• Journal of the Korea institute for structural maintenance and inspection
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• v.11 no.3
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• pp.123-131
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• 2007

The buckling behavior of a fiber reinforced plastic pipe was researched. When a cylindrical structure is made of isotropic material, it shows two dimensional buckled shape which has same deformed section along the longitudinal direction. But an anisotropic cylindrical structure shows three dimensional buckled shape which has different deformed section along the longitudinal direction. Because the modulus of elasticity is varied in a certain direction when ply angles are changed, the strength of a pipe are changed as ply angles are changed. In this study, the limitation of two dimensional and three dimensional buckling mode was investigated and the buckling strength of a laminated composite pipe was evaluated.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.12 no.3
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• pp.475-484
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• 1999

압력절점은 요소의 균등한 압력증분을 1개의 자유도로 갖는 절점이며, 유한요소의 하중-변위 평형방정식에 체적과 압력의 관계를 추가하여 한계압력 이후에서도 체적변화에 따른 압력증분을 직접적으로 제저할 수 있는 절점이다. 본 연구에서는 철근콘크리트의 평면 구성 방정식과 적층정식화에 적용한 쉘 요소에 압력절점을 추가하고 해석시 체적을 제어함으로써 철근콘크리트 원통형 구조에 대해 파괴까지의 극한내압 능력을 해석할 수 있는 체적제어 비선형 해석기법을 개발하였다. 본 논문에서 제안한 해석기법을 이용하여 철근콘크리트 원통형 구조물에 대하여 비선형 해석을 수행하여 한계압력과 한계압력 이후의 구조물의 거동을 예측하였으며 실험결과와 비교 검증하였다.

• Composites Research
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• v.17 no.1
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• pp.18-28
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• 2004

In order to evaluate the strength of carbody structures of railway rolling stock made of laminated fiber-reinforced composite materials, total laminate approach was introduced. Structural analyses were conducted to check the basic design of hybrid composite carbody structures of the Korean Tilting Train eXpress(TTX) with the service speed of 180km/h. The mechanical tests were also conducted to obtain strengths of composite laminates. The results show that all stress components of composite carbody structures are inside of failure envelopes and total laminate approach is recommended to predict the failure of hybrid composite carbody structures at the stage of the basic design.

• Proceedings of the KAIS Fall Conference
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• 2009.12a
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• pp.220-222
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• 2009

적층형 가유전체 구조는 유효유전율과 유효투자율은 주어진 표준형 전송선로의 경우보다 증가하므로 결과적으로 전송선로의 길이를 짧게 할 수 있는 장점이 있다. 따라서 회로의 소형화에 유용하게 사용될 수 있는데, 본 논문에서는 한 예로써 대표적인 무선 회로인 방향성 결합기의 소형화된 회로에 대하여 기술하고 있다. 표준형 회로와 적층형 가유전체 구조를 이용하여 소형화한 방향성 결합기를 2GHz 대역에서 설계하여 실제로 제작하여 측정한 결과를 제시한다. 종래의 표준형 회로와 비교할 때, 동일한 성능을 유지하면서도 회로의 크기가 49.4%만큼 감소한 결과가 소개된다.

• Proceedings of the KAIS Fall Conference
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• 2009.05a
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• pp.300-302
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• 2009

적층형 가유전체 구조는 유효유전율과 유효투자율은 주어진 표준형 전송선로의 경우보다 증가하므로 결과적으로 전송선로의 길이를 짧게 할 수 있는 장점이 있다. 따라서 회로의 소형화에 유용하게 사용될 수 있는데, 본 논문에서는 한 예로써 대표적인 무선 회로인 윌킨슨 전력분배기의 소형화된 회로에 대하여 기술하고 있다. 표준형 회로와 적층형 가유전체 구조를 이용하여 소형화한 윌킨슨 전력분배기를 2GHz 대역에서 설계하여 실제로 제작하여 측정한 결과를 제시한다. 종래의 표준형 회로와 비교할 때, 동일한 성능을 유지하면서도 회로의 크기가 32%만큼 감소한 결과가 소개된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.181-181
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• 2007

