• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.3
• /
• pp.69-75
• /
• 2001

Photoimageable thick film technology is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process. Line resolution of 25 $\mu\textrm{m}$ width and 25 $\mu\textrm{m}$ space could be obtained by laminating green sheet, printing photoimageable Ag paste, exposing the test patterns, developing, and co-firing. In case of using the alumina substrate, 20 $\mu\textrm{m}$ fine line could be also obtained by similar process. Test results showed that exposing power density and developing time were the most important processing parameters for the fine line formation. Microstrip and series gap resonators with well-defined line morphology and good transmission characteristics in high frequency were formed by this new technology, and thereby dielectric constant and loss of test substrate were calculated.

• Composites Research
• /
• v.37 no.3
• /
• pp.219-225
• /
• 2024

It is essential to develop a light-weight, high-performance structure for the deployable reflector antenna, which is the payload of a reconnaissance satellite, considering launch and orbital operation performance. Among them, the composite main reflector is a key component that constitutes a deployable reflector antenna. In particular, the development of a high-performance main reflector is required to acquire high-quality satellite images after agile attitude control maneuvers during satellite missions. To develop main reflector, the initial design of the main reflector was confirmed considering the structural performance according to the laminate stacking design and material properties of the composite main reflector that constitutes the deployable reflector antenna. Based on the initial design, four types of composite main reflectors were manufactured with the variable for manufacturing process. As variables for manufacturing process, the curing process of the composite structure, the application of adhesive film between the carbon fiber composite sheet and the honeycomb core, and the venting path inside the sandwich composite were selected. After manufacture main reflector, weight measurement, non-destructive testing(NDT), surface error measurement, and modal test were performed on the four types of main reflectors produced. By selecting a manufacturing process that does not apply adhesive film and includes venting path, for a composite main reflector with light weight and structural performance, we developed and verified a main reflector that can be applied to the SAR(Synthetic Aperture Rader) satellite.

• Membrane Journal
• /
• v.27 no.5
• /
• pp.449-457
• /
• 2017

In this study, the 10 stages stacked module was designed by increasing the number of unit cells in the membrane capacitive deionization(MCDI) process. The aminated polysulfone and sulfonated poly(ether ether ketone) were synthesized and coated on porous carbon electrode by casting method. The salt removal efficiency was measured for the 10 stage stacked module under the operation conditions of adsorption voltage and time, desorption voltage and time, flow rate and concentration of feed water, and di-valent solutions including $CaSO_4$, $MgCl_2$ and tap water. Typically, when 100 mg/L of NaCl as the feed was used, the salt removal efficiency was 98.3% at a flow rate of 100 mL/min, the adsorption condition of 1.2 V/3 min and desorption condition of -0.5 V/5 min.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.33 no.6
• /
• pp.282-287
• /
• 2023

The effect of stress relief heat treatment temperature and duration time on the microstructure, residual stress and Vickers hardness of additively manufactured Ti-6Al-4V alloy using laser powder bed fusion process was clarified. As a result of stress relief heat treatment for 240 minutes at 823 K and 60 minutes or more at 873 K, residual stress was decreased less than 30 MPa without grain growth and phase transformation which causes dimensional distortion and deterioration of mechanical properties. In addition, hardness was increased with increasing heat treatment temperature and duration time. It was deduced that the refinement of acicular martensitic α' phase due to the increasing duration time of isothermal heat treatment at 773~873 K, which was not detected by XRD and phase map analysis using SEM-EBSD, probably increases the hardness.

• Composites Research
• /
• v.13 no.4
• /
• pp.42-53
• /
• 2000

A study has been made to establish an optimum condition in the surface treatment and curing method that is important for the fabrication of Al 7075/CFRP laminates. PAA(Phosphoric Acid Anodizing) provided a good adhesive strength and FPL(Sulfuric / Sodium Dichromate Acid Etching) had a similar adhesive strength with PAA. On the other hand, the poor adhesive strength was shown on vapor degrease and CAA(Chromic Acid Anodizing). By using the atomic force microscope(AFM), it was found that the PAA oxide surface obviously had a greater degree of microroughness as compared to vapor degrease, CAA and FPL treated surfaces. These results support the concept of a mechanical interlocking of the adhesive with-in the oxide pores as the predominant adhesion mechanism. In curing methods, the adhesive strength of co-curing method was higher than that of secondary curing method. With respect to stability of specimen shape, the secondary curing method was better than co-curing method. DMA(Dynamic Mechanical Analysis) test revealed $T_g$ in curing times over 60 min is nearly same, so it is estimated they will have similar degree of curing and joint durability in using FM300M adhesive film.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.45 no.2
• /
• pp.112-117
• /
• 2008

