• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.8
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• pp.30-37
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• 2014

In this paper, the compact model for FinFET gate resistance is developed. Based on the FinFET geometry and material, the value of the gate resistance is extracted by Y-parameter analysis using 3D device simulator, Sentaurus. By dividing the gate resistance into horizontal and vertical components, the proposed gate resistance model captures the non-linear characteristics. The proposed compact model reflects the realistic gate structure which has two different materials (Tungsten, TiN) stacked. Using the proposed model, the number of fins for the minimum gate resistance can be proposed based on the variation of gate geometrical parameters. The proposed gate resistance model is implemented in BSIM-CMG. A ring-oscillator is designed, and its delay performance is compared with and without gate resistance.

• Journal of the Earthquake Engineering Society of Korea
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• v.11 no.1 s.53
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• pp.21-27
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• 2007

In this study, an approach that installs seismic isolation bearings was proposed for the seismic retrofit of the existing bridges. The method that replaces all existing bearings with seismic isolators was proposed already. However, in this study, we recommend to utilize the existing bearings for the benefit of safety and cost. According to our proposal, the seismic isolators do not support vertical loads but they Just function as the period shifter and the horizontal damper. To verify this approach experimentally, the real scale bearings and lead rubber bearings far the real highway bridges were designed and fabricated. And the responses of this isolated bridges to the assumed earthquakes were determined by the pseudo dynamic test scheme. The test results were also compared to the responses computed by the well known structural analysis software to check the reliability of the test. From the test results, we found that the retrofitted bridges using the proposed method showed stable performances under earthquakes.

• Journal of the Korean Society for Nondestructive Testing
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• v.7 no.2
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• pp.42-47
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• 1988

The off-axis tensile strength of the unidirectional carbon fiber reinforced plastic and the residual strength of impact damaged CFRP were measured and compared with the stress wave factor (SWF) of the specimens. The SWF values were measured to be decreased with the strength reduction in both cases and found to be useful for the nondestructive strength evaluation of unidirectional CFRP. The failure behaviour of the unidirectional CFRP during off-axis tensile testing was also monitored by acoustic emission(AE) method. The AE energy release showed the characteristic feature depending on the off-axis angle and this result was analyzed to be caused by the difference of the expected failure mode depending on the off-axis angle. The failure mode of CFRP was found to be analyzed by investigation of the peak amplitude distribution of AE.

• Journal of the Korean Wood Science and Technology
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• v.43 no.6
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• pp.861-867
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• 2015

The Compact Tension (CT) type test was performed in order to evaluate the fracture toughness performance of glass fiber-reinforced laminated timber. Glass fiber textile and sheet Glass fiber reinforced plastic were used as reinforcement. The reinforced laminated timber was formed by inserting and laminating the reinforcement between laminated woods. Compact tension samples are produced under ASTM D5045. The sample length was determined by taking account of the end distance of 7D, and bolt holes (12 mm, 16 mm, 20 mm) had been made at the end of artificial notches in advance. The fracture toughness load of sheet fiberglass reinforced plastic reinforced laminated timber was increased 33 % in comparison to unreinforced laminated timber while the glass fiber textile reinforced laminated timber was increased 152 %. According to Double Cantilever Beam theory, the stress intensity factor was 1.08~1.38 for sheet glass fiber reinforced plastic reinforced laminated timber and 1.38~1.86 for glass fiber textile reinforced laminated timber, respectively. That was because, for the glass fiber textile reinforced laminated timber, the fiber array direction of glass fiber and laminated wood orthogonal to each other suppressed the split propagation in the wood.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.1
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• pp.8-13
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• 2020

Stress is the main cause of warpage failure of very thin substrates with thickness of several hundred ㎛, such as IC packages. Stress usually results from differences in crystal structures and corresponding thermal expansion coefficients when depositing different substances on a substrate. In this study, the behaviors of stress occurring in substrates were numerically analyzed by the thin-film pattern of the rectangles stacked on the substrates. First, the substrate displacement was obtained and the substrate strain and stress were obtained using it. When the tensile force is concentrated at the edge of the thin film pattern, normal and shear stresses are generated around the edge of the thin film pattern. Normal stress occurs near the edges of the thin film pattern and the vertexes. Shear stress also occurs around the edge of the thin film pattern, but unlike normal stress, it does not appear near the vertexes. It was also confirmed that the magnitude and direction of shear stress are changed around the edge. When edge forces of thin-film pattern are equal, the normal stress was about 10 times larger than the shear stress. This indicates that normal stress is the biggest cause of warpage failure.

