• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.2
• /
• pp.245-253
• /
• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Korean Journal of Fisheries and Aquatic Sciences
• /
• v.14 no.2
• /
• pp.103-115
• /
• 1981

The cathodic reactions of lead anodic films formed in phosphoric acid, oxalic acid and sodium hydroxide solutions and the reactivities of Di-iso-butylnitrosoamine (DBNA) in sea water at $15\sim30^{\circ}C$ were studied by means of constant current-potential method. Besides, various contants and thermodynamic quantities obtained in the experiment were also do-scribed to explain the reactivities of protons that entered in the anodic film by being transferred across the metal-oxide interface. The electrode reactions of lead anodic film formed in sodium hydroxide solution in 60mM DBNA+0.5M NaCl did not occur because of complete insulator formed on anodic film. The values of $(\partial\triangle E_{H^+}/\partial T)_{i=const}$, estimated with Bead anodic films formed in phosphoric acid in 60mM DBNA+0.5M NaCl and 60mM $DBNA+6\%_{\circ}$ sea water were $-0.006\;V/^{\circ}C\;and\;-0.005\;V/^{\circ}C$, thus being nearly coincided, but the values of $(\partial E_o/\partial T)_{i=o}$ were $0.002\;V/^{\circ}C\;and\;-0.002\;V/^{\circ}C$, being completely inversed.

• Journal of Adhesion and Interface
• /
• v.21 no.3
• /
• pp.107-112
• /
• 2020

Recently, the atomically thin transition-metal dichalcogenide (TMD) semiconductors have attracted much attention owing to their remarkable properties such as tunable bandgap with high carrier mobility, flexibility, transparency, etc. However, because these TMD materials have a significant drawback that they are easily degraded in an ambient environment, various attempts have been made to improve chemical stability. In this research article, I report a method to improve the air stability of WSe₂ one of the TMD materials via surface passivation with an h-BN insulator, and its application to field-effect transistors (FETs). With a modified hot pick-up transfer technique, a vertical heterostructure of h-BN/WSe₂ was successfully made, and then the structure was used to fabricate the top-gate bottom-contact FETs. The fabricated WSe₂-based FET exhibited not only excellent air stability, but also high hole mobility of 150 ㎠/Vs at room temperature, on/off current ratios up to 3×10⁶, and 192 mV/decade of subthreshold swing.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.41 no.7
• /
• pp.665-671
• /
• 2017

The alkali-Metal Thermal-to-electric Converter (AMTEC) is one of the promising static energy conversion technologies for the direct conversion of thermal energy to electrical energy. The advantages over a conventional energy converter are its high theoretical conversion efficiency of 40% and power density of 500 W/kg. The working principle of an AMTEC battery is the electrochemical reaction of the sodium through an ion conducting electrolyte. Sodium ion pass through the hot side of the beta"-alumina solid electrolyte (BASE) primarily as a result of the pressure difference. This pressure difference across the BASE has a significant effect on the overall performance of the AMTEC system. In order to build the high pressure difference across the BASE, hermeticity is required for each joined components for high temperature range of $900^{\circ}C$. The AMTEC battery was manufactured by utilizing robust joining technology of BASE/insulator/metal flange interfaces of the system for both structural and electrical stability. The electrical potential difference between the anode and cathode sides, where the electrons emitted from sodium ionization and recombined into sodium, was characterized as the open-circuit voltage. The efforts of technological improvement were concentrated on a high-power output and conversion efficiency. This paper discusses about the joining and performance of the AMTEC systems.

• Journal of the Korean Society for Railway
• /
• v.12 no.3
• /
• pp.405-411
• /
• 2009

Railway signaling system in a rapid transit using the ATC system the approved a speed limit to a train and a part of signaling system in a metro approved a distance which is possible to move. Referring to the way of transmitting train control information, there are the one transmitting it to the on-board system of a train using the direct track, the another transmitting it establishing an instrument, and the other transmitting an instrument by a railway track. The one is the method using the direct track as a conductor for composing the part of the track and attaining the information controlling a train by transmitting a signal to the track. It is used for the high-speed railway and the subway. The method using the track attains information by transmitting it to returned information, and the on-board system of a train attains it by magnetic coupling. Because many reinforcing bars on the concrete slab track are used, interaction between a rail and a reinforcing bar that is not produced on ballast track is made. Due to the interaction, the electric characteristic of rail is changed. In the current paper, we numerically computed the coupling coefficient between the rail and the reinforcing bar based on the concrete slab track throughout the model related to the rail and the reinforcing bar using the concrete slab track that is used in the second interval of the Gyeongbu high-speed railway, and we defined the coupling coefficient not changed in the electric characteristic of rail in the condition that there is no interaction between the rail and the reinforcing bar.

