• Proceedings of the KAIS Fall Conference
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• 2002.05a
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• pp.67-69
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• 2002

주얼리 제품에서 마스터패턴 제작비는 최종제품의 20% 정도로 전체 주얼리제품 시장에서 매우 큰 비중을 차지한다. 기존 주얼리 제품을 제작하는 일반 공정인 ‘디자인 시안→상세도면 제작→1왁스형 제작→석고 플라스크 제작→은 마스터패턴의 제작→왁스패턴의 대량생산→정밀주조→최종제품’의 복잡한 단계를 ‘CAD 디자인 시안→쾌속조형기 듀라폼 음각몰드 제작→저융점 합금으로 마스터패턴 제작→정밀주조→최종제품’의 공정으로 단순화하면서도 대폭시간을 단축할 수 있는 신공정을 제안하였다. 주요공정인 selective laster sintering (SLS)형 쾌속조형기(rapid prototype: RP)를 이용해서 분해온도가 190℃인 듀라폼 분말로 미리 3D CAD로 설계한 직경 20mm의 구, 링 요소를 각각 상하형의 합체형 몰드와 일체형 몰드로 제작하였다. 제작된 몰드에 융점이 70℃인 Pb-Sn-Bi-Cd 저융점 합금을 주입하여 마스터패턴을 제조하였다. 완성된 마스터패턴은 목표형상에 비해 치수 변형율이 2% 이내로 우수하고 주입공정 및 후가공공정이 용이하여 주얼리용 마스터패턴으로 응용이 가능하였다.

• Journal of Welding and Joining
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• v.27 no.3
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• pp.23-31
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• 2009

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.1-10
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• 2022

Recently, semiconductor devices have been used in many fields owing to various applications of mobile electronics, wearable and flexible devices and substrates. During the semiconductor chip bonding process, the mismatch of coefficient of therm al expansion (CTE) between the substrate and the solder, and the excessive heat applied to the entire substrate and components affect the performance and reliability of the device. These problems can cause warpage and deterioration of long-term reliability of the electronic packages. In order to improve these issues, many studies on low-melting temperature solders, which is capable of performing a low-temperature process, have been actively conducted. Among the various low-melting temperature solders, such as Sn-Bi and Sn-In, Sn-58Bi solder is attracting attention as a promising low-temperature solder because of its advantages such as high yield strength, moderate mechanical property, and low cost. However, due to the high brittleness of Bi, improvement of the Sn-Bi solder is needed. In this review paper, recent research trends to improve the mechanical properties of Sn-Bi solder by adding trace elements or particles were introduced and compared.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.146-146
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• 1994

• Korean Journal of Materials Research
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• v.10 no.6
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• pp.392-397
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• 2000

The effect of pressure on the phase transformation in Fe-30Ni-0.35C Alloy and pure metals was investigated by using PDSC(pressure differential scanning calorimeter). As the pressure increased from 1 atm to 60 atm, the $A_s$points of the ausformed martensite and the marformed martensite in Fe-30Ni-0.35C Alloy were lowered about $2~4^{\circ}C$ at reverse transformation. This is why the volume change came down at phase transition(from martensite to autenite). As the pressure increased from 1 atm to 60 atm, $A_f$ points were constant or slightly increased. This is due to the promotion of carbide precipitation with increasing pressure. The enthalpy change of the ausformed martensite in Fe-30Ni-0.35C Alloy was increased by 10~14J/g. The melting points of the pure metals, Se, Sn, Pb, Zn and Te were slightly increased with increasing pressure. The enthalpy changes of the pure metals at melting were little changed or slightly increased with increasing pressure.

• Journal of the Microelectronics and Packaging Society
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• v.3 no.1
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• pp.25-32
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• 1996

본 연구에서는 BaTiO3에 Sr과 Pb를 치환시켜TiO3 조성의 세라믹 유전체를 제조한 후 페로브스카이트형 Ba(Cu, Mo)O3를 저융점 flux 로 첨가하여 120$0^{\circ}C$ 이하의 여러온도에 서 소결을 행하였으며 flux 첨가량의 변화에 따른 소결거동 및 유전 특성의변화를 조사하였 다. 이러한 저온 소결용 유전체 세라믹스가 MLCC의 응용시 Pt-Pd계의합금을 내부전극으로 사용가능성을 검토하였다. Flux를 4mol%첨가한 TiO3-0.04Ba(Cu,Mo)O3 조성의 유전체는 120$0^{\circ}C$의 온도에서 2시간 소결했을 경우 소결밀도는 이론밀도의 95% 에 근접하였으며 이때 의 비유전율은 8000이상을 나타내었다. 이러한 소결 온도의 감소는 저융점인 ba(Cu,Mo)O3 계의 flux가 첨가되면서 비교적 낮은 온도에서 액상을 형성하여 소결을 촉진시켰기 때문으 로 사료된다.

