Cu Electroplating on the Si Wafer and Reliability Assessment of Low Alpha Solder Bump for 3-D Packaging (3차원 실장용 실리콘 웨이퍼 Cu 전해도금 및 로우알파솔더 범프의 신뢰성 평가)
-
- Proceedings of the Korean Institute of Surface Engineering Conference
- /
- 2012.11a
- /
- pp.123-123
- /
- 2012