• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.1-7
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• 2008

We studied a growth behavior of Intermetallic compounds(IMCs) during solder bumping with two reflow methods. Ti(50 nm), Cu($1{\mu}m$), Au(50 nm) and Ti(50 nm) thin films were deposited on $SiO_2$/Si wafer using the DC magnetron sputtering system as the under bump metallization(UBM). And the $5{\mu}m$ thick Cu bumps and $20{\mu}m$ thick Sn bumps were fabricated on UBM by electroplating. Sn bumps were reflowed in RTA(Rapid Thermal Annealing) system and convection reflow oven. When RTA system was used, reflow was possible without using flux and IMC thickness formed in the solder interface was thinner than that of a convectional method.

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.85-90
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• 1997

A new ionized sputtering process was developed to fill small trench or via using additional ionizing mechanism of sputtered particles from 32cm $AlCu_x$(x=0.5%) cathode target with rotating magnet, then drawn toward substrate by small negative DC potential. The radial uniformity in RFI magnetron sputtering was studied by plasma diagnosis and appropriate RFI coil design to improve it. Optical emission intensities of excited species. $Ar^{\circ}, \;Ar^+;Al^+, \;Al^{\circ}$ are measured across the radial direction and showed close correlation with deposit's bottom to top thickness ratios in trenches and vias of submicron opening and 1.5 aspect ratio. After increase of the diameter of RF coil from 29 cm to 32 cm and improved the power leading feedthrough symmetry by removal of asymmetric single turn region, there was an increase of uniformity from 7.5% to 1.5% in bottom to top thickness ratio in 0.6 $\mu\textrm{m}$ vias.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.39 no.2
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• pp.6-10
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• 2002

Al films (1000~4000${\AA}$)were deposited on glass and polymer(polyethersulfine) plastic substrates by DC-magnetron sputtering for plastic-based flat-panel displays. A stepped heating process was used both to improve the electrical characteristics and to diminish the thermal expansion of the polymer substrates. Following this procedure, we could succeed in sputtering Al films without any cracking or shrinkage of the polymer substrates. The treatment temperatures and deposited process of Al films were under 200$^{\circ}C$. Also, this low temperature fabrication process allows the application of plastic substrates. Scanning Electrom Microscopy, Atomic Force Microscopy, X-ray Dffractometry, and electrical measurements such as resistivity measurements were performed to investigate the properties of deposited the Al films and their reliability. 

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.143-143
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• 1999

Co/Ti 다층 박막을 제조하기 위해 직류원 마그네트론 스퍼터링 시스템을 이용하여 (100)실리콘 단결정 기판위에 Co와 Ti층을 각각 2/2, 5/5, 10/10 nm 정도의 두께로 조절하여 세가지 조성의 Co/Ti 다층 박막을 제조하였다. 이러한 Co/Ti 다층 박막의 후속 열처리는 Ar 가스분위기 하에서 Tube furnace를 이용하여 20$0^{\circ}C$와 30$0^{\circ}C$, 40$0^{\circ}C$의 온도에서 진행하였다. 증착초기에서부터 후속 열처리 공정을 진행하는 동안, Co/Ti 다층 박막에서의 계면반응을 미세 구조 변화 및 전기, 자기적 특성변화와 연관지어 관찰하였다. Co/Ti 다층 박막의 결정 구조와 미세 구조 변화를 관찰하기 위해 각각 X-선 회절기와 투과 전자 현미경을 사용하였고, 다층 박막의 전기적, 자기적 특성 변화를 관찰하기 위해 각각 4점 탐침기, 진동 시료형 자속계를 이용하였다. Co/Ti 다층 박막을 20$0^{\circ}C$의 저온에서 열처리를 한 경우에는 증착 초기의 계면반응에 의해 형성된 비정질 층이 성장하였고, 30$0^{\circ}C$와 40$0^{\circ}C$의 고온에서 열처리를 하는 경우에는 비정질 측의 성장보다는 새로운 화합물 CoTi 결정상이 형성되면서 비정질상은 오히려 감소하였다. 즉, Co/Ti 다층 박막의 계면 반응은 결정질 Co와 Ti을 계면 반응물로 소모시키면서 비정질 층을 성장시키는 비정질화 반응이 활발히 일어났다. 특히, 소모된 계면 반응물로 소모시키면서 비정질 층을 성장시키는 비정질화 반응일 활발히 일어났다. 특히, 계면 반응물로 소모시키면서 비정질 층을 성장시키는 비정질화 반응일 활발히 일어났다. 특히, 소모된 계면 반응물 Co와 Ti 중에서 Ti의 소모속도가 더 빠르게 관찰되었다. 이로부터 Ti 이 증착초기에서 저온 열처리 과정동안 Co/Ti 다층 박막의 계면에서 일어나는 비정질화 반응의 주 확산자로 작용했다는 것을 알 수 있다. 한편, 30$0^{\circ}C$와 40$0^{\circ}C$의 고온에서 열처리한 Co/Ti 다층 박막의 계면 반응은, 비정질 반응에 의한 비정질층의 형성보다는 새로운 화합물 결정질 CoTi상을 형성시키는 결정화 반응이 우세했다. Co/Ti 다층 박막의 전기적 저항은, 열처리에 의한 비정질 층의 생성 및 성장으로 인해 증가하였고 새로운 저저항 CoTi 결정상의 형성으로 인해 감소하는 것을 알 수 있었다. 또한 Co/Ti 다층 박막의 포화 자화값은, 열처리에 의한 계면에서의 비정질화 반응과 CoTi 결정화 반응으로 인해 강자성체인 Co 결정상이 감소됨에 따라 감소하는 경향을 나타냈다.

