• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.47-53
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• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• Journal of Korean Society of Steel Construction
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• v.24 no.2
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• pp.199-206
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• 2012

Unstiffened seated connections (USC) ensure easy installation and safety during erection, thereby making the process more economical. USCs consist of a seat angle for carrying the beam's reactions and a top angle to provide beam stability. These angles are bolted or welded to the beam and supporting member. This paper sought to propose a design table for the weld strength of such connections obtained from the elastic vector method (EVM) and the instantaneous center-of-rotation method (ICM) in terms of calculating the eccentricity. Also, the proposed design table is compared with both AISC and KBC specifications.

• Journal of Korean Society of Steel Construction
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• v.15 no.5 s.66
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• pp.519-529
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• 2003

In recent years, the use of cold-formed steel roof truss has been increased in the steel houses and high-rise apartments. The design of the roof truss anchor connections has been based on the experience and decision of designers. In this paper, the structural behavior of anchor connections based on experimental and decision is described. In the tests, truss members and connection members were jointed directly with self-drilling screw fasteners and the simple shaped connection member with excellent workability and structural capacity was used to connect roof truss and sub-structure. The connecting method was selected according to the construction material of sub-structure: chemical anchor for reinforced concrete structure and welding or DX-Pin for steel structures. The pull-out tests of various type anchor connection were executed to obtain the strength and the stiffness and the result have been compared with AISI(1996) and AlSC(1989) specifications, Simple formulas for the shear strength of screw connections have been propose and compared with tests.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.93.2-93.2
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• 2018

최근 기후 변화 문제로 $CO_2$배출량 억제 정책에 따라 열전재료가 다양한 분야에 크게 주목 받고 있다. 열전 모듈은 전류를 흘려 온도차를 발생시키는 펠티어 효과와 온도차를 전력으로 변환하는 제백 효과를 이용한다. 열전발전용에 적용되는 상용 열전모듈의 경우, 열전소자의 접합부의 수는 수십 개 이상이다. 따라서 단 한 개의 접합 불량 열전소자가 모듈 전체의 열전성능에 큰 영향을 미친다. 현재 상용화 된 Bi-Te계 열전 모듈은 Bi-Te의 Te와 Sn계 솔더의 주성분인 Sn이 $250^{\circ}C$ 부근에서 취성의 Sn-Te계 금속 화합물을 형성한다고 알려져 있다. 이 때 생성된 Sn-Te 화합물은 열전모듈의 접합강도를 약화시키고 이로 인해 열전모듈의 접합 신뢰성을 크게 저하 시킬 수 있다. 이를 해결하기 위해 솔더와 소자 사이에 확산방지층이 적용되고 있으며, 이 중에서 니켈합금이 가장 널리 적용되고 있다. 니켈층을 형성시키는 방법 중에서, 무전해 도금법은 간단하게 열전소자 표면 위에 도금 층을 균일한 두께로 만들어 낼 수 있다. 하지만, 니켈 도금층과 Bi-Te 소자 간에 화학적 결함이 존재하지 않기 때문에, 무전해 니켈 도금층의 밀착성이 떨어진다. 이 때. 소자 표면에 거칠기 효과(anchor effect)를 부여하기 위해 물리적 샌딩법을 사용하는데 이 방법의 경우 소자에 크랙 같은 손상을 미쳐 열전모듈의 신뢰성 저하를 가져온다. 그러므로 거칠기 효과를 부여하면서 소자에 손상을 최소화하는 습식 식각법을 개발하여 Bi-Te계 열전소자의 표면 조도를 조절하고 무전해 Ni-P 도금을 실시하였다. 그리고 열처리 유무에 따른 열전모듈의 접합강도를 측정하였으며, 제작한 열전 모듈의 접합부 및 파단부의 계면 분석하여 무전해 Ni-P도금을 위한 습식식각법(wet etching법)에 대하여 검토하였다. N-type은 질산과 구연산의 혼합수용액에, P-type은 왕수에 습식 식각처리를 해서 적당히 표면 조도를 조절한 후에 EPMA로 분석을 해본 결과 니켈 도금층과 Bi-Te 소자 간에 anchor effect가 부여 된 것을 확인했다. 습식 식각에 의해서 제조된 열전모듈의 접합강도는 종래의 알루미나 샌딩법으로 제조한 열전모듈 보다 높은 접합강도를 나타내었다.

