• Journal of the Institute of Electronics Engineers of Korea CI
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• v.48 no.1
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• pp.90-100
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• 2011

We present a parallel bi-conjugate gradient (Bi-CG) matrix solver for large scale Bio-FET simulations based on recent graphics processing units (GPUs) which can realize a large-scale parallel processing with very low cost. The proposed method is focused on solving the Poisson equation in a parallel way, which requires massive computational resources in not only semiconductor simulation, but also other various fields including computational fluid dynamics and heat transfer simulations. As a result, our solver is around 30 times faster than those with traditional methods based on single core CPU systems in solving the Possion equation in a 3D FDM (Finite Difference Method) scheme. The proposed method is implemented and tested based on NVIDIA's CUDA (Compute Unified Device Architecture) environment which enables general purpose parallel processing in GPUs. Unlike other similar GPU-based approaches which apply usually 32-bit single-precision floating point arithmetics, we use 64-bit double-precision operations for better convergence. Applications on the CUDA platform are rather easy to implement but very hard to get optimized performances. In this regard, we also discuss the optimization strategy of the proposed method.

• 전자공학회논문지 IE
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• v.49 no.1
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• pp.18-23
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• 2012

In this paper, a potable device application for DC-DC converter was designed for voltage protection circuit. Voltage protection circuit to offer the under voltage lock out and over voltage protection consists of a comparator and bais circuits were implemented using. XFAB 1um CMOS process, SPICE simulations was confirmed through the characteristics. Simulation results, under voltage lock out input voltage is 4.8 V higher when the turn-on and, 4.2 V less when turn-off. When the input voltage is low voltage is applied can be used to prevent malfunction of the circuit. Over voltage protection is 3.8 V reference voltage when the output voltage caused by blocking circuit prevents device destruction can be used to improve the stability and reliability. The virtual control circuits of the DC-DC converter connected. According to the results of the abnormal voltage, voltage protection circuit behavior was confirmed. The proposed voltage protection circuit of the DC-DC converter cell is useful are considered.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.5
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• pp.8-14
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• 2007

In this paper, $HfO_2$/Hf stacked film has been applied as the gate dielectric in MOS devices. The $HfO_2$ thin film was deposited on p-type (100) silicon wafers by atomic layer deposition (ALD) using TEMAHf and $O_3$ as precursors. Prior to the deposition of the $HfO_2$ film, a thin Hf metal layer was deposited as an intermediate layer. Round-type MOS capacitors have been fabricated on Si substrates with 2000${\AA}$-thick Al or Pt top electrode. The prepared film showed the stoichiometric components. At the $HfO_2$/Si interface, both Hf-Si and Hf-Si-O bonds were observed, instead of Si-O bond. The sandwiched Hf metal layer suppressed the growing of $SiO_x$ layer so that $HfSi_xO_y$ layer was achieved. It seems that the intermediate Hf metal layer has a benefit for the enhancement of electric characteristics of gate dielectric in $HfO_2$/Si structure.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.45 no.5
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• pp.40-45
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• 2008

In this paper, a microstrip linear tapered slot antenna is designed. A tapered slot antenna(TSA) has many advantages such as low profile, low weight, easy fabrication, and compatibility with monolithic microwave integrated circuits(MMIC). In addition, it has demonstrated multi octave bandwidth, moderately high gain, and symmetrical E- and H-plane beam patterns. A feed network is implemented with transition between a microstrip and a slot line for the microstrip linear tapered slot antenna. The transition is consist of two sides. One side has a microstrip line, the other side has a slot line. The dimensions of the microstrip and slot line are ${\lambda}_m/4$ and ${\lambda}_s/4$ at the center of the cross section of the microstrip and slot line. In order to get broad bandwidth antenna characteristics, the tapered length is chosen as $4{\lambda}_o$ and termination width is chosen as $1.75{\lambda}_o$. Experimental results show that the microstrip tapered slot antenna has symmetrical E- and H-plane beam patterns with around 5GHz of bandwidth at center frequency of 5.0GHz.