• Composites Research
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• v.16 no.3
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• pp.9-17
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• 2003

In order to simulate the crack connection between cords and the interply crack growth in the belt-layer of real tire, 2 ply rubber/cord laminate specimens with exposed edges were tested in 4~11mm displacement control. Measurement of the crack connection is evaluated when crack reaches the half of the length between 45$^{\circ}$ aligned cords, and the amount of the crack growth is measured by the steel probe method. 2 dimensional analytic modeling was performed to simulate the crack connection between cords at the exposed edges. Also, the theoretical life of the specimens was calculated from the crack connection life between cords(critical value) and from the critical value to the final failure by the use of Tearing energy(T); the strain energy release per unit area of one fracture surface of a crack. Then, theoretical life was compared with those of experiments. The life prediction up to the critical value has about 20% error compared to experimental life, and up to the final failure about 65% error. Therefore, total theoretical life has about 45% error compared to the experimental life, which is conceivable in the case of rubber.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.30 no.5
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• pp.381-387
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• 2017

Fiber-reinforced composites not only have a direction of thermal expansion coefficient, but also inevitably suffer thermal stress effects due to the difference between the manufacturing process temperature and the actual use temperature. The damage caused by thermal stress is more prominent in the case of thick composite laminates, which are increasingly applied in the aerospace industry, and have a great influence on the mechanical function and fracture strength of the laminates. In this study, the dimensional reduction and thermal stress recovery theory of composite beam structure having high slenderness ratio is introduced and show the efficiency and accuracy of the thermal stress comparison results between the 3-D finite element model and the dimension reduction beam model. Efficient recovery analysis study will be introduced by reconstructing the thermal stress of the composite beam section applied to the thermal environment by constructing the dimensional reduction modeling and recovery relations.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.31 no.3
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• pp.272-278
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• 1995

In this paper to investigate mode I and mode II critical energy release rates, G sub(IC) and G sub(IIC), three prepregs which are domestic products are used. Those are used for the unidirectional composites, but only one is used for the cross-ply laminate composites which is molded [0/90] sub(6s), [0/45] sub(6s) and [0/45/90] sub(6s). The value of G sub(IC) is almost same when modified three calculating methods are applied. The highest value of G sub(IC) at crack initiation is obtained at the [0/90] sub(6s) interlaminar and the lowest one is at the [0/45/90] sub(6s) interlaminar.

• Design & Manufacturing
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• v.16 no.3
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• pp.58-65
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• 2022

Micro-fluidic chip has been fabricated by lithography process on silicon or glass wafer, casting using PDMS, injection molding of thermoplastics or 3D printing, etc. Among these processes, 3D printing can fabricate micro-fluidic chip directly from the design without master or template for fluidic channel fabricated previously. Due to this direct printing, 3D printing provides very fast and economical method for prototyping micro-fluidic chip comparing to conventional fabrication process such as lithography, PDMS casting or injection molding. Although 3D printing is now used more extensively due to this fast and cheap process done automatically by single printing machine, there are some issues on accuracy or surface characteristics, etc. The accuracy of the shape and size of the micro-channel is limited by the resolution of the printing and printing direction or layering direction in case of SLM type of 3D printing using UV curable resin. In this study, the printing direction and thickness of each printing layer are investigated to see the effect on the size, shape and surface of the micro-channel. A set of micro-channels with different size was designed and arrayed orthogonal. Micro-fluidic chips are 3D printed in different directions to the micro-channel, orthogonal, parallel, or skewed. The shape of the cross-section of the micro-channel and the surface of the micro-channel are photographed using optical microscopy. From a series of experiments, an optimal printing direction and process conditions are investigated for 3D printing of micro-fluidic chip.

• Journal of the Korea institute for structural maintenance and inspection
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• v.28 no.1
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• pp.90-97
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• 2024

In this study, we employed Highly Ductile Cement Composite (HDCC) to evaluate the flexural performance of a RC slab that simulates the laminating structure of a seashell. To evaluate flexural performance, we produced conventional RC slab specimens, HDCC slab specimens, and HDCC-M slab specimens which biomimics a seashell's layered structure by inserting PE mesh inside the slab made of HDCC. A series of 4-point bending tests were conducted. Experimental results shows the flexural strength of the HDCC-M slab specimen was 1.7 times and 1.2 times higher than that of the RC and HDCC slab specimens, respectively. Furthermore, the ductility was evaluated using the ratio of yield deflection to maximum deflection, and it was confirmed that the HDCC slab test specimen exhibited the best ductility. This is most likely due to the fact that the inserted PE mesh separates the layers and increases ductility, while the HDCC passing through the mesh prevents the loss of load carrying capacity due to layer separation.