• Journal of Adhesion and Interface
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• v.20 no.1
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• pp.23-28
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• 2019

In this study, the micro- and nano-particles were used and their shapes were transferred into the polydimethylsiloxane (PDMS) film to fabricate the dry adhesives and their properties were investigated. The Cu nanoparticles of the sizes of 20 nm, 40 nm and 70 nm and the polymethylmethacrylate (PMMA) beads of the size of $5{\mu}m$ were used to transfer their images and the resultant properties of the dry adhesives were compared. The effects of particle size and materials on the mechanical property, tensile adhesion strength, light transmittance, surface morphology, water contact angle were studied. The dry adhesives obtained from the transfer process of Cu nanoparticles with the size of 20 nm resulted in the enhancement of tensile adhesion strength more than 300% compared to that of the bare PDMS. The formation of nanostructure of large surface area on the surface of the PDMS film by the Cu nanoparticles may responsible for the improvement. This study suggests that the use of nanoparticles during the fabrication of PDMS dry adhesives is easy and effective and could be applied to the fabrication of the medical patch.

• Proceedings of the Korean Fiber Society Conference
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• 2002.04a
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• pp.293-296
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• 2002

소수성인 폴리올레핀계를 친수성화하여 고분자의 표면특성을 개량하거나 고분자 재료 표면에 새로운 기능을 부여하고자 하는 연구가 1970년대부터 계속되고 있다. 이러한 고분자의 표면 특성개질에 대한 연구는 보통 고분자의 도장성, 인쇄성, 접착성, 젖음성 들을 개선하기 위한 것이다. 그 중 재료의 표면층 만을 효율적으로 개질 시키는 저온 플라즈마 처리법은 낮은 기압에서 행하는 글로우 방전법과 대기압 부근에서 행하는 코로나 방전법으로 나눌 수 있으며, 특히 대기압하에서 코로나 방전을 이용한 표면개질법은 산업현장에서 연속적이면서 고속으로 처리할 수 있고 취급이 용이하다는 장점 때문에 표면개질에 있어서 현재 널리 사용되고 있는 방법중 하나이다[1]. (중략)

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1277-1282
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• 2008

Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1999.04a
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• pp.27-27
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• 1999

본 연구에서는 초음파 Immersion법을 이용하여 복합재 연소관내에 존재하는 결함을 검출하는 방법에 대하여 연구하였으며, 이를 위하여 FRP의 delamination, FRP-EPDM간의 미접착을 모사한 모의 결함 시편을 제작하여 시험하였다. 먼저 복합재료에 대한 초음파 시험방법을 최적화하기 위하여 가장 검출 감도가 좋은 탐촉자의 적용 주파수조건 및 물거리를 구하였으며, 이들 최적 조건으로 모의 결함 시편을 A, B, C-Scan하여 결함을 검출 분석하였다. 그리고 시험 자료를 바탕으로 데이터 값을 분석함으로써 복합재료에서의 음파 속도, 음향 임피던스, 반사율 및 투과율 등 복합재료의 초음파 특성을 산출하였으며, 동 시편에 대한 X-ray 필름을 촬영하여 그 결과를 초음파 시험 결과와 비교 분석하였다.

• Journal of the Korean Wood Science and Technology
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• v.35 no.3
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• pp.36-44
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• 2007

The purpose of this study was to investigate thermal stability, reactivity, and bonding strength of existing epoxy resin mixed with the epoxidized soybean oil (ESBO) in order to use soybean oil economically. In the dry shear test, the marked strengths showed $30.5kgf/cm^2$ at the ratio of ESBO to epoxy resin 9 : 1 and $6.2kgf/cm^2$ at the ratio 8 : 2. The bonding strengths of the others, except mixing ratios 2 : 8 and 1 : 9, exceeded the requirement of Korean plywood standard of $7.0kgf/cm^2$. In the wet shear test, the result was $5.8kgf/cm^2$ at the ratio 9 : 1. There were no thickness swelling and moisture absorption in the water resistance of the film. The value of activation energy, Tg (${\Delta}E$), by DSC analysis showed between $110^{\circ}C$ and $120^{\circ}C$ through all ratios. Epoxy in the epoxy resin fully reacted with the hardener (TETA), but it is difficult to decide that epoxys in the ESBO were reacted directly with the hardener from FT-IR analysis. As the mixing ratio of ESBO increased, the thermal stabilities dropped from TGA analysis. From the comprehensive view on the results of above experiments, it could be confirmed through experiments that the ESBO in the mixed adhesive of epoxy resin/ESBO played a role as an extending agent level of epoxy adhesive, and we were able to know that in order to utilize ESBO as an adhesive, a study should be performed on the condition of hardening, inducible of the hardening reaction.

• Journal of Adhesion and Interface
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• v.16 no.4
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• pp.146-151
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• 2015

Raw sap of essential oil in Korean Dendropanax lacquer was extracted with ethanol, and which was cured by using ROMP (ring opening metathesis polymerization, one of olefin metathesis). Curing behavior with subsequent film properties were studied and compared with conventional curing (under ambient conditions) and UV photo curing. The compositional changes of major ingredients in the lacquer before and after curing were studied by using GC-MS (gas chromatography mass spectrometry). ROMP-cured coating film showed higher gel contents (40%) as compared to those of conventional (8%) and UV curing (25%). ROMP curing with 2 wt% Grubbs' catalyst at $100^{\circ}C$ completed curing reaction within 2 h, which was much faster than that of conventional curing. The quality of coating film prepared with ROMP was more homogeneous and wrinkle-free as compared with that with UV curing. It was found that major ingredients of sesquiterpenes, such as ${\alpha}$-selinene, ${\beta}$-selinene, and ${\delta}$-cadinene were reacted in ROMP, as well as polyacetylenes.