PTCR 세라믹스를 적층형 부품으로 제조할 경우 소형화, 저 저항화 및 과전류 유입 시 빠른 응답특성을 갖는다는 장점을 가지고 있으며, 이러한 적층형 부품제조시에는 내부전극재가 부품소자의 물성에 중요한 영향을 미친다. 특히 우수한 옴성 접촉(Ohmic Contact)을 갖는 Zn, Fe, Sn, Ni 등의 적층 PTC용 전극재는 높은 산화특성으로 인해 재산화 과정에서의 비옴성 접촉(Non-ohmic contact)을 갖게 되어 PTC 특성을 저하시킬 우려가 있다. 따라서 본 연구에서는 적층형 PTCR 세라믹스의 내부전극재와 반도체 세라믹층의 동시소성거동 및 적층 PTCR 세라믹스의 전기적 특성을 평가하였다. 본 연구에 적용된 내부전극재로는 Ni 전극을 사용하였고, Ni 전극용 paste로는 무공제 paste, 반도체 세라믹공제 paste, $BaTiO_3$ 공제 paste의 3종 전극재가 이용되었다. 적층형 PTCR 세라믹스의 제조공정은 테이프 캐스팅(Tape casting), 내부전극인쇄, 적층 및 동시소성을 포함하는 적층화공정을 적용하였다. 각각의 전극 paste를 적용하여 제조된 chip은 미세구조관찰, I-V특성, R-T특성 등을 평가하여 내부전극내 세라믹공제의 영향을 고찰하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.2
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• pp.443-448
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• 2010

Rapid advance in information technology requires high performance devices with compact size. Integrated multi-layer electronic element with different functions enables those compact devices to possess various performances and powerful capabilities. In mass production, the multi-layer electronic element is manufactured as a bulk type with a large number of parts for productivity. However, this may cause the electronic part to be damaged in the cutting process of the bulk elements to separate into each part. Therefore the cutting performance of multi-layer element bulk is playing an important role in the view of production efficiency. This study focuses on the cutting characteristics of multi-layer electronic elements. In order to increase the efficiency, the vibration cutting method was applied to the blade cutting machine. Flexure hinge structure, which is an physical amplifier of increasing displacement, was attached to the vibration cutting device for machining efficiency. The behaviors of flexure hinge were modeled with Lagrange equation and simulated with finite element method (FEM). Performance of hinge structure was verified by experimental modal analysis (EMA) for hinge structure to be tuned to the specific mode of vibrations. Cutting experiments of multi-layer elements were conducted with the proposed vibrating cutting module, and the characteristics was analyzed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.10
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• pp.687-698
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• 2001

This paper presents a three dimensional stacked pad area away (PAA) package configuration as an implementation method of radio frequency (RF) circuits. 224MHz RF circuits of intelligence traffic system(ITS) were constructed with the stacked PAA RF pakage configuration. In the process of manufacturing the stacked PAA RF pakage, RF circuits were partitioned to subareas following their function and operating frequency. Each area of circuits separated to each subunits. The operating characteristics of RF PAA package module and the electrical properties of each subunits were examined. The measurement of electrical parameters for solder balls which were interconnects for stacked PAA RF packages showed that the parasitic capacitance and inductance were 30fF and 120pH, respectively, which might be negligible in PAA RF packaging system. HP 4396B network/spectrum analyzer revealed that the amplification gain of a receiver and transmitter at 224 MHz was 22dB and 27dB, respectively. The gain was 3dB lower than designed values. The difference was probably generated from fabrication process of the circuits by employing commercial standard

• Proceedings of the KAIS Fall Conference
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• 2010.11a
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• pp.359-362
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• 2010

본 논문에서는 적층형 백색유기발광 조명소자를 제작하여 단층형 구조와 비교 분석하는 연구와 CGL(Charge Generation Layer)의 두께 변화에 따른 소자특성 연구를 하였다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.5
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• pp.682-687
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• 2022

In this paper, the research results on monolithic three-dimensional integrated-circuit (M3DICs) stacked with tunneling field effect transistors (TFETs) are introduced. Unlike metal-oxide-semiconductor field-effect transistors (MOSFETs), TFETs are designed differently from the layout of symmetrical MOSFETs because the source and drain of TFET are asymmetrical. Various monolithic 3D inverter (M3D-INV) structures and layouts are possible due to the asymmetric structure, and among them, a simple inverter structure with the minimum metal layer is proposed. Using the proposed M3D-INV, this M3D logic gates such as NAND and NOR gates by sequentially stacking TFETs are proposed, respectively. The simulation results of voltage transfer characteristics of the proposed M3D logic gates are investigated using mixed-mode simulator of technology computer aided design (TCAD), and the operation of each logic circuit is verified. The cell area for each M3D logic gate is reduced by about 50% compared to one for the two-dimensional planar logic gates.