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Development of Embedded Type Sensor Module for Measuring Stress of Concrete Using Hetero-core Optical Fiber (헤테로코어 광섬유를 이용한 콘크리트 응력 측정용 매립형 센서모듈의 개발)

  • Yang, Hee-Won;Lee, Hwan-Woo
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.26 no.2
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    • pp.68-75
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    • 2022
  • In this study, in order to directly evaluate the prestress of the PSC structure, a new sensor module based on the measurement of the deformation of concrete was proposed using hetero-core optical fibers and performance tests were performed. In a hetero-core optical fiber, optical loss occurs when a specific part of the transmission path is bent, and the amount of optical loss changes linearly according to the magnitude of the curvature. In order to confirm the measurement performance of the sensor module and the applicability of the optical fiber, the sensor module was deformed and the light passing through the optical fiber was converted into wattage and measured. It can be seen that the light passing through the optical fiber has a linearity of 0.9333 in relation to the deformation while generating the maximum deformation of 0.5 mm at a rate of 0.12 mm/min in a cylindrical concrete specimen with a diameter of 15 cm and a height of 35 cm in which the sensor module is embedded. Based on the results of this experiment, it is judged that it is possible to directly evaluate the prestress of a PSC structure by embedding a sensor module using a hetero-core optical fiber in the structure and measuring the compression deformation in concrete. It is judged that it can be used as useful data for the development of a sheath tube integrated sensor module to be applied to be applied to the girder model experiment.

A study on the correction of the connection part of the underground facility 3D model and the correction of irregularities (지하시설물 3차원 모델 연결부 보정 및 요철보정에 관한 연구)

  • Kim, Sung Su;Han, Kyu Won;Heo, Sung Seo;Han, Sang Hoon
    • Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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    • v.39 no.6
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    • pp.429-435
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    • 2021
  • The integrated underground space map shows the underground facility(water supply, sewage, gas, electric power, communication, heating), underground structures (subway, underpass, underground walkway, underground parking lot, underground shopping mall, common ward), ground(drilling, coffin, geology) refers to a map constructed so that a total of 15 types of underground information can be checked at a glance on a three-dimensional basis. The purpose of this study is to develop a technology to correct the problem of curved surface processing and the unevenness of underground facility pipelines that occur in converting 2D underground facility data into 3D-based underground space integrated map(3D underground facility model). do it with. To this end, we first investigated and reviewed the domestic and foreign status of technologies that generate data on underground facilities based on three dimensions, and developed a surface correction algorithm and an unevenness correction algorithm to solve practical problems. Algorithms to verify the developed algorithm This applied correction program was developed. Based on the above process, the three-dimensional model of the underground facility could be produced identically to reality. This study is judged to have significance as a basic study to improve the utilization of the underground spatial integration map.

Design of DVB-T/H SiP using IC-embedded PCB Process (IC-임베디드 PCB 공정을 사용한 DVB-T/H SiP 설계)

  • Lee, Tae-Heon;Lee, Jang-Hoon;Yoon, Young-Min;Choi, Seog-Moon;Kim, Chang-Gyun;Song, In-Chae;Kim, Boo-Gyoun;Wee, Jae-Kyung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.9
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    • pp.14-23
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    • 2010
  • This paper reports the fabrication of a DVB-T/H System in Package (SiP) that is able to receive and process the DVB-T/H signal. The DVB-T/H is the European telecommunication standard for Digital Video Broadcasting (DVB). An IC-embedded Printed Circuit Board (PCB) process, interpose a chip between PCB layers, has applied to the DVB-T/H SiP. The chip inserted in DVB-T/H SiP is the System on Chip (SoC) for mobile TV. It is comprised of a RF block for DVB-T/H RF signal and a digital block to convert received signal to digital signal for an application processor. To operate the DVB-T/H IC, a 3MHz DC-DC converter and LDO are on the DVB-T/H SiP. And a 38.4MHz crystal is used as a clock source. The fabricated DVB-T/H SiP form 4 layers which size is $8mm{\times}8mm$. The DVB-T/H IC is located between 2nd and 3rd layer. According to the result of simulation, the RF signal sensitivity is improved since the layout modification of the ground plane and via. And we confirmed the adjustment of LC value on power transmission is necessary to turn down the noise level in a SiP. Although the size of a DVB-T/H SiP is decreased over 70% than reference module, the power consumption and efficiency is on a par with reference module. The average power consumption is 297mW and the efficiency is 87%. But, the RF signal sensitivity is declined by average 3.8dB. This is caused by the decrease of the RF signal sensitivity which is 2.8dB, because of the noise from the DC-DC converter.

