• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.9
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• pp.815-820
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• 2016

An elastic polymer (e.g., PDMS) blended with EFG particles is a promising conductive composite for fabricating soft sensors that can detect an object's deformation up to or more than 50%. Here, we develop large-strain, sprayable soft sensors using a mixture of PDMS and EFG particles, which are used as a host elastomer and electrically conductive particles, respectively. A solution for a conductive composite mixture is prepared by the microwave-assisted graphite exfoliation, followed by ultrasonication-induced fragmentation of the exfoliated graphite and ultrasonic blending of PDMS and EFG. Using the prepared solutions for composite and pure PDMS, 1-, 2-, and 3-axis soft sensors are fabricated by airbrush stencil technique where composite mixture and pure PDMS are materials for sensing and insulating layers, respectively. We characterize the soft strain sensors after investigating the effect of PDMS/EFG wt% on mechanical compliance and electrical conductance of the conductive composite.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.3
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• pp.284-291
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• 2002

An attempt was made to evaluate the degree of aging degradation in thermally aged 2.25Cr-1Mo steel by electrical resistivity measurement. Artificial aging was performed to simulate the microstructural degradation in 2.25Cr-1Mo steel arising from long time exposure at $540^{\circ}C$. Microstructural parameter (amount of solid solution element), mechanical property (ductile-brittle transition temperature) and electrical resistivity were measured to investigate the mutual relationship among these parameters. Depletion of solid solution element(Mo and Cr) in matrix was detected after aging. The ductile-brittle transition temperature(DBTT) increased rapidly in the initial stage of aging and then saturated afterward. On the other hand, the electrical resistivity decreased rapidly in the beginning and then saturated in the later stage of aging.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.11
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• pp.1697-1704
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• 2001

A finite element model for polarization switching in electro-mechanically coupled materials is proposed and applied to predict the switching behavior of a two-dimensional ferroelectric ceramic. A complicated micro-structure existing in the material is modeled as il continuum body and a simple 3 node triangle finite element with nodal displacement and voltage degrees of freedom is used for a finite element analysis. The elements use nonlinear constitutive equations, switching criterion and kinetic relation, fur representation of material response at strong electric and stress fields. The polarization state of the material is represented by internal variables in each element, which are updated at each simulation step based on the proposed constitutive equations. The model reproduces strain and electric displacement hysteresis loops observed in the material.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2011.04a
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• pp.285-287
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• 2011

본 논문에서는 지능형 작동기의 효율적 설계와 특성예측을 위하여 기계적 상사 모델을 개발하고, 작동기의 최적작동 조건을 고찰한다. 먼저 지능형 작동기의 기계적 상사는 단순한 2자유도 스프링-메스-뎀퍼 시스템으로 등가 시스템을 구현하였다. 이 때 스프링 강성계수는 시스템의 강성 또는 전기-기계 연성계수 등으로 상사되며, 전기회로 구성품 등은 질량, 뎀퍼 등으로 상사되어진다. 단순화된 기계적 상사모델을 이용하여 작동조건에서의 전기회로 구성품의 튜닝을 최적화 할 수 있다. 특히 작동기의 공진주파수에서의 특성을 고려하여 최적조건을 도출함으로써 그 성능을 극대화 할 수 있다.

• Korean Journal of Materials Research
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• v.11 no.4
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• pp.312-318
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• 2001

The mechanical and electrical properties of Cu-Nb filamentary nanocomposite fabricated by the bundling and drawing process were examined. The strength increased gradually with increasing Nb content while the ductility was insensitive to Nb content. The ratio of yield stresses at 293K and 75K are found to be 치ose to that of Young's moduli in various Cu-Nb nanocomposites, suggesting that athermal obstacles primarily control the strength. The fracture morphologies show ductile fractures irrespective of Nb contents. Secondary cracking along the interfaces between subelemental wires was occasionally observed and the frequency of secondary cracking increased with increasing Nb content. The conductivity and the resistivity ratio decreased with increasing Nb content. The decrease of the conductivity and the resistivity ratio(${\rho}_{293k}$/$\{rho}_{75k}$) can be explained by the increasing contribution of interface scattering.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.2
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• pp.25-34
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• 2003

