• Journal of the Korea institute for structural maintenance and inspection
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• v.26 no.4
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• pp.73-80
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• 2022

This study evaluated changes in fluidity and rheological properties over time for 3D printed composite materials, and evaluated compressive strength and splitting tensile strength properties for laminated and molded specimens. The composite material for 3D printing starts to change rapidly after 30 minutes of extrusion, and the viscosity of the material tends to be maintained up to 90 minutes, but it was confirmed that construction within 60 minutes after mixing is effective. The compressive strength of the laminated test specimen showed equivalent or better performance at all ages compared to the molded test specimen. In the stress-strain curve of the laminated specimen, the initial slope was similar to that of the molded specimen, but the descending slope was on average 1.9 times higher than that of the molded specimen, indicating relatively brittle behavior. The splitting tensile strength of the P-V laminated specimen was about 6% lower than that of the molded specimen. It is judged that this is because the interfacial adhesion force against the vertical load is affected by the pattern direction of the laminated test specimen.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.1
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• pp.8-13
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• 2020

Stress is the main cause of warpage failure of very thin substrates with thickness of several hundred ㎛, such as IC packages. Stress usually results from differences in crystal structures and corresponding thermal expansion coefficients when depositing different substances on a substrate. In this study, the behaviors of stress occurring in substrates were numerically analyzed by the thin-film pattern of the rectangles stacked on the substrates. First, the substrate displacement was obtained and the substrate strain and stress were obtained using it. When the tensile force is concentrated at the edge of the thin film pattern, normal and shear stresses are generated around the edge of the thin film pattern. Normal stress occurs near the edges of the thin film pattern and the vertexes. Shear stress also occurs around the edge of the thin film pattern, but unlike normal stress, it does not appear near the vertexes. It was also confirmed that the magnitude and direction of shear stress are changed around the edge. When edge forces of thin-film pattern are equal, the normal stress was about 10 times larger than the shear stress. This indicates that normal stress is the biggest cause of warpage failure.

• Journal of Satellite, Information and Communications
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• v.12 no.1
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• pp.132-136
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• 2017

In this paper, expanded lowest operating frequency by adopting circular slot on ground of balun and balance improved balance performances by stacking dielectric layer balun is proposed. Bandwidth of proposed balun is 1~7 GHz, and electrical length is $0.05{\lambda}$ at 1 GHz. In order to check performances of the proposed balun, simple dipole is integrated with the balun and radiation pattern of dipole is measured.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2000.11a
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• pp.328-332
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• 2000

본 논문에서는 기생 패치 구조와 적층 구조의 광대역 마이크로스트립 안테나에 평행 결합 선로 형태의 광대역 임피던스 정합 회로를 결합하여 쉽게 추가적인 임피던스 대역폭 개선을 얻을 수 있음을 제안하였다. 평행 결합 선로 형태의 광대역 임피던스 정합 회로 설계를 위하여 분포 회로 방식의 반복적인 방법을 제시하였고. 설계\ulcorner제작 결과 기생 패치 구조와 적층 구조에서 각각 56.23%와 16.45%의 추가적인 임피던스 대역폭 개선을 이룰 수 있었다. 그리고 방사 패턴과 측정된 이득을 보면 평행 결합 선로의 결합으로 인한 방사 패턴에서의 큰 변화는 보이지 않았고, 이득에서는 평행 결합 선로 부분의 커플링 손실로 인해 최대 이득이 약 1 dB 정도 감소하는 것을 확인할 수 있었다.