Real-Time 3D Ultrasound Imaging Method Using a Cross Array Based on Synthetic Aperture Focusing: II. Linear Wave Front Transmission Approach (합성구경 기반의 교차어레이를 이용한 실시간 3차원 초음파 영상화 기법 : II. 선형파면 송신 방법)

  • 김강식;송태경
    • Journal of Biomedical Engineering Research
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    • v.25 no.5
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    • pp.403-414
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    • 2004
  • In the accompanying paper, we proposed a real. time volumetric imaging method using a cross array based on receive dynamic focusing and synthetic aperture focusing along lateral and elevational directions, respetively. But synthetic aperture methods using spherical waves are subject to beam spreading with increasing depth due to the wave diffraction phenomenon. Moreover, since the proposed method uses only one element for each transmission, it has a limited transmit power. To overcome these limitations, we propose a new real. time volumetric imaging method using cross arrays based on synthetic aperture technique with linear wave fronts. In the proposed method, linear wave fronts having different angles on the horizontal plane is transmitted successively from all transmit array elements. On receive, by employing the conventional dynamic focusing and synthetic aperture methods along lateral and elevational directions, respectively, ultrasound waves can be focused effectively at all imaging points. Mathematical analysis and computer simulation results show that the proposed method can provide uniform elevational resolution over a large depth of field. Especially, since the new method can construct a volume image with a limited number of transmit receive events using a full transmit aperture, it is suitable for real-time 3D imaging with high transmit power and volume rate.

Three-dimensional Model Generation for Active Shape Model Algorithm (능동모양모델 알고리듬을 위한 삼차원 모델생성 기법)

  • Lim, Seong-Jae;Jeong, Yong-Yeon;Ho, Yo-Sung
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.43 no.6 s.312
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    • pp.28-35
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    • 2006
  • Statistical models of shape variability based on active shape models (ASMs) have been successfully utilized to perform segmentation and recognition tasks in two-dimensional (2D) images. Three-dimensional (3D) model-based approaches are more promising than 2D approaches since they can bring in more realistic shape constraints for recognizing and delineating the object boundary. For 3D model-based approaches, however, building the 3D shape model from a training set of segmented instances of an object is a major challenge and currently it remains an open problem in building the 3D shape model, one essential step is to generate a point distribution model (PDM). Corresponding landmarks must be selected in all1 training shapes for generating PDM, and manual determination of landmark correspondences is very time-consuming, tedious, and error-prone. In this paper, we propose a novel automatic method for generating 3D statistical shape models. Given a set of training 3D shapes, we generate a 3D model by 1) building the mean shape fro]n the distance transform of the training shapes, 2) utilizing a tetrahedron method for automatically selecting landmarks on the mean shape, and 3) subsequently propagating these landmarks to each training shape via a distance labeling method. In this paper, we investigate the accuracy and compactness of the 3D model for the human liver built from 50 segmented individual CT data sets. The proposed method is very general without such assumptions and can be applied to other data sets.

The Trend Analysis of Propulsion System for Railway Vehicle Using Patent Analysis (특허분석을 통한 철도차량용 추진제어장치 기술 분석)

  • Han, Young-Jae;Lee, Su-Gil;Park, Chan-Kyoung;Kim, Young-Guk;Bae, Chang-Han
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.5
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    • pp.131-138
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    • 2018
  • In this study, we investigated the trend of technological development in major countries related to the propulsion equipment of railway vehicles. The propulsion system is the main equipment of electric vehicles. A lot of time and investment are required in order to ensure the development of technology. Therefore, developed countries have maximized their effort to develop technologies with safety, reliability, and convenience of maintenance. They have also done their utmost to prevent technology transfer to other countries after the development of new technologies. For example, Toshiba of Japan developed a new 3,300V/1,500 A class IGBT power device, but was reluctant to export it to foreign countries in order to protect this technology. In this study, we analyzed the patents applied for related to propulsion control systems and presented the direction of development during the technical development of these systems. The patent analysis of the core technologies was conducted using the Thomson Innovation DB. We examined the number of patents applied for by country, year and major applicant. As a result of the analysis, it was found that the proportion of patent applications per country was in the order of China, 48%, Europe 16.6%, and the United States 14.9%. The patent situation of the top 10 principal applicants revealed that (the top three were?) ABB 14%, GE 13%, and CRRC 12%. At the same time, we also conducted a qualitative analysis of the level of technical development by evaluating such factors as the influence index, quotation, market securing power and citation. Based on the result of the patent analysis, we presented the direction of technical development of the propulsion control equipment of railway vehicles. Based on the analysis results, it was found that domestic applicants considerably reduced their efforts to protect their patents from foreign companies. Nowadays, most of the electric motors used in Korea are induction motors. In advanced countries, permanent magnet electric motors are employed in new railway lines. Therefore, intensive investment is needed in new developments.

