• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Journal of the Korean Society for Railway
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• v.15 no.6
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• pp.588-596
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• 2012

This paper presents a new semi-analytical annular Mindlin plate element with which out-of-plane natural vibration of thick disks can be analyzed simply, efficiently, and accurately through FEM by including effects of rotary inertia and transverse shear deformation. Using static deformation modes which are exact solutions of equilibrium equations of annular Mindlin plate, the element interpolation functions, stiffness and mass matrices corresponding to each number of nodal diameters are derived. The element is capable of representing out-of-plane rigid-body motions exactly and free from shear locking. Natural frequencies of uniform and multi-step disks with or without concentric ring support are analyzed by applying the presented element. Such results are compared with theoretical predictions of previous works or FEA results obtained by using two-dimensional shell element to investigate the convergence and accuracy of the presented element.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.1
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• pp.45-51
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• 2009

A low-voltage, low-power analog CMOS front-end for a cardiac pacemaker is proposed. The circuits include a 4th order switched-capacitor (SC) filter with a passband of 80-120 Hz and a SC variable gain amplifier whose control range is from 0 to 24-dB with 0.094 dB step. An inverter-based switched-capacitor circuit technique is used for low-voltage operation and ultra-low power consumption, and correlated double sampling technique is used for reducing the finite gain effect of an inverter. The proposed circuit has been designed in a $0.35-{\mu}m$ CMOS process, and it achieves 80-dB SFDR at 5-kHz sampling frequency. The power consumption is only 330 nW at 1-V power supply.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.241-241
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• 2016

반도체 선폭이 20 nm급까지 감소함에 따라 기존에 수율에 문제를 끼치던 공정 외부 유입 입자뿐만 아니라, 공정 도중에 발생하는 수~수십 나노의 작은 입자도 수율에 악영향을 끼치게 되었다. 이에 따라 저압, 극청정 조건에서 진행되는 공정 중 발생하는 입자를 실시간으로 모니터링 할 수 있는 장비에 대한 수요가 발생하고 있다. Particle beam mass spectrometer (PBMS)는 이러한 요구사항을 만족할 수 있는 장비로 100 mtorr의 공정 조건에서 5 nm 이상의 입자의 직경별 수농도를 측정할 수 있는 장비이다. PBMS로 입자의 수농도를 측정하기 위해서는 PBMS 전단에서 입자를 중앙으로 집속할 필요가 있다. 공기역학렌즈는 PBMS 전단에서 입자를 집속시키기 위해 일반적으로 널리 사용되고 있는 장비로 여러 개의 오리피스로 이루어져 있다. 공기역학렌즈를 지나는 수송 유체와 입자는 이러한 연속 오리피스를 거치면서 팽창과 수축을 반복하며, 관성력의 차이로 인해 입자가 중앙으로 집속된다. 그러나 기존 공기역학렌즈는 고정된 직경의 오리피스를 사용하기 때문에 설계된 공정조건 이외에는 입자의 집속효율이 감소한다는 단점을 지닌다. 따라서 공정조건이 바뀔 경우 공기역학렌즈를 교체해야 되며, 진공이라는 환경하에서 이러한 교체는 많은 시간과 노력을 요구로 한다. 본 연구에서는 이러한 공기역학렌즈의 문제점을 해결하기 위해 다양한 공정조건에서 교체 없이 사용할 수 있는 새로운 형태의 직경 가변형 공기역학렌즈인 조리개형 공기역학렌즈를 제안하였다. 기존 연구를 통해 조리개형 공기 역학 렌즈가 다양한 압력 범위 내에서 나노입자를 성공적으로 집속할 수 있음을 보였지만, 장비를 상용화하기 위해서는 사용자가 좀 더 쉽게 렌즈직경을 결정 할 수 있어야 한다. 이에 본 연구에서는 조리개형 렌즈의 중공 직경에 따른 입자 집속 특성을 평가하였으며, 최종적으로 압력과 집속하고자 하는 직경에 따라 렌즈 중공 직경을 결정할 수 있게 해주는 데이터 베이스를 제작하였다.