• Fire Science and Engineering
• /
• v.25 no.6
• /
• pp.83-88
• /
• 2011

This study presented the structure and characteristics of vinyl cords used for wiring electric equipment and appliances and analyzed the photographs of damaged flat-type vinyl cords (VFF, $1.25mm^2$) and the metallic cross-sectional structure of melted conductors. Normal VFFs were made by twisting several strands together and the surface of the conductor was red brown. In addition, from the analysis of the metallic structure of the conductor, it was found that its grains had been elongated. The surface of a VFF damaged by normal flame showed no sheen with carbonized insulation material fused on the conductor surface. In addition, from the analysis of the cross-sectional structure of the melted area, it was found that voids of a certain shape were formed on it but that the cord's own elongation structure could not be checked. The cross-sectional analysis of the melted conductor damaged by the external flame applied to a VFF to which electric current was being applied showed no elongation structure for each cord, and revealed that irregular voids and a columnar structure had grown. The surface of the VFF damaged by overcurrent was uniformly carbonized and the cross-sectional structure analysis of the melted conductor revealed that the dendritic structure had grown. The analysis of the characteristics of the VFF melted by short-circuit showed that even though some part of the surface was contaminated, it showed little sheen and that the area rebounded by melting was round in shape. In addition, the cross-sectional structure analysis using a metallurgical microscope showed the boundary surface and columnar structure and revealed an amorphous structure like normal copper at areas other than the melted conductor.

• KSCE Journal of Civil and Environmental Engineering Research
• /
• v.32 no.3C
• /
• pp.95-104
• /
• 2012

Due to current interest in creation of urban space and urban landscape, more emphasis has been placed on underground space development. With increasing number of underground power cables and its importance, a study of backfill materials for pipe is now imperative. Backfill materials require outstanding thermal characteristics since breakdown of cable insulation can be caused if heat generated from transmission of underground power cables had not been effectively discharged through backfill materials. Also, coal ash, which are industrial by-products, is being produced in high volume every year. Among them, ponded ash (PA) is not recycled and instead, mostly buried. Therefore in this study, thermal conductivity test based on mixture ratio (PA, ponded ash : FA, fly ash) was performed to evaluate the thermal conductivity characteristics of CLSM (controlled low strength materials) with coal ash. The results indicate that the mixture ratio (PA, ponded ash : FA, fly ash) of 80:20, water contents of 28~30%, and cement contents of 7-11% showed the highest conductivity at 0.796~0.884W/mK and thus, considered optimal in terms of recycling ponded ash (PA) as well as for maximizing utilization as backfill materials for pipe in underground.

• Journal of Korean Tunnelling and Underground Space Association
• /
• v.19 no.2
• /
• pp.121-141
• /
• 2017

The thermal analysis of an underground power conduit for electrical cables is essential to determine their current capacity with an increasing number of demands for high-voltage underground cables. The temperature rises around a buried cable, caused by excessive heat dissipation, may increase considerably the thermal resistance of the cables, leading to the danger of "thermal runaway" or damaging to insulators. It is a key design factor to develop the mechanism on thermal behavior of backfilling materials for underground power conduits. With a full-scale field test, a numerical model was developed to estimate the temperature change as well as the thermal resistance existing between an underground power conduit and backfill materials. In comparison with the field test, the numerical model for analyzing thermal behavior depending on density, moisture content and soil constituents is verified by the one-year-long field measurement.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.1
• /
• pp.33-39
• /
• 2010

Printing technologies have been indicated as alternative methods for patterning conductive, semi-conductive or insulative materials on account of their low-cost, large-area patternability and pattern flexibility. For application of the printing technologies in manufacture of semiconductor or display modules, ink or paste composed of nanoparticles, solvent and additives are basically needed. Here, we report recent advances in eco-friendly nano-ink technology for semiconductor and display technology. Then, we will introduce an eco-friendly ink formation technology developed in our group with an example of manufacturing $SiO_2$ nanopowders and inks. We tried to manufacture ultrafine $SiO_2$ nanoparticles by applying a low-temperature synthetic method, and then attempted to fabricate the printed $SiO_2$ film onto the glass substrate to see whether the $SiO_2$ nanoparticles are feasible for the printing or not. Finally, the electrical characteristics of the films were measured to investigate the effect of the manufacturing parameters.

• Journal of Sensor Science and Technology
• /
• v.8 no.3
• /
• pp.239-246
• /
• 1999

A highly sensitive photovoltaic infrared photodiode was fabricated for detecting infrared light in $3{\sim}5\;{\mu}m$ wavelength range on InSb wafer with p-i-n structure grown by MOCVD. Silicon dioxide($SiO_2$) insulating films for the junction interface and surface of photodiode were prepared using RPCVD because InSb has low melting point and evaporation temperature. After formation of In ohmic contacts by thermal evaporation, the electrical properties of the photodiode were characterized in dark state at 77K. A product of zero-bias resistance and area($R_0A$) showed $1.56{\times}10^6\;{\Omega}{\cdot}cm^2$ that satisfied BLIP(background limited infrared photodetector) condition. When the photodiode was tested under infrared light, the normalized detectivity of about $10^{11}\;cm{\cdot}Hz^{1/2}{\cdot}W^{-1}$ was obtained. we successfully fabricated a unit cell with InSb IR array with good quantum efficiency and high detectivity.