• Journal of the Korea institute for structural maintenance and inspection
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• v.23 no.6
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• pp.113-119
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• 2019

This study aims at the analysis using the Resistivity Estimation Model (REM) to examine the effect of specimen size on the measurement of electrical resistivity. In the experiment, specimens of concrete were fabricated and the apparent resistivity was measured for each electrode interval. The apparent resistivity measured was found to be distorted in the apparent resistivity as the specimen size became smaller and closer to the outside (edge). As a result of comparing the experimental and analysis values, it is expected that REM can be used to examine the effect of the size of the specimen.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.8
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• pp.39-48
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• 2016

In this paper, we propose thermal resistance compact model of FinFET structure that has hexagon shaped source/drain. The heating effect and thermal properties were increased by reduced size of the device, and thermal resistance is an important factor to analyze the effect and the properties. The heat source and each contact that is moved heat out were set up in transistor, and domain is divided by the heat source and the four parts of contacts : source, drain, gate, substrate. Each contact thermal resistance model is subdivided as a easily interpretable structure by analyzing the temperature and heat flow of the TCAD simulation results. The domains are modeled based on an integration or conformal mapping method through the structure parameters according to its structure. First modeled by analyzing the thermal resistance to a single fin, and applying the change in the parameter of the channel increases to improve the accuracy of the thermal resistance model of the multi-fin/ finger. The proposed thermal resistance model was compared to the thermal resistance by analyzing results of the 3D Technology CAD simulations, and the proposed total thermal resistance model has an error of 3 % less in single and multi-finl. The proposed thermal resistance model can predict the thermal resistance due to the increase of the fin / finger, and the circuit characteristics can be improved by calculating the self-heating effect and thermal characterization.

• Journal of the Korean Society of Marine Environment & Safety
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• v.20 no.4
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• pp.419-425
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• 2014

The current work investigated the variation of numerical solutions according to the grid number, the distance of the first grid point off the ship surface, turbulence modeling and discretization. The subject vessel is KVLCC. A commercial code, Gridgen V15 and FLUENT were used the generation of the ship hull surface and spatial system and flow computation. The first part of examination, the effect of solutions were accessed depending on the grid number, turbulence modeling and discretization. The second part was focus on the suitable selection of the distance of the first grid point off the ship surface: $Y_P+$. When grid number and discretization were fixed the same value, the friction resistance showed differences within 1 % but the pressure resistance showed big differences 9 % depending on the turbulence modeling. When $Y_P+$ were set 30 and 50 for the same discretization, friction resistance showed almost same results within 1 % according to the turbulence modeling. However, when $Y_P+$ were fixed 100, friction resistance showed more differences of 3 % compared to $Y_P+$ of 30 and 50. Whereas pressure resistance showed big differences of 10 % regardless of turbulence modeling. When turbulence modeling and discretization were set the same value, friction, pressure and total resistance showed almost same result within 0.3 % depending on the grid number. Lastly, When turbulence modeling and discretization were fixed the same value, the friction resistance showed differences within 5~8 % but the pressure resistance showed small differences depending on the $Y_P+$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.10a
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• pp.137-138
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• 2016

본 연구에서는 기술수용모델과 혁신확산이론을 기반으로 스마트폰 혁신기술 저항에 관한 재사용 의도에 미치는 영향을 알아보고자 한다. 외부변수는 기술수용모델의 인지된 유용성과 인지된 사용 용이성 그리고 혁신확산이론의 적합성과 복잡성을 4개 변수를 두고자 한다. 예측변수는 혁신저항 변수를 두고 재사용의도에 미치는 영향으로 하여 개념모델을 완성하였다. 또한 혁신저항 변수가 인지된 위험 요인을 매개하여 재사용의도에 미치는 영향을 알아보고자 하였다. 연구대상은 부산 경남지역 및 전북지역에 거주하는 스마트폰 사용자를 대상으로 설문을 통해 자료를 수집하고자 한다. 인구통계학인 분석은 IBM SPSS Statistics 19로 하고 확인적 요인분석과 변수들 간의 인과관계에 대한 경로분석은 Smart PLS를 사용하여 분석하고자 한다. 분석결과를 바탕으로 이론적 실무적 시사점을 제시하고자 한다.