• Proceedings of the KAIS Fall Conference
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• 2001.05a
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• pp.148-150
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• 2001

본 논문에서는 소결 후 20 ㎛ 정도의 두께를 갖는 ceramic green sheet를 이용하여 초소형(1005) 칩 인덕터를 제작하였다. 인덕터의 패턴을 최적화함에 있어서 HP사의 HFSS(High Frequency Structure Simulator)를 이용하였고 이 과정에서 인덕터의 전기적 특성, 등가회로등을 추출하였다. 칩 인덕터를 제작함에 있어서 모든 적층 공정을 최적화하였다. 실제 제작한 인덕터와 simulation 결과의 관계성을 도출하고 이를 통해 목표 용량을 tuning하였다. 이와 같은 과정을 통해 1-39 nH의 인덕턴스를 갖는 1005크기의 칩 인덕터를 개발하였고, 이를 선진사의 제품과 비교할 때 우수한 전기적 특성을 나타내었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2006.11a
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• pp.28.1-28.1
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• 2006

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.20 no.2
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• pp.72-78
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• 2021

This paper proposes a wide-band dual-polarization stacked patch array antenna for satellite SAR system applications. The array antenna was designed for loss minimization and wide-band characteristics to enhance the performance of the SAR system and optimize it for active return loss in applications to active phased arrays. The fabricated array antenna showed a performance of 19.26%/19.79% fractional bandwidth within the -10 dB reference level of the active return loss and showed loss characteristics of 0.797 dB/0.799 dB averaged within the operational frequency for both H/V-polarization cases. The pattern performance was verified by comparing the measured patterns with the calculated patterns obtained by the array factor.

• Journal of Aerospace System Engineering
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• v.16 no.5
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• pp.35-42
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• 2022

This paper deals with predicting comparable mechanical properties of laminated composite plates. The stiffness of an equivalent anisotropic composite plate is derived based on classical lamination theory. A novel failure criterion is defined to describe the failure behaviour of laminated composite plates based on micro-mechanics failure criteria. Finally, the theory's validation of finite element analysis results was verified. We concluded that this theory is very suitable for failure analysis of laminated composite plates for aerospace applications due to their relative simplicity and computational efficiency.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.50 no.4
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• pp.223-231
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• 2022

Residual stress that can occur during the metal additive manufacturing process is an important factor that must be properly controlled for the precise production of metal parts through 3D printing. Therefore, in this study, the factors affecting these residual stresses were investigated using an experimental method. For the experiment, a specimen was manufactured through an additive manufacturing process, and the amount of deformation was measured by cutting it. By appropriately calibrating the measured data using methods such as curve fitting, it was possible to quantitatively analyze the effect of process parameters and metal powder reuse on deformation due to residual stress. From this result, it was confirmed that the factor that has the greatest influence on the magnitude of deformation due to residual stress in the metal additive manufacturing process is whether the metal powder is reused. In addition, it was confirmed that process parameters such as laser pattern and laser scan angle can also affect the deformation.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.223.1-223.1
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• 2015

본 연구에서는 지름이 다른 두 개의 디스크가 적층된 구조를 갖는 금 나노 구조체를 제작하고 그 광학적 특성에 대해 연구하였다. 나노임프린팅을 통하여 패턴된 폴리머 포어 어레이에 금 박막을 증착하고, 포어 내부에 증착된 금 나노구조체를 선택적으로 수거하는 방법을 이용하였다 [1]. 특히 금 증착 시, 빗각으로 증착 (oblique-angle deposition)을 하여 지름이 다른 두 개의 디스크가 적층되어 있는 구조를 형성하는 것이 가능하였다. 증착 각도의 조절을 통해 적층된 두 디스크의 지름 비율을 변화시킬 뿐만 아니라, 2차원 디스크 형태의 나노구조체부터 3차원 디쉬 형태의 구조체도 제작이 가능함을 확인하였다. 제안된 하향식 나노공정을 통하여 합성된 금 나노구조체를 이용하여 광열 전환(photothermal heat conversion)과 광 간섭성 단층 (optical coherence tomography) 측정을 진행하였고, 서로 다른 두 개의 디스크가 적층된 형태의 금 나노구조체는 상용 금 나노로드 (Au nanorod) 보다 높은 광 열 전환 효율을 갖을 뿐 아니라 우수한 OCT 이미징 특성을 보였다. 광열 전환 및 OCT 이미징 실험 결과는 각각 플라즈모닉 나노구조의 광흡수, 광산란 특성에 기반하므로, 본 연구를 통하여 제안된 금 나노구조체는 광흡수 및 광산란을 기반한 바이오이미징 나노프로브로 유용하게 사용될 수 있을 것으로 전망된다.