• Journal of Adhesion and Interface
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• v.18 no.2
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• pp.59-67
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• 2017

Recently, integration of parts is accelerating according to the growth of the smart mobile industry. The integration of these parts causes problems of interference phenomena between the parts, and the importance of electromagnetic wave shielding technology to solve this problem is highlighted. Electromagnetic wave shielding technology is implemented so as to reflect or absorb electromagnetic waves, and generally conductive materials are utilized for electromagnetic wave shielding. Transparent shielding technology is required according to recent industrial changes. In this research, we propose transparent the shielding film using imprint technology with conductive composite binder. Utilizing UV polymerized acrylic binder to produce a conductive composite binder. Spherical, plate and stacked silver particles were used for conductivity. The changes of the curing characteristics, conductivity and adhesion were observed according to the structural characteristics of the silver particles. The use of spherical particles was the most efficient in the curing process, and an additional curing system was required to complement the UV-shadowing structure. In the conductivity evaluation, the stacked structure showed excellent characteristics. The adhesion of spherical system was the best. It is evaluated as a result of irregularities on the surface. Ultimately, the patterned film using this showed excellent transparency characteristics.

• Journal of Adhesion and Interface
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• v.20 no.1
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• pp.1-8
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• 2019

Fabrication of monolayer is important method for enhancing physical and chemical characteristics such as light shielding and antireflection while maintaining thin film properties. In previous studies, monolayers were fabricated by various methods on small substrates, but processes were complicated and difficult to form monolayers with large area. We used rod coating equipment with a small amount of coating liquid to form a HCP (hexagonal closed packing) coating of PMMA beads on PET(poly(ethylene terephthalate)) substrate with $20cm{\times}20cm$ size. We observed that changes in morphologies of monolayers by using the solvents with different boiling points and vapor pressures, by adapting surfactants on particles and by applying plasma treatment on substrates. The coverage was increased by 20% by optimizing the coating conditions including meniscus of beads, control of the attraction - repulsion forces and surface energy. This result can potentially be applied to optical films and sensors because it is possible to make a uniform and large-scale monolayer in a simple and rapid manner when it is compared to the methods in previous studies.

• Composites Research
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• v.37 no.3
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• pp.219-225
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• 2024

It is essential to develop a light-weight, high-performance structure for the deployable reflector antenna, which is the payload of a reconnaissance satellite, considering launch and orbital operation performance. Among them, the composite main reflector is a key component that constitutes a deployable reflector antenna. In particular, the development of a high-performance main reflector is required to acquire high-quality satellite images after agile attitude control maneuvers during satellite missions. To develop main reflector, the initial design of the main reflector was confirmed considering the structural performance according to the laminate stacking design and material properties of the composite main reflector that constitutes the deployable reflector antenna. Based on the initial design, four types of composite main reflectors were manufactured with the variable for manufacturing process. As variables for manufacturing process, the curing process of the composite structure, the application of adhesive film between the carbon fiber composite sheet and the honeycomb core, and the venting path inside the sandwich composite were selected. After manufacture main reflector, weight measurement, non-destructive testing(NDT), surface error measurement, and modal test were performed on the four types of main reflectors produced. By selecting a manufacturing process that does not apply adhesive film and includes venting path, for a composite main reflector with light weight and structural performance, we developed and verified a main reflector that can be applied to the SAR(Synthetic Aperture Rader) satellite.

• Korean Chemical Engineering Research
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• v.43 no.4
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• pp.495-502
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• 2005

Copper was plated on the tungsten substrate by use of a direct copper electroless plating. The optimum deposition conditions were found to be with a concentration of $CuSO_4$ 7.615 g/L, EDTA of 10.258 g/L, and glyoxylic acid of 7 g/L, respectively. The solution temperature was maintained at $60^{\circ}C$. The pH was varied from 11.0 to 12.8. After the deposition, the properties of the copper film were investigated with X-ray diffractometer (XRD), Field emission secondary electron microscope (FESEM), Atomic force microscope (AFM), X-ray photoelectron spectroscope (XPS), and Rutherford backscattering spectroscope (RBS). The best deposition condition was founded to be the solution pH of 11.8. In the case of 10 min deposition at the pH of 11.8, the grain shape was spherical, Cu phase was pure without impurity peak ($Cu_2O$ peak), and the surface root mean square roughness was about 11 nm. The thickness of the film turned out to be 140 nm after deposition for 12 min and the deposition rate was found to be about 12 nm/min. Increase in pH induced a formation of $Cu_2O$ phase with a long rectangular grain shape. The pH control seems to play an important role for the orientation of Cu in electroless deposition. The deposited copper concentration was 99 atomic percent according to RBS. The resulting Cu/W film yielded a good adhesive strength, because Cu/W alloy forms during electroless deposition.