• Journal of IKEEE
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• v.22 no.3
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• pp.842-845
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• 2018

In this paper, we propose low-power operational methods for thermal-energy-harvesting sensor circuits. Here, the amount of harvested current has been measured as low as 8uA. However the DC power consumption of the sensor circuit is known to consume much larger than 8uA. Thus, We propose the hardware-based power gating and software-based active/sleep timing control schemes, respectively, for controlling the power consumption of sensor circuit. In the hardware-based power gating scheme, if the ratio of Toff/Ton is larger than 22, the sensor can consume less than 8uA. For the software-based active/sleep control scheme, if the ratio of Tslp/Tact is larger than 3, we can suppress the current consumption below 8uA. The hardware-based and software-based schemes proposed in this paper would be helpful in various applications of energy-harvesting sensor circuits, where the power consumption is limited by an amount of harvested energy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.99-104
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• 2020

In this study, we fabricated a metamorphic high-electron-mobility transistor (mHEMT) device with a T-type gate structure for the implementation of W-band monolithic microwave integrated circuits (MMICs) and investigated its characteristics. To fabricate the mHEMT device, a recess process for etching of its Schottky layer was applied before gate metal deposition, and an e-beam lithography using a triple photoresist film for the T-gate structure was employed. We measured DC and RF characteristics of the fabricated device to verify the characteristics that can be used in W-band MMIC design. The mHEMT device exhibited DC characteristics such as a drain current density of 747 mA/mm, maximum transconductance of 1.354 S/mm, and pinch-off voltage of -0.42 V. Concerning the frequency characteristics, the device showed a cutoff frequency of 215 GHz and maximum oscillation frequency of 260 GHz, which provide sufficient performance for W-band MMIC design and fabrication. In addition, active and passive modeling was performed and its accuracy was evaluated by comparing the measured results. The developed mHEMT and device models could be used for the fabrication of W-band MMICs.

• The Transactions of the Korean Institute of Power Electronics
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• v.5 no.4
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• pp.358-369
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• 2000

Shielded metal arc welding machines with AC transformer have been widely used for thin-plate welding applications. Because of being bulky, heavy and of tap-changing property, so the SMAW's are changing to new power electronic circuits such as inverter circuit in order to reduce the system size and also to improve the welding performances at input output sides. The PWM inverter arc welding machine with diode rectifier has better output welding performances but it is has the plentiful harmonics and the lower input power factor. To solve these problems, input current-controlled scheme is considered for PWM inverter arc welding system, and then total input power factor is maintained to be more than 99%. Also a new combined control is proposed which can control both instantaeous welding output voltage and current under constant power condition, and as a result the variations of instantaneous current and voltage can be reduced to very narrow range in the V-I curve relationship, and hence the variance of welding current and voltage become so reduced. In addition the spatter generated during welding process is greatly reduced up to 70%. And the overall effiency can be improved up to 10%, which becomes higher when the load is lower.

• Journal of IKEEE
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• v.24 no.3
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• pp.901-908
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• 2020

This paper describes a method for scalable hardware implementation of modular inversion. The proposed scalable architecture has a one-dimensional array of processing elements (PEs) that perform arithmetic operations in 32-bit word, and its performance and hardware size can be adjusted depending on the number of PEs used. The hardware operation of the scalable processor for modular inversion was verified by implementing it on Spartan-6 FPGA device. As a result of logic synthesis with a 180-nm CMOS standard cells, the operating frequency was estimated to be in the range of 167 to 131 MHz and the gate counts were in the range of 60,000 to 91,000 gate equivalents when the number of PEs was in the range of 1 to 10. When calculating 256-bit modular inverse, the average performance was 18.7 to 118.2 Mbps, depending on the number of PEs in the range of 1 to 10. Since our scalable architecture for computing modular inversion in GF(p) has the trade-off relationship between performance and hardware complexity depending on the number of PEs used, it can be used to efficiently implement modular inversion processor optimized for performance and hardware complexity required by applications.

