• Journal of Conservation Science
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• v.18 s.18
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• pp.5-18
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• 2006

Dujeong-dong site of Cheonan is known as the site of Baekje period in the first half of the fourth century. This study investigated the visible properties and the chemical composition of the 18 pieces of the glass found in the site, and considered scientific properties and periodic interrelationship of the glass on the basis of the analysis result. The observation of the visible properties and microstructure of ancient glass was performed with both an electron microscope and an optical microscope, and the chemical composition was conducted by way of both quantitative and qualitative analysis using Scanning Electron Microscope(SEM) with Energy Dispersive Spectrometer(EDS). In the analysis result, various chemical composition systems are identified in the glass beads of Dujeong-dong site, such as lead-barium, soda and potash glass, and also different shapes were found such as gold foil glass beads, tubular beads, and round beads. It is estimated that the classification of glass by means of its chemical composition was also closely related to the color of glass.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2004.04a
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• pp.371-377
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• 2004

In an effort to simplify, standardize, and make effective use of information on arrival／departure through electronic means developed up to now, this paper suggests ebXML based Global Port B2B Framework, which makes it possible not only to realize e-commerce transactions between ports, but also simultaneously realize standardization and integration. In addition, due to its reusability of information, various reports are to be simplified and automated

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.1
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• pp.33-40
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• 1992

Several etching phenomena were observed and analyzed in diaphragm process performed on 4-inch (100) Si wafers for sensor application. In case of deep etching to above 300$\mu$m depth, the etch-defects appeared at etched surface could be classified into three categories such as hillocks, reaction products, and white residues. It was known that the hillock had a pyramidal shape or trapizoidal hexahedron structure depending on the density and size of the reaction products. The IR spectra showed that the white residue, which was due to the local over-saturation of Si dissolved in solution, was mostly Si-N-O compounds mixed with a small amount of H and C etc. Also, the difference in both the existence of etch-defects and etch rate distribution over a whole wafer was investigated when the etched surfaces were downward, upward horizontally and erective in etching solutions. The obtained data were analyzed through flow pattern in the etching bath. As the results, the downward and erective postures were favorable in the etch rate uniformity and the etch-defect removal, respectively.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.5
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• pp.114-124
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• 2014

HEVC is a state-of-the-art video coding standard developed by JCT-VC. HEVC provides about 2 times higher subjective coding efficiency than H.264/AVC. One of the main goal of HEVC development is to efficiently coding UHD resolution video so that HEVC is expected to be widely used for coding UHD resolution video. Decoding such high resolution video generates a large number of memory accesses, so a decoding system needs high-bandwidth for memory system and/or internal communication architecture. In order to determine such requirements, this paper presents an analysis of the memory access complexity for HEVC decoder. we first estimate the amount of memory access performed by software HEVC decoder on an embedded system and a desktop computer. Then, we present the memory bandwidth models for HEVC decoder by analyzing the data flow of HEVC decoding tools. Experimental results show the software decoder produce 6.9-40.5 GB/s of DRAM accesses. also, the analysis reveals the hardware decoder requires 2.4 GB/s of DRAM bandwidth.

• Journal of IKEEE
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• v.12 no.2
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• pp.110-117
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• 2008

This paper presents a new Insulated Gate Bipolar Transistor(IGBT) based on Non Punch Through(NPT) IGBT structure for power switching device. The proposed structure has adding N+ beside the P-base region of the conventional IGBT structure. The added n+ diffusion of the proposed device ensure device has faster turn-off time and lower forward conduction loss than the conventional IGBT structure. But, added n+ region can reduce th breakdown voltage and latching current density of the proposed device due to its high doping concentration. This problems can be overcome by using diverter on the right side of the device. In the simulation results, turn-off time of the proposed device is 0.3us and the on-state voltage drop is 3V. The results show that the proposed device has superior characteristic than conventional structure.

• Journal of IKEEE
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• v.21 no.2
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• pp.123-129
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• 2017

Proton Exchange Membrane Fuel Cell (FEMFC) is a strong candidate for future automobile and power generation because of its high power density, low emission and low operation temperature. The major concerns of the gas diffusion layer (GDL) inside a FEMFC is water management. The GDL is typically comprised of carbon for electrical conductivity and PTFE for Hydrophobicity. In this simulation, GDL flooding was investigated using a simplified approach method of an established equation models(Fick' Law, Darcy, Law, Stefan-Maxwell diffusion). The performance of GDL was shown using result of the inner heat, water density and oxygen density of the cell using model equations. The catalyst layer mode in FEMFC showed results of effectiveness factor, Butler-volmer and hydrogen flux density. These results are interesting because the influence of several factors has been shown and the information will be helpful for fuel cell design.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.27-31
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• 2015

Thermal management becomes a key technology as the power density of high performance and high density devices increases. Conventional heat sink or TIM methods will be limited to resolve thermal problems of next-generation IC devices. Recently, to increase heat flux through high powered IC devices liquid cooling system has been actively studied. In this study a chip-level liquid cooling system with TSV and microchannel was fabricated on Si wafer using DRIE process and analyzed the cooling characteristics. Three different TSV shapes were fabricated and the effect of TSV shapes was analyzed. The shape of liquid flowing through microchannel was observed by fluorescence microscope. The temperature differential of liquid cooling system was measured by IR microscope from RT to $300^{\circ}C$.

• The Journal of the Korea institute of electronic communication sciences
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• v.5 no.6
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• pp.602-612
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• 2010

In this paper, we propose an object-oriented modeling technique using UML(Unified Modeling Language) for accessibility of user and efficiency of facilities under Web-based integrated manufacturing management system application. For this, we first collect user requirements and related technology of integrated manufacturing system, and then design proposed system considering business flow and various essential design part(class, component, package, use case, and etc) to reduce system risk as well as communicate peacefully between developers in system redevelopments. Additionally, we develop database of manufacturing master code, check management, repair management and error management for proposed systems. Finally, we design and implement our three main modules; manufacturing check module, manufacturing repair module, manufacturing error module under Web-based environments with JSP language.

• The Journal of Information Technology
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• v.3 no.2
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• pp.97-113
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• 2000

Recently, the electronic commerce(EC), driven by the development of Internet, has been one of the most important interests. Physical distribution in EC is one of the most important factors. Logistics will be one of the most important industries in the 21st century. Logistics, especially in related to EC presents enormous potential opportunities for logistics Companies. However, logistics companies in Korea still don't have international competitive and effective strategies for customer in compare with leading international logistics companies. So it is needed to study development strategies of logistics companies in Korea against leading international logistics companies. Logistics companies in Korea is able to learn from practical experience of logistics companies in developed country by benchmarking studies. It is three development strategies in order to develop Logistics Companies in Korea. $\circled1$ development of sophisticated logistics service product $\circled2$ reinforcement and enlargement of diverse added service $\circled3$ construction of international logistics network

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.12
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• pp.234-241
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• 2012

This paper proposes a novel design methodology considering transistor layout variation. The proposed design technique is to improve the transistor's electrical characteristics without performing a circuit simulation to extract transistor layout variation. There are three advantages in the proposed method. Firstly, there is no need to change the normal design flow used in layout designs. Secondly, there is no need to perform simulation in order to extract the transistor layout variation. Thirdly, early warnings in layout design lead to decreasing the number of post layout simulations. Less post layout simulations will decrease the number of iterations in the design cycle and shorten design period. The number of bad transistors in the early design phase were reduced from 17.8% to 2.9% by applying eDRC environment for layout designers to develop Standard Cell Library.