• Journal of the Korean Ceramic Society
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• v.39 no.10
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• pp.928-934
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• 2002

Gallium doped Zinc Oxide(GZO) films were deposited by dc magnetron sputtering using a GZO ceramic target at various conditions such as substrate temperature (RT, 400), residual water pressure ($P_{H_2O}$; 1.61${\times}10^{-4}∼2.2{\times}10^{-3}$ Pa), introduction of $H_2$ gas (8.5%) and different magnetic field strengths(250, 1000G). GZO films deposited without substrate heating showed clear degradation in film crystallinity and electrical properties with increasing $P_{H_2O}$. The resistivity increased from 3.0${\times}10^{-3}$ to 3.1${\times}10^{-2}{\Omega}㎝$ and the grain size of the films decreased from 24 to 3 nm when PH2O was increased from 1.61${\times}10^{-4}$ to 2.2${\times}10^{-3}$ Pa. However, degradation in electrical properties with increasing $P_{H_2O}$ was not observed for the films deposited with introduction of 8.5% $H_2$. When magnetic field strength of the cathode increased from 250G to 1000G, crystallinity and electrical properties of GZO films improved remarkably about all the $P_{H_2O}$. This result could be attributed to the decrease in film damage caused by the decrease in plasma impedance.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Applied Chemistry for Engineering
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• v.16 no.6
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• pp.768-771
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• 2005

The deposition of silicon nitride ($SiN_x$) thin films was carried out on $SiO_2/Si$ substrate at room temperature by reactive dc magnetron sputtering. The analysis of deposited $SiN_x$ films using x-ray photoelectron spectroscopy indicated that the composition of $SiN_x$ films was Si-rich. The deposited $SiN_x$ thin films were annealed by varying annealing temperature and time. X-ray diffraction (XRD) analysis was performed in order to examine the crystallization of Si in $SiN_x$ thin films. The optical and electrical properties of $SiN_x$ thin films were measured for the observation of Si nanodot. As a result, we observed the XRD peaks that might be the Si crystals. As the annealing time and annealing temperature increased, the photoluminescence intensity of $SiN_x$ films gradually increased. The capacitance-voltage characteristics of $SiN_x$ film measured before and after annealing indicated that the trap effect of electrons or holes occurred due to the existence Si nanodots in the $SiN_x$ thin films.

• Korean Journal of Optics and Photonics
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• v.14 no.3
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• pp.343-348
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• 2003

Indium tin oxide (ITO) thin films (170 nm) were grown by DC magnetron sputtering deposition on Coming glass substrates without a post annealing. The electrical transport and optical properties of the films have been investigated as a function of deposition temperature $T_{s}$ (10$0^{\circ}C$$\leq$ $T_{s}$$\leq$35$0^{\circ}C$) and oxygen partial pressure $P_{o_{2}}$, (0 $P_{o_{2}}$ $\leq$ 10$^{-5}$ torr). Films were deposited from a high density (99% of theoretical density) ITO target (I $n_2$ $O_3$: Sn $O_2$= 90 wt% : 10 wt%) made of ITO nano powders. With an increase of $T_{s}$ the electrical resistivity p of ITO thin films was found to decrease, but the mobility $\mu$$_{H}$ was found to increase. The carrier density nu shows the maximum value of 6.6$\times$10$^{20}$ /㎤ at $T_{s}$ = 30$0^{\circ}C$. At fixed Is, with an increase of the oxygen partial pressure, $n_{H}$ and $\mu$$_{H}$ were found to decrease, but p was found to increase. The minimum resistivity and maximum mobility values of the ITO films were found to be 0.3 mΩ.cm and 39.3 $\textrm{cm}^2$/V.s, respectively. The visible transmittance of the ITO films was above 80%.. 80%..

• Korean Journal of Optics and Photonics
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• v.13 no.5
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• pp.455-459
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• 2002

The transport and optical properties of $In_2O_3$:Zn(IZO) thin films grown by DC magnetron sputtering deposition have been studied. The deposition temperatures ($T_s$) were varied from room temperature to $400^{\circ}C$ in $50^{\circ}C$ steps. The IZO films are an amorphous phase for $T_s$<$300^{\circ}C$ and polycrystalline phase for $350^{\circ}C$＜$T_s$. In contrast to ordinary films, amorphous IZO films have lower resistivity and higher optical transmittance than polycrystalline IZO films. The resistivity of amorphous IZO was in the range of 0.29~0.4 m$\Omega$cm and that of polycrystalline IZO was in the range of 1~4 m$\Omega$cm. The carrier type for IZO film was found to be n-type, and the carrier density, was $3~5{\times}10^{20}/cm^3$. The Hall mobility, $({\mu}_H)$, was 20~$50\textrm{cm}^2$/V.sec. The predominant scattering mechanisms in both amorphous and polycrystalline IZO films were believed to be ionized impurity scattering and lattice scattering. The visible transmittance of the IZO films, which decreases with an increase of TS, was above 80%.