• Journal of the Korean Vacuum Society
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• v.7 no.1
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• pp.51-58
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• 1998

ZnS and TB-doped ZnS (ZnS:Tb) thin films were grown by traveling wave reactor atomic layer epitaxy (AKE) and characterized using materials and surface analysis techniques. $ZnCl_2$, $H_2$S,and tris(2,26,6-tetramethyl-3,5-heptandionato) terbium ($Tb(TMHD)_3$) were used as the precursors in the growth of ZnS:Tb films. The dependence of Cl content in ZnS films on growth temperature was investigated using Rutherford backscattering spectrometry. The Cl content decreased from approximately 9 at.% to 1 at. % as increasing the growth temperature from 400 to $500^{\circ}C$. The segregation of Cl in near surface region was also observed by depth profiling using Auger electron spectroscopy. Scanning electron microscopic studies showed that the ALE-grown ZnS and ZnS:Tb film during ALE process using $Tb(TMHD)_3$was also investigated. Approximately 1 at.% of O in ZnS:Tb(0.5 at.%) film which showed a good crystallinity of hexagonal 2H structure.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.83-83
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• 2012

금속 실리사이드는 낮은 비저항, 실리콘과의 좋은 호환성 등으로 배선 contact 물질로 널리 연구되고 있다. 특히 $CoSi_2$는 선폭의 축소와 관계없이 일정하고 낮은 비저항과 열적 안정성이 우수한 특성 등으로 배선 contact 물질로 활발히 연구되고 있다. 금속 실리사이드를 실리콘 평면기판에 형성시키는 방법으로는 열처리를 통한 금속박막과 실리콘 기판 사이에 확산작용을 이용한 SALICIDE (self-algined silicide) 기술이 대표적이며 CoSi2도 이와 같은 방법으로 형성할 수 있다. Co 박막을 증착하는 방법에는 물리적 기상증착법 (PVD)과 유기금속 화학 증착법 등이 보고되어있지만 최근 급격하게 진행 중인 소자구조의 나노화 및 고 단차화에 따라 기존의 증착 기술은 낮은 단차 피복성으로 인하여 한계에 부딪힐 것으로 예상되고 있다. ALD(atomic layer deposition)는 뛰어난 단차 피복성을 가지고 원자단위 두께조절이 용이하여 나노 영역에서의 증착 방법으로 지대한 관심을 받고 있다. 앞선 연구에서 본 연구진은 CoCp2 전구체과 $NH_3$ plasma를 사용하여 Plasma enhanced ALD (PE-ALD)를 이용한 고 순도 저 저항 Co 박막 증착 공정을 개발 하고 이를 SALICIDE 공정에 적용하여 $CoSi_2$ 형성 연구를 보고한 바 있다. 하지만 이 연구에서 PE-ALD Co 박막은 플라즈마 고유의 성질로 인하여 단차 피복성의 한계를 보였다. 이번 연구에서 본 연구진은 Co(AMD)2 전구체와 $NH_3$, $H_2$, $NH_3$ plasma를 반응 기체로 사용하여 Thermal ALD(Th-ALD) Co 및 PE-ALD Co 박막을 증착 하였다. 고 단차 Co 박막의 증착을 위하여 Th-ALD 공정에 초점을 맞추어 Co 박막의 특성을 분석하였으며, Th-ALD 및 PE-ALD 공정으로 증착된 Co 박막의 단차를 비교하였다. 연구 결과 Th-ALD Co 박막은 95% 이상의 높은 단차 피복성을 가져 PE-ALD Co 박막의 단차 피복성에 비해 크게 향상되었음을 확인하였다. 추가적으로, Th-ALD Co 박막에 고 단차 박막의 증착이 가능한 Th-ALD Ru을 capping layer로 이용하여 CoSi2 형성을 확인하였고, 기존의 PVD Ti capping layer와 비교하였다. 이번 연구에서 Co 박막 및 $CoSi_2$ 의 특성 분석을 위하여 X선 반사율 분석법 (XRR), X선 광전자 분광법 (XPS), X선 회절 분석법 (XRD), 주사 전자 현미경 (SEM), 주사 투과 전자 현미경 (STEM) 등을 사용하였다.