In the present paper, formulation of a nine-node assumed strain shell element is modified and extended for analysis of actuator embedded/attached structures. The shell element can alleviate locking and has sic DOFs per node by discarding assumption of no thickness change. In modeling of the physicalquantities, we have assumed linear strain field through the whole thickness direction. The electric and mechanical quantities have been coupled through the constitutive equations. Unlike typical shell element, the present shell element allows thickness change. Thus, three-dimensional piezoelasticity can be accurately simulated. Base on the formulation, a finite element program is generated and the code is validated by solving numerical examples. The results from the present work are well agreed with those from other references.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2011.04a
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• pp.290-291
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• 2011

본 논문에서는 열-전기-기계 하중 하의 지능형 복합재료 보 모델을 전산점근해석기법에 기초하여 개발하였다. 열-전기-기계 하중 하의 구조물은 지난 십년간 많은 연구가 있어왔으나, 주로 고전적 보 모델에 기반을 두어 진행되어져 왔다. 멀티피직스 환경하의 구조물은 여러 가지 하중의 조합과 이에 따른 연성효과의 고려가 필수적이다. 따라서 공학적인 가정이 없는 점근해석기법은 보다 정확한 등가 보 모델을 개발하는데 있어 기반요소가 될 수 있다. 본 연구에서는 3차원 멀티피직스 구성방정식으로부터 출발하여 점근기법을 적용 체계적으로 등가 보 모델을 유도하고 그 해석 결과를 고찰하고자 한다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.122-122
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• 2014

본 연구에서는 micro-hardening을 통한 고강도 고연성 전해동박을 제조하기 위해 Sn, Co, Zn 등의 원소 첨가량, 전류밀도, 전해액 온도, 첨가제 제어 등의 공정조건 변화에 따른 전해동박층의 표면 형상, 조성 및 전기전도도를 평가하였고, 인장강도와 연신율을 평가하였다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.177-180
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• 2003

초 박형 실리콘 칩을 이용하여 실리콘 칩들을 포함한 모듈 전체가 굽힘이 자유로운 유연 패키징 기술을 구현하였으며 bending test와 FEA를 통해 초 박형 실리콘 칩의 기계적 특성을 살펴보았다. 초 박형 실리콘칩$(t<30{\mu}m)$은 표면손상의 가능성을 배제하기 위해 화학적 thinning 방법을 이용하여 제작되었으며 열압착 방식에 의해 $Kapton^{(R)}$에 바로 실장 되었다. 실리콘칩과 $Kapton^{(R)}$ 기판간의 단차가 적기 때문에 전기도금 방식으로 전기적 결선을 이룰 수 있었다. 이러한 방식의 패키징은 이러한 공정은 flip chip 공정에 비해 공정 간단하고 wire 본딩과 달리 표면 단차 적다. 따라서 연성회로 기관을 비롯한 인쇄회로기판의 표면뿐만 아니라 기판 자체에 삽임이 가능하여 패키징 밀도 증가를 기대할 수 있으며 실질적인 실장 가능면적을 극대화 할 수 있다.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.11 s.116
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• pp.1140-1148
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• 2006

In this paper, transmission loss of smart panel was investigated using piezoelectric shunt damping. Admittance of piezoelectric system was introduced to represent electro-mechanical coupling of smart panel and to predict the performance of shunt damping. Finite element method was used to obtain numerical admittance. In order to illuminate the effect of noise reduction in the shunt system, transmission loss of the smart panel was investigated. Two models were considered to show the relation between admittance and transmission loss of smart panel. It was observed that admittance of piezoelectric system could be used as a design index of smart panel.