• Journal of Convergence for Information Technology
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• v.11 no.3
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• pp.107-124
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• 2021

This study is a study on the innovation resistance that may arise in connection with the introduction and use of smart factory-related technologies by SMEs. It is to study the effect of the leading factors of innovation resistance on innovation resistance and the effect of innovation resistance on use intention by using the extended innovation resistance model. A total of 176 survey data were used for the study, and the study was conducted using SPSS 25 and Smart PLS 2.0. Relative advantage, suitability, perceived risk, social impact, and organizational characteristics have a significant effect on innovation resistance, and innovation resistance was tested to have a significant effect on the intention to use. As an implication according to the research, a plan to improve the level of introduction and use of smart factories using the expanded innovative storage model was presented by dividing positive and negative factors, and factors that should be improved and factors that should be reduced are presented. It was specifically presented.

• Journal of the KSME
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• v.26 no.3
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• pp.200-203
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• 1986

본 해설에서는 이론적 해석의 접근방법을 통하여 열접촉 저항의 기본적인 구조를 이해하는데 목적을 두었으며, 여러형태의 이론적 모델중에서 비교적 단순한 Cetinkale & Fishenden 의 연구 결과를 이용하여 이 모델에 포함된 각 인자들을 실제표면에 대해 어떻게 적용하는가를 검토하 였다.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.31 no.4A
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• pp.323-329
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• 2011

Most current design codes of concrete structures adopt the partial safety factor format to assure the proper safety margin or reliability against various limit states as a practical design tool. The safety factors, load and resistance factors and so on, are determined based on the theory of structural reliability, which takes into account the statistical uncertainties of both loads and resistances. The establishment of statistical models for load and resistance should be preceded the application of reliability theory. In this paper, especially the influence of the statistical variations of resistance models, which are described in terms of strength of concrete, strength of reinforcements and sectional dimensions and so on, are examined and the probabilistic models for resistance of reinforced concrete members were developed. The statistical data were collected on local tests and experiments in Korea and the Monte Carlo simulation (MCS) technique was used. The results of this paper may be useful and valuable in calibration of design code in this country.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.5
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• pp.54-61
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• 1999

We suggested a macro medel for MOS transistors, which incorporates the distributed substrate resistance by using a method which utilizes external diodes on SPICE MOS model. By fitting the simulated s-parameters to the measures ones, we obtained a model set for the W=200TEX>$\mu\textrm{m}$ and L=0.8TEX>$\mu\textrm{m}$ NMOS transistor, and also analyzed the effects of distributed substrate resistance in the RF range. By comparing the physical parameters calculated from simulated s-parameters such as ac resistances and capacitances with the measured ones, we confirmed the validity of the simulation results. For the frequencies below 10GHz, it seems appropriated to use a simple macro model which utilizes the existing SPICE MOS model with junction diodes, after including one lumped resistor each for gate and substrate nodes.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.3
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• pp.259-265
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• 2016

Recently, life prediction models for Pb-based and Pb-free solders used in chip resistor assemblies under thermal cycling have been introduced. The models suggest that the field lifetimes of Pb-free solders would be better than those of Pb-based solders when used for chip resistors under thermal cycling conditions, while the lifetime of the chip assemblies under accelerated test conditions show a reverse relationship. In this study, the prediction models were verified by applying the model to another research case. Finite element models were built, thermal cycling conditions were applied, and the energy densities were calculated. Finally, life prediction analysis was conducted for the cases where Pb-based and Pb-free solders were used. The prediction results were then compared with the test data of the case. It was verified that the predictions of the developed life cycle models are on the practical scale.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.3
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• pp.545-550
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• 2017

When the systolic blood pressure is high, intermittent turbulence in blood flow appears in the aorta and carotid artery with stenosis during the systolic period. The turbulent blood flow is difficult to analyze using the Newtonian turbulence model due to the viscous characteristics of blood flow. As the shear rate is increased, the blood viscosity decreases by the viscoelastic properties of blood and a drag reduction phenomenon occurs in turbulent blood flow. Therefore, a new non-Newtonian turbulent model is required for viscoelastic fluid and hemodynamics. The main aims of this study were to develop a non-Newtonian turbulence model using the drag reduction phenomenon based on the standard $k-{\varepsilon}$ turbulent model for a general non-Newtonian fluid. This was validated with the experimental data and has a good tendency for non-Newtonian turbulent flow. In addition, the computation time and resources were lower than those of the low Reynolds number turbulent model. A modified turbulent model was used to analyze various turbulent blood flows.