• Title/Summary/Keyword: 전자스페클패턴 간섭시스템

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A Study on the Strain Analysis of Plane by Electronic Speckle Pattern Interferometry(ESPI) (전자처리스페클패턴간섭법에 의한 평판의 Strain 해석에 관한 연구)

  • Kim, Koung-Suk;Choi, Hyoung-Chul;Yang, Seung-Pil;Kim, Hyoung-Soo;Chung, Jae-Kang;Kim, Dong-Hyun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.14 no.2
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    • pp.101-111
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    • 1994
  • Electronic speckle pattern interferometry(ESPI) using a CW laser, a video system and an image processor were applied to the in-plane displacement measurements. Unlike traditional strain gauges or Moire method, ESPI method requires no special surface preparation or attachments and it can be measured in-plane displacement without any contact and real time. In this experiment, specimen was loaded in paralled with a loa cell. The specimen was plance to which strain gauges was attached. The study provides an example of how ESPI have been used to measure displacement and strain distribution in this specimen. The results measured by ESPI were compared with the data which were measured by strain gauge method in tensile testing.

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A Study on the Measurement of Elastic-Plastic Zone at the Crack Tip under Cyclic Loading using ESPI System. (전자스페클 간섭시스템을 이용한 피로하중을 받는 균열선단에서 탄소성 영역 측정에 관한 연구)

  • Kim, Kyung-Su;Shin, Byung-Chun;Shim, Chun-Sik;Park, Jin-Young
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2002.05a
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    • pp.140-144
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    • 2002
  • In this paper, the plastic zone size ahead of the crack tip of DENT specimen and the crack growth length under cyclic loading were measured by ESPI system. These results of the plastic zone size measured by ESPI system were compared with the plastic zone size proposed by Irwin. The results of tile crack growth length measured by it were also compared with them measured by the image analysis system. It is confirmed that it is possible to measure the plastic zone and crack growth length.

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Non-destructive Inspection of Semiconductor Package by Laser Speckle Interferometry (레이저 스페클 간섭법을 이용한 반도체 패키지의 비파괴검사)

  • Kim, Koung-Suk;Yang, Kwang-Young;Kang, Ki-Soo;Choi, Jung-Gu;Lee, Hang-Seo
    • Journal of the Korean Society for Nondestructive Testing
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    • v.25 no.2
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    • pp.81-86
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    • 2005
  • This paper proposes a non-destructive ESPI technique to quantitatively evaluate defects inside a semiconductor package. The inspection system consists of the ESPI system, a thermal loading system and an adiabatic chamber. The technique is high feasibility for non-destructive testing of a semiconductor and overcomes the weaknesses of previous techniques, such as time-consumption and difficult quantitative evaluation. Most defects are classified as delamination defects, resulting from the insufficient adhesive strength between layers and from non-homogeneous heat spread. Ninety percent of the tested samples had delamination defects which originated at the corner of the chip and nay be related to heat spread design.

The Development of In-Plane Displacement Measurement System on Laser Speckle Interferometry (레이저 스페클 간섭법을 이용한 면내변위 측정시스템 개발)

  • Yoon H.S.;Kim K.S.;Park C.J.;Choi T.H.;Choi J.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.556-560
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    • 2005
  • The measurement method by Laser Speckle Interferometry which uses the interference law which will grow precedes and with it explains a resolution measurement ability and together the change of place arrowhead and general measurement, at real-time measurement sensitivity it has application boat song from candle precise measurement field it is increasing. But, currently the domestic application technique to sleeps and optical science military merit by optical science interferometer and directness it composes purchases to the level which it applies the expensive commercial business equipment the outside and in spite of the technical ripple effect is deficient even in many strong point. The hazard which complements like this problem point form technical development it leads from the research which it sees and an application degree and to sleep as the measurement equipment which tries to develop the small-sized optical science interference sensor and an interpretation program it raises it does.

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Development Non-contact Laser Measuring System for Vibration Analysis of Structures (구조물의 진동 해석을 위한 비접촉 레이저 계측 시스템 개발)

  • 정현철;김경석;최정석;김성식;강기수;정승택;최태호
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.911-914
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    • 2003
  • The non-contact laser measurement system what can be used for the vibration analysis of structures is discussed. There are few systems using laser speckle interferometer for vibration analysis. One of these systems is the Electronic Speckle Pattern Interferometer (ESPI). With ESPI system, one can obtain the vibration mode shape qualitatively and the maximum vibration amplitude quantitatively of the structure at each resonance frequency. In this paper, the phase-shifting ESPI system with stroboscopic illumination for measuring vibration mode shapes is constructed and the operating software is programmed. The results are compared with that of commercial ESPI system.

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