constraint function with respect to design in order to calculate the next improved design. This paper presents an efficient algorithm application for the design sensitivity analysis, using the direct differentiation method. A mounting area of suspension that welded on chassis frame is analyzed to show the validity and the efficiency of the proposed method. A mounting area of suspension that welded on chassis frame is analyzed to show the validity and the efficiency of the proposed method.

• Tunnel and Underground Space
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• v.31 no.6
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• pp.623-646
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• 2021

As the demand for electric power increases with acceleration of electrification at home and abroad, the needs for coal-fired electrical power plant are accordingly increased. However, these coal-fired electrical power plants induce also many environmental problems such as increase of air pollutants, increase of possibility of land contamination by reclamation of coal ash, even though these power plants have a good economical efficiency. In case of a by-product of coal-fired electrical power plants, only 70% of them are recycled and the remaining 30% of by-product are fully buried in surrounding ground. Consequently, this study deals with coal ash backfilling mechanism in abandoned mine openings for the purposes of increasing the coal ash recycling rate as well as securing the mine area stability. In order to analyze the backfill and ground reinforcement by interaction between rock mass and backfills, the copying samples of discontinuous surface with different roughnesses were produced for bond strength tests and direct shear tests. And statistical analysis was also conducted to decide the characteristics of bond and shear behavior with joint roughness and their curing day. Numerical simulations were also analyzed for examining the effect of interface behavior on ground stability.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.127.1-127.1
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• 2016

Si은 값싸고 넓은 시설기반을 갖추고 있어, 발전산업에서 태양광소자의 주원료로 널리 사용된다. 하지만 Si은 간접 띠틈을 Si의 특성을 개선하기 위해 최근 Si에 특정한 결함을 넣어 직접 띠틈으로 바꿔 광효율을 높이려는 시도가 있다. 2015년 초 Si단결정[111]으로 Seiwatz-chain 형태의 결함이 있다면 결함이 있는 Si(111)에 직접 띠틈이 생길 것 이라고 이론적으로 예상했다. 이러한 구조의 제작방법으로 Ca/Si(111)과 Si(111)을 접합 후 가열하여 Ca을 빼내는 방법을 제시했다[1]. 본 연구에서는 이 제작방법 외에 Ca/Si(111)-$2{\times}1$ 표면에서[2] 에피성장으로 결함이 유지된 Si단결정 형성가능성을 제일원리 계산을 통해 연구했다. 제일원리 계산방법으로는 VASP(Vienna Ab-initio Simulation Package)를 이용하였다. Si원자 한개, 두 개, 세 개가 흡착될 경우 원자당 흡착에너지는 각각 3.73 eV, 3.73 eV, 3.91 eV 였다. 따라서 Si원자는 무리형태로 흡착될 것으로 예상되어 결함을 유지하며 단결정으로 성장하기는 어려울 것으로 보인다.

• New & Renewable Energy
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• v.3 no.1 s.9
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• pp.46-53
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• 2007

Direct Methanol Fuel Cell, DMFC is a potential power source for portable IT application. DMFC works at low temperature ($<100^{\circ}C$) without fuel processing. Methanol has high energy density, fuel economy, and easiness to handle. This paper focuses high efficient catalyst to increase utilization in the electrode, new membrane reducing methanol crossover, new material parts, and optimization of system integration. Lightweight and small-sized DMFC based on new materials, efficient stack, and improved system control will be applied to the 50W prototype system for the notebook computer.