• Korean Journal of Materials Research
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• v.8 no.11
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• pp.1011-1019
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• 1998

This work designed Sn-5%Pb-1.5%Ag-x%In solder alloy to develop the solder alloy with low Pb content. This solder alloy doesn't cause environmental pollution. and this study reviewed the probability of replacement of Sn-37%Pb solder as evaluation of melting range, wettability. microstructure, microhardne'ss, tensile strength, drossability of this new solder alloys. The level of international regulation in dissolution amount of Pb ion was 3ppm. But dissolution amount of Pb ion in Sn-5%Pb solder alloy confirmed not to threat the global environmental is 0.46ppm. The melting range of this solder alloy was $183-192^{\circ}C$. Also the range of solidification was very narrow within $5^{\circ}C$. The wettability was similar to Sn-37%Pb solder, and the effect of amount of In addition of wettability couldn't be founded. The probability of replacement in the melting range and wettability is very high. And microhardness of this solder alloy was 1.5 times of conventional type solder. Tensile strength of new solder alloys was a little high than that of conventional type solder. With increasing amount of In% addition, tensile strength was increased, but elongation was decreased. The solder alloy of l%In addition revealed AgSn and Pb on dendrite microstructure boundary, and $Ag_3Sn$, $Ag_3In$ and Pb were revealed on it at the solder alloy of 3% In addition. The drossability was superior to Sn-37%Pb solder alloy and the solder alloys of 2% In addition was not generated for 3hrs.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.232-234
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• 2007

This study conducts numerical simulations of Isotropic conductive adhesives using low melting point alloy fillers during the reflow process. The CIP method and predictor-corrector method are used to simulate more accurately on free surface flow of low melting point alloy fillers. For finding out optical conditions to obtain reliable conduction paths, the present study conducts extensive numerical simulations.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.3 no.2
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• pp.110-114
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• 2002

The master pattern manufacturing process is one of the most important processes in jewelry industry because the process takes 20% of total jewelry manufacturing costs. The previous jewelry manufacturing process has many steps of "rough design${\leftrightarro}$ detailed drawing${\leftrightarro}$ wax pattern manufacturing ${\leftrightarro}$ lime soda flask mold manufacturing ${\leftrightarro}$ silver master pattern manufacturing ${\leftrightarro}$ mass production of wax pattern ${\leftrightarro}$ investment casting process ${\leftrightarro}$ final jewelry product." A novel process that reduces processing steps by using a rapid prototyping system (RP) has been suggested. The process is "3D CAD design ${\leftrightarro}$ DuraForm mold manufacturing by RP ${\leftrightarro}$ manufacturing master pattern by low melting alloy ${\leftrightarro}$ mass production of wax pattern ${\leftrightarro}$ investment casting process${\leftrightarro}$ final jewelry product." Molds are made with DuraForm powder, of which melting temperature is 19$0^{\circ}C$, by a selective laster sintering type RP. An alloy of Pb-Sn-Bi-Cd, of which melting temperature is $70^{\circ}C$, is casted in the DuraForm molds. Spheres and rings of diameter 20 mm are made by this process. The dimension deformation rate is less than 2%, and the post processing of the castings is convenient. The casting made by the suggested process can be used as a master pattern of jewelry products.of jewelry products.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.157-157
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• 2003

TiAl 금속간화합물은 저밀도, 고용융점 및 우수한 고온강도 둥의 여러 장점을 지녀 고온의 열악한 부식성 분위기에 노출되는 가스터빈, 자동차 엔진부품 등에 사용하기 위해 최근 활발한 연구가 진행되고 있다. 그러나 이 합금의 실용화에 장애가 되는 가장 큰 문제점은 나쁜 저온인성, 고온가공의 어려움 및 고온에서의 나쁜 내산화성이다. 일반적으로 V는 상온연성을 증진시키지만 내산화성을 감소시키고, Nb는 상온연성과 내산화성을 증진시키는 원소이다. 또한 Mo는 강도와 연성을 증진시킨다. 이들 첨가원소의 산화특성을 비교분석하기 위하여 고온산화실험을 실시하고, 산화막의 구조, 산화막의 종류 및 형성과정을 SEM/EDS, EPMA 및 XRD을 이용하여 조사하였다.