• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4757-4761
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• 2012

LED chip on board(COB) package has been fabricated using aluminum substrate and aluminum anodization process. An alumina layer, used as a dielectric in COB substrate, is produced on aluminum substrate by selective anodization process. Also, selective anodization process makes it possible to construct a thermal via with a fully-filled via hole. Two types of the COB package are fabricated in order to analyze the effects of their substrate types on thermal resistivity and luminous efficiency. The aluminum substrate with the thermal via shows more improved measurement results compared with the alumina substrate. These results demonstrate that selective anodization process and thermal via can increase heat dissipation of COB package in this work. In addition, it is proved experimentally that these parameters also can be enhanced using efficient layout of multiple chip in the COB package.

• Journal of the Korean Geosynthetics Society
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• v.10 no.4
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• pp.123-130
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• 2011

In the precedent study it was presented that the comparison of thermal resistivity using various backfill materials including river sand regarding water content, dry unit weight and particle size distribution. Based on the precedent study, this study focused on developing the optimized backfill material that would improve the power transfer capability and minimize the thermal runaway due to an increase of power transmission capacity of underground power cables. When raw materials, such as river sand, recycled sand, crush rock and stone powder, are used for a backfill material, they has not efficient thermal resistivity around underground power cables. Thus, laboratory tests are performed by mixing Fly-ash, slag and floc with them, and then it is found that the optimized backfill material are required proper water content and maximum density. Through various experimental test, when coarse material, crush rock, is mixed with recycled sand, stone powder, slag or floc for a dense material, the thermal resistivity of it has $50^{\circ}C$-cm/Watt at optimum moisture content, and the increase of thermal resistivity does not happen in dry condition. The result of experiments approach the optimization of the backfill materials for underground power cables.

• Journal of Korean Tunnelling and Underground Space Association
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• v.19 no.2
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• pp.121-141
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• 2017

The thermal analysis of an underground power conduit for electrical cables is essential to determine their current capacity with an increasing number of demands for high-voltage underground cables. The temperature rises around a buried cable, caused by excessive heat dissipation, may increase considerably the thermal resistance of the cables, leading to the danger of "thermal runaway" or damaging to insulators. It is a key design factor to develop the mechanism on thermal behavior of backfilling materials for underground power conduits. With a full-scale field test, a numerical model was developed to estimate the temperature change as well as the thermal resistance existing between an underground power conduit and backfill materials. In comparison with the field test, the numerical model for analyzing thermal behavior depending on density, moisture content and soil constituents is verified by the one-year-long field measurement.

• Geophysics and Geophysical Exploration
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• v.18 no.3
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• pp.115-124
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• 2015

A modified electrical resistivity survey has been suggested and applied to a leakage detection problem of concrete barrage. We suggest the modified electrical resistivity methods using electrodes floating on the water and apply line current sources instead of conventional point current sources in order to facilitate simple analysis. In addition, the study introduced the following three variations of modified electrode array: Direct potential array, Parallel potential array and Cross potential array. These arrays were tested and investigated through numerical experiment, physical model experiment and geophysical field exploration in order to verify their applicability to the water leakage detection of a concrete barrage. When water leakage occurred, all kind of array operations demonstrated distinct changes of aspects of potential difference in graphs obtained by not only the numerical and physical model experiments but also geophysical field exploration. Therefore, this modified electrode arrays of electrical resistivity survey, which has been adapted to the concrete barrage, has been found to be a useful method to detect water leakage.

• 전기의세계
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• v.27 no.6
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• pp.14-20
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• 1978

열설계의 목적은 장치 또는 시스템에 있어서 주어진 전기적, 기계적, 조건 및 신뢰성, 보전성, 가격등의 요구조건에 따라 열원에서 최종적인 heat sink까지 열을 능률적으로 전파하는데 있다. 즉 장치전체의 온도를 낮추거나, 부품 또는 장치내의 온도를 균일하게 함으로서 안정된 동작을 할 수 있게 설계하는 것을 말한다. 전자공학분야의 열설계는 부품과 장치의 두 영역으로 구분할 수 있으나 장치의 열설계는 부품자체와 부품간의 접속에서의 전체적인 열적 조화를 의미하므로 여기서는 개별소자 특히 Power Transistor를 중심으로 I, II부로 나누어 열적 문제점에 관해 소개하고자 한다.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 1998.05a
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• pp.95-103
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• 1998

