• Proceedings of the KSME Conference
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• 2004.11a
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• pp.285-290
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• 2004

Low cycle fatigue tests are performed on the Inconel 617 that be used for a hot gas casing. The relation between strain energy density and numbers of cycles to failure is examined in order to predict the low cycle fatigue life of Inconel 617. The life predicted by the strain energy method is found to coincide with experimental data and results obtained from the Coffin-Manson method. Also the cyclic behavior of Inconel 617 is characterized by cyclic hardening with increasing number of cycle at room temperature.

• Composites Research
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• v.31 no.6
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• pp.332-339
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• 2018

Fiber metal hybrid laminate (FML) can be used as an economic material with superior mechanical properties and light weight than conventional metal by bonding of metal and FRP. However, there are disadvantages that it is difficult to predict fracture behavior because of the large difference in properties depending on the type of fiber and lamination conditions. In this paper, we study the failure behavior of hybrid materials with laminated glass fiber reinforced plastics (GFRP, GEP118, woven type) in Al6061-T6 alloy. The Al alloys were coated with GFRP 1, 3, and 5 layers, and fracture behavior was analyzed by using a static test and a low cycle fatigue test. In the low cycle fatigue test, strain - life analysis and the total strain energy density method were used to analyze and predict the fatigue life. The Al alloy did not have tensile properties strengthening effect due to the GFRP coating. The fatigue hysteresis geometry followed the behavior of the Al alloy, the base material, regardless of the GFRP coating and number of coatings. As a result of the low cycle fatigue test, the fatigue strength was increased by the coating of GFRP, but it did not increase proportionally with the number of GFRP layers.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.9-17
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• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.