Vertical interconnection scheme using novel silicon-through-via for 3D MEMS devices or stacked package is proposed and fabricated to demonstrate its feasibility. The suggested silicon-through-via replaces electroplated copper, which is used as an interconnecting material in conventional through-via, with doped silicon. Adoption of doped silicon instead of metal eliminates thermal-mismatch-induced stress, which can make troubles in high temperature MEMS processes, such as wafer bonding and LP-CVD(low pressure chemical vapor deposition). Two silicon layers of $30{\mu}m$ thickness are stacked on the substrate. The through-via arrays with spacing $40{\mu}m$ and $50{\mu}m$ are fabricated successfully. Electrical characteristics of the through-via are measured and analyzed. The measured resistance of the silicon-through-via is $169.9\Omega$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.24 no.10
• /
• pp.964-970
• /
• 2013

This paper presents a bandpass wireless 3-D chip to chip interface technique. The proposed technique uses direct amplitude modulation of the free running oscillator which especially utilizes the coupling capacitance between two stacked chips as a part of the resonator. Therefore, the oscillator is three dimensionally configured and a simple envelope detector can be used as a receiver without any additional matching circuitry. The proposed link was designed and fabricated using 110 nm CMOS technology and experimental results successfully showed the data transmission at a data rate of 2 Gb/s for the stacked chips with a thickness of 50 ${\mu}m$ consuming 4.32 mW. The sizes of the Tx and Rx chips are 0.045 $mm^2$ and 0.029 $mm^2$, respectively.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.8 no.4
• /
• pp.775-780
• /
• 2007

Rapid Prototyping (RP) is a technology that produces prototype parts from 3D computer aided design model data without intermediate processing technology rapidly. CAD model data are created from 3D object digitizing systems but presented just as 2D data when they are printed as a hard copy or displayed on a monitor. However, Rapid Prototyping Technology fabricates 3D objects the same that CAD data because it transforms designed 3D CAD data into 2D cross sectional data, and manufactures layer by layer deposition sequentially. But most of all the small and medium scale companies which produce a toothbrush, a toy and such like provisions are in difficult situations to buy RP system because it is very expensive. In this paper, we propose a 3D control system adopting open source programs for implementing Rapid Prototyping Technology in order that RP system can be purchase at a moderate price.

• Composites Research
• /
• v.36 no.2
• /
• pp.108-116
• /
• 2023

In this paper, kinematic design and multi-body dynamics analysis were conducted to develop a small manipulator platform for automating the maintenance of structures made of composite materials. To design manipulator kinematically, the existing composite repair process was considered. The 3D design was conducted after selecting the basic specifications of manipulator and end-effecter in consideration of the patch lamination process for repair. Then, variables necessary for simulation and control were generated in MATLAB through inverse kinematic analysis. To evaluate the structural stability of platform, multibody dynamics analysis was conducted using Altair Inspire and Optistruct. Based on the simulation conducted in Inspire, multibody dynamics analysis was conducted in Optistruct, and structural stability was verified through the results of maximum displacement and Von-Mises stress over time. To verify the design, manufacturing and controlling of platform were conducted and compared with the simulation. It was confirmed that the actual repair process path and the simulation showed a good agreement.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.23 no.5
• /
• pp.613-623
• /
• 2012

In this paper, we present an ultra miniaturized voltage tuned oscillator, with HMIC-type amplifier and phase shifter, using LTCC artificial dielectric resonator. ADR which consists of periodic conductor patterns and stacked layers has a smaller size than a dielectric resonator. The design specification of ADR is obtained from the design goal of oscillator. The structure of the ADR with a stacked circular disk type is chosen. The resonance characteristic, physical dimension and stack number are analyzed. For miniaturization of ADRO, the ADR is internally implemented at the upper part of the LTCC substrate and the other circuits, which are amplifier and phase shifter are integrated at the bottom side respectively. The fabricated ADRO has ultra small size of $13{\times}13{\times}3mm^3$ and is a SMT type. The designed ADRO satisfies the open-loop oscillation condition at the design frequency. As a results, the oscillation frequency range is 2.025~2.108 GHz at a tuning voltage of 0~5 V. The phase noise is $-109{\pm}4$ dBc/Hz at 100 kHz offset frequency and the power is $6.8{\pm}0.2$ dBm. The power frequency tuning normalized figure of merit is -30.88 dB.