오늘날 전기 철도 차량의 속도제어방식에는 A.C모터의 속도를 제어하는 방식을 많이 사용하고 있고 이 경우 여러 개의 GTO thyristor와 다이오드가 필요하다. 그런데 이러한 반도체 소자들은 전기 부하의 일부를 저항열로 소모하며 반도체의 용량에 따라 차이가 있으나 전기 철도 차량의 경우 약 1~2㎾의 열이 발생한다. 따라서 이들 소자들이 적정온도범위(100~12$0^{\circ}C$미만)를 유지하기 위해서는 소자의 내부저항열을 외부로 방출시켜야 한다. 지난 30여 년 동안 이러한 반도체 소자 냉각에는 강제대류, 침적 비등, 히트파이프식 냉각방법이 적용되어 왔다. 최근에는 히트파이프식 냉각방법이 유지보수, 크기 및 중량 등 여러 측면에서 상대적으로 유리하기 때문에 히트파이프식 냉각방법을 주로 사용하고 있다. (중략)

• Proceedings of the KAIS Fall Conference
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• 2008.05a
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• pp.43-45
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• 2008

박막 제작공정은 반도체 제작 공정, 고정밀도의 하드디스크 및 레이저 디스크 기술, LCD/P에 DML평판 디스크 플레이어 제작 공정에 있어 중요한 기술이다. 더욱이, 이 공정은 이동 전화 커버의 증착 및 전자 차폐의 일반기술, 램프의 반사판, 화장품 용기, 몇몇 상품에 있어 카메라 렌즈의 광학 표면 코팅과 코팅 필름 제작에 사용된다. 본 연구의 주요목적은 반도체 제작 공정과 많은 산업 분야에서 기본 재료로 사용되는 전영저항의 개발에 있다. 개발 공정은 다음과 같다. 전자빔이 최상의 진공 분위기에서 텅스텐 필라멘트의 열에 의해 방출된다. 그때 전자는 높은 전압에서 가속화된다. 전자들은 반대 재료에 충돌되고, 반대편 재료는 발생 열에 의해 코팅된다. 1차년도 연구목적은 고성능 전열 저항체 개발을 위한 지름 당 필라멘트 선의 기계적 특성을 조사하고 CAE 해석을 수행하며, 2차 년도에는 대량 생산 라인 구축을 위한 자동검사 라인 개발에 초점이 맞추어져 있다. 만일, 본 연구를 통해 전열 저항체가 개발된다면, 그 제품은 고효율, 외국제품 대비 가격 경쟁력을 가지므로 제품 경쟁력을 가질 수 있을 것으로 생각된다.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.199.1-199.1
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• 2010

Use of recycled aggregates that are constituents of concrete or asphalt-based structures has become popular because the recycling is an eco-friendly way to overcome the depletion of natural aggregates. In order to adopt the recycled aggregates for backfilling a power transmission pipeline trench, their thermal resistivity should be low enough to prevent thermal runaway in the transmission system. In this study, a series of laboratory tests with QTM-500 and KD2 Pro was performed to measure the thermal resistivity of recycled aggregates prepared from various sources. Relationships between the thermal resistivity of recycled aggregates and the water content have been obtained with consideration of compaction effort. Similar to natural soils, the thermal resistivity of the recycled aggregates decreases with increasing the water content. In addition, this study compared the experimental data with conventional prediction models for the thermal resistivity in the literature, which suggests the availability of the recycled aggregates as backfill material substituting for natural aggregates when backfilling the power transmission pipeline trench.

• Applied Chemistry for Engineering
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• v.9 no.2
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• pp.214-219
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• 1998

The transparent conducting tin oxide films were deposited on g1ass substrates by the ultrasonic spray pyrolysis. Examined were effects of deposition parameters on the electrical resistance, optical transmittance, crystal structure, and thickness of tin oxide films. As both the deposition time and concentration of tin(IV) chloride increase, the deposited tin oxide films exhibited the decrease of electrical resistance and optical transmittance in the visible and near infrared region. With increasing heat-treatment temperature in air, the deposited tin oxide films showed the enhanced electrical resistance and optical transmittance. This study suggests that the ultrasonic spray pyrolysis may be a promising deposition technique effectively to prepare transparent conducting films of good quality in a single step.

• Journal of the Korean Geotechnical Society
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• v.19 no.1
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• pp.201-207
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• 2003

In this paper, the utilization of waste foundry sand produced in the molding process is studied as a backfill material for underground electric utility systems such as concrete box structures and pipe lines for power supply. The physical, chemical and thermal properties for waste foundry sand are investigated far mechanical stability, environmental hazard and power transmission capacity Also its properties are compared with those of the natural river sand. The test results show that waste foundry sand can be utilized for underground concrete box structures as a backfill material; however, it can not be applied to underground pipe lines due to high thermal resistivity or low power transmission capacity.