• Journal of the Korean GEO-environmental Society
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• v.5 no.3
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• pp.51-60
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• 2004

In Korea there are recently many attempts to expand a temporary soil nailing system into a permanent soil nailing system since the first construction in 1993. In the soil nailing system, the rigid facing walls act on restraining the deformation of the ground. These are purposed to minimize the damage of adjacent buildings or underground structures. In Korea, to minimize the relaxation of the ground, the soil nailing system in the downtown area is often used experientially together with braced cuts, sheet pile walls, soil cement walls (SCW), or jet grouting walls. However, for the conservative design, the confining effects by the stiff facing have been ignored because the proper design approach of considering the facing stiffness has not been proposed. In this study, various laboratory model tests are carried out to examining the influence the rigidity of facings on the global safety of soil nailing system. Also, the parametric studies using the numerical technique as shear-strength reduction technique are carried out. In the parametric study, the thickness of concrete facing walls is changed to identify the effects of the facing wall stiffness.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.9
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• pp.46-53
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• 2014

In this paper, ku-band RF transceiver system is designed for the unmanned aerial vehicle(UAV) line-of-sight(LOS) datalink. The RF transceiver system is consisted of the transmitting and receiving unit, RF front-end unit, and high power amplification unit. The transmitting and receiving unit has the functions of frequency up/down converting and channel changing. The RF front-end unit has the functions of transmitting and receiving signal duplexing, antenna selection, small signal amplification, and frequency filtering excluding the receiving signal. The high power amplification unit has the functions of ku-band power amplification and transmitting power variation(High/Middle/Low/Mute). The frequency up/down converting of transmitting and receiving unit is designed by using the superheterodyne method. The RF transceiver system is designed to obtain the broadband and high linearity properties for the reliable transmission and reception of high data-rate and high speed data. Also, the channel changing function is designed to use selectively the frequency as the operation environment of UAV.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.29-34
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• 2020

The behavior of brittle fracture of electroless nickel immersion gold (ENIG) /Sn-3.0wt.%Ag-0.5wt.%Cu (SAC305) solder joints was evaluated. The pH of the electroless nickel plating solution for ENIG surface treatment was changed from 4.0 to 5.5. As the pH of the Ni plating solution increased, pin hole in the Ni-P layer increased. The thickness of the interfacial intermetallic compound (IMC) of the solder joint increased with pH of Ni plating solution. The high speed shear strength of the SAC305 solder joint on ENIG surface finish decreased with the pH of the Ni plating solution. In addition, the brittle fracture rate of the solder joint was the highest when the pH of the Ni plating solution was 5.

• Convergence Security Journal
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• v.16 no.5
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• pp.3-9
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• 2016

The wireless sensor networks have become an economically viable monitoring solution for a wide variety of civilian and military applications. The main challenge in wireless sensor networks is the secure transmission of information through the network, which ensures that the network is secure, energy-efficient and able to identify and prevent intrusions in a hostile or unattended environment. In that correspondence, this paper proposes a distributed clustering process that integrates the necessary measures for secure wireless sensors to ensure integrity, authenticity and confidentiality of the aggregated data. We use the notion of pre-distribution of symmetric and asymmetric keys for a secured key management scheme, and then describe the detailed scheme which each sensor node within its cluster makes use of the pre-distribution of cryptographic parameters before deployment. Finally, we present simulation results for the proposed scheme in wireless sensor network.

• Journal of the Korea Concrete Institute
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• v.19 no.4
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• pp.433-439
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• 2007

The main objective of the paper is to investigate the static behavior of a prestressed concrete (PSC) girder that has been spliced with precast box segments. A 20 m long full-scale spliced PSC girder is fabricated and tested to compare its static performance against a monolithic girder. The monolithic girder has the same geometric and material properties with respect to the spliced girder. This includes infernal strain, deflections, neutral axis position, and crack patterns for both girders. The test also consists of monitoring relative displacements occurring across the joints. Both the horizontal displacement (gap) and vertical displacement (sliding) are measured throughout the loading procedure. All results have been compared to those obtained from the monolithic girder. It has been demonstrated that the spliced girder offers close behavior with respect to the monolithic girder up to the crack load. Both girders exhibits ductile flexural failure rather than abrupt shear failure at joints.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.23-33
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• 2007

The growing environmental regulation governs the use of lead by RoHS, WEEE, and then. The electronic industry is moving to replace Pb-bearing solder with Pb-free solder. To use the Pb-free solder, microelectronic industry needs consequently the new reliability appraisal such as the packaging for high temperature process, various mechanical change caused by new solder, and the development of Pb-free sloder for long life of product. The evaluation of solder bar and mechanical properties of joint were performed compared with international standard, and new appraisal standard was established. The solderability and spread ability of Sn-0.7Cu solder material showed up to the standard. Shear test of solder joint using by the solder resulted that the shear strengths after thermal shock or after aging were not much lower than the shear strength of as-soldered and that they were also up to the standard.