• Proceedings of the Earthquake Engineering Society of Korea Conference
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• 2003.03a
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• pp.337-348
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• 2003

본 연구는 8개의 RBS (reduced beam section) 내진 철골모멘트접합부의 실물대 실험결과를 요약한 것이다. 본 실험의 주요변수는 보 웨브 접합법 및 패널존 강도를 택하였다. 균형 패널존 시험체는 접합부의 내진성능을 감소시키지 않으면서, 보와 패널존이 함께 균형적으로 지진에너지를 소산시키도록 설계하여 값비싼 패널존보강판(doubler plates)의 수요를 줄이고자 시도한 것이다. 보 웨브를 용접한 시험체는 모두 특별 연성모멘트골조에서 요구되는 접합부 회전능력을 충분히 발휘하였다. 반면 보 웨브를 볼트접합한 시험체는 조기에 스캘럽을 가로지르는 취성파단이 발생하는 열등한 성능을 보였다. 보 그루브 용접부 자체의 취성파괴가 본 연구에서와 같이 양질의 용접에 의해 방지되면, 스켈럽 부근의 취성파단이 다음에 해결해야 할 문제로 대두되는 경향을 보인다. 보 웨브를 볼팅한 경우에 접합부 취성파단의 빈도가 월등히 높은 이유를 실험 및 해석결과를 토대로 제시하였다 측정된 변형도 데이터에 의할 때, 접합부의 전단력 전달메카니즘은 흔히 가정하는 고전 휨이론에 의한 예측과 전혀 다르다. 이는 전통적 보 웨브 설계법을 재검토할 필요가 있음을 시사하는 것이다. 아울러, 본 연구의 제한된 실험자료 및 접합부에서 요구되는 바람직한 거동기준을 근거로 균형 패널존의 강도범위에 대한 예비적 추정치를 제시하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.347-348
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• 2015

Ni 도금 및 표면 거칠기에 따른 열전모듈의 접합강도 특성을 알아보기 위해 Bi-Te 소재 위에 Sand-blasting 방법을 사용하여 표면 거칠기를 조절하고, Ni-P 무전해 도금을 수행하였다. 접합강도 측정 및 표면 성분을 분석하기 위해 전단응력 측정기, FE-SEM을 이용하였다. Sand-blasting과 Ni 도금을 실시한 시편이 sand-blasting과 도금을 미실시한 대조군보다 전단응력이 높았고, 큰 방 수의 sand로 sand-blasting 한 시편일수록 전단응력이 더 높은 경향성을 보였다.

• Journal of the Korea Concrete Institute
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• v.18 no.2 s.92
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• pp.257-266
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• 2006

Flat-plate building systems are utilized extensively for construction of apartments, hotels and office buildings because of short construction period, low floor-to-floor height and flexibility in plan design. Recently, to increase lateral seismic resistance of flat-plate building systems, wall-columns are used frequently. Therefore, to estimate strength of flat-plate column connection accurately, the effect of column section shape on the behavior of flat-plate column connection should be considered properly, In the present study, a numerical analysis was performed for interior connections of continuous flat-plate to analyze the effect of column section shape. For the purpose, a computer program for nonlinear FE analysis was developed, and the validity was verified. Through the parametric study, the variations of shear stress distribution around the connection were investigated. According to the result of numerical analysis, as the length of the cross section of column in the direction of lateral load increases, the effective area and the maximum shear strength providing the torsional resistance decrease considerably. Therefore, these effects should be considered properly to estimate the strength of flat-plate connection accurately.

• Journal of Korean Society of Steel Construction
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• v.24 no.1
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• pp.35-46
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• 2012

With the increase in the demand for high-rise buildings, the use of high-strength steel has likewise increased. Thus, it has become more necessary to study the resistance force of the high-strength hollow structural section (HSS) joint of 600MPa. Additionally, the current design equation in Korea limits maximum yield stress at 360MPa in the case of HSS. In other words, since the current specification does not apply to HSS of 600MPa, this study aims to investigate the applicability of design equations as well as examine the behavior of the connection through the experiment and finite element analysis (FEA) of the plate-tube connection of 600MPa. In particular, this paper presents the behavior of joints with the gusset plates welded in the longitudinal direction of the circular hollow section (CHS) when the joints are subjected to lateral force. Comparing design equations with the results of FEA and the test, existing design equations are underestimated to be 56~79% in the case of high-strength materials.

• Journal of Korean Society of Steel Construction
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• v.19 no.1
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• pp.117-127
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• 2007

In this study, we evaluate the strength of steel box beam-to-column connections subjected to axial loads in steel frame piers. The T-connection strength was reduced due to the column axial force in the two-story pier structure. To examine this phenomenon, non-linear FEM analysis was carried out and the analytical procedure was verified by comparing it with experimental results. To clarify the effect of the axial force and major design parameters in connection with strength, influence of panel zone width-thickness ratio, sectional area, and axial force was investigated using FEM analysis. Also, the theoretical strength equations were suggested by stress distribution of panel zone. The strength of the T-connection was compared with one of the one-story pier structure connections. As a result, the strength evaluation equations are proposed in consideration of the panel zone width-thickness ratio and sectional area ratio for the T-connections.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.31-38
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• 2015

In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.