An Area-Efficient Time-Shared 10b DAC for AMOLED Column Driver IC Applications (AMOLED 컬럼 구동회로 응용을 위한 시분할 기법 기반의 면적 효율적인 10b DAC)

  • Kim, Won-Kang;An, Tai-Ji;Lee, Seung-Hoon
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.5
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    • pp.87-97
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    • 2016
  • This work proposes a time-shared 10b DAC based on a two-step resistor string to minimize the effective area of a DAC channel for driving each AMOLED display column. The proposed DAC shows a lower effective DAC area per unit column driver and a faster conversion speed than the conventional DACs by employing a time-shared DEMUX and a ROM-based two-step decoder of 6b and 4b in the first and second resistor string. In the second-stage 4b floating resistor string, a simple current source rather than a unity-gain buffer decreases the loading effect and chip area of a DAC channel and eliminates offset mismatch between channels caused by buffer amplifiers. The proposed 1-to-24 DEMUX enables a single DAC channel to drive 24 columns sequentially with a single-phase clock and a 5b binary counter. A 0.9pF sampling capacitor and a small-sized source follower in the input stage of each column-driving buffer amplifier decrease the effect due to channel charge injection and improve the output settling accuracy of the buffer amplifier while using the top-plate sampling scheme in the proposed DAC. The proposed DAC in a $0.18{\mu}m$ CMOS shows a signal settling time of 62.5ns during code transitions from '$000_{16}$' to '$3FF_{16}$'. The prototype DAC occupies a unit channel area of $0.058mm^2$ and an effective unit channel area of $0.002mm^2$ while consuming 6.08mW with analog and digital power supplies of 3.3V and 1.8V, respectively.

Spectral Response of $TiO_{2}$/Se : Te Heterojunction for Color Sensor (컬러센서를 위한 $TiO_{2}$/Se : Te 이종접합의 스펙트럼 응답)

  • Woo, Jung-Ok;Park, Wug-Dong;Kim, Ki-Wan;Lee, Wu-Il
    • Journal of Sensor Science and Technology
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    • v.2 no.1
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    • pp.101-108
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    • 1993
  • $TiO_{2}$/Se : Te heterojunction for color sensor has been fabricated by RF reactive sputtering and thermal evaporation methods onto glass substrate. The optimum deposition condition of $TiO_{2}$ films was such that RF power was 120 W, substrate temperature was $100^{\circ}C$, oxygen concentration was 50%, working pressure was 50 mTorr for the $TiO_{2}$ film thickness of $1000{\AA}$. In this case, the optical transmittance of $TiO_{2}$ film at 550 nm-wavelength was 85%, resistivity was $2{\times}10^9{\Omega}{\cdot}cm$, refractive index was 2.3, and optical bandgap was 3.58 eV. The composition ratio of 0 to Ti by AES analysis was 1.7. When $TiO_{2}$ films were annealed at $400^{\circ}C$ for 30 min. in $O_{2}$ ambient, the optical transmittance of $TiO_{2}$ films at the wavelength range of $300{\sim}580$ nm was improved from 0 to 25%. When Se : Te films were annealed at $190^{\circ}C$ for 1 min., photosensitivity under illumination of 1000 lux was 0.75. The optical bandgap of Se : Te films was 1.7 eV. The structures of Se : Te films were the hexagonal with (100) and (110) orientation. The spectral response of a-Se was improved by the addition of Te, especially in the long wavelength region. The $TiO_{2}$/Se : Te heterojunction showed wide spectral response, and more improved one than that of a-Si film in the blue light region.

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