• Proceedings of the Korean Ceranic Society Conference
• /
• 2003.10a
• /
• pp.149.2-149
• /
• 2003

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.8 no.4
• /
• pp.626-633
• /
• 1998

For the fabrication of low temperature cofirable glass/ceramic with high dielectric constant, crystallizing glass [$SiO_2-TiO_2-RO (RO:BaO, CaO:SrO)$] was formed. The glass/ceramic composites were made by mixing this glass and alumina ceramic as filler, and its characteristics was investigated. With this glass compositon, it was possible to fabricate the glass which could be crystallized under $900^{\circ}C$. And it was found that the crystallizing temperature was changed in accordance with the composition of RO in glass. By adding $Bi_2O_3$ as flux, using $Al_2O_3$ as filler and sintering at $860^{\circ}C$, low temperature cofirable glass/ceramic with high dielectric constant was fabricated. The density of that composites was 3.96 g/$\textrm{cm}^3$, dielectric constant was 17 and Q. f was 600.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05c
• /
• pp.245-248
• /
• 2003

저온동시소성 세라믹으로 제작된 모듈을 고주파 대역에 적용할 경우 dimension의 오차는 모듈 특성의 오차를 유발시킨다. Constrained sintering 기술은 XY 방향의 수축을 억제시킴으로써 세라믹 소결체의 dimensional tolerance를 향상시키기 위하여 개발된 기술이다. LTCC의 소성온도에서는 수축하지 않는 비소성층을 LTCC 적층체의 위 아래에 함께 적층시킴으로써 XY 방향의 수축은 기계적으로 억제되며, 두께 방향으로만 수축이 일어난다. 본 연구에서는 LTCC 기판을 constrained sintering 방법으로 소성하고, 그 특성값을 일반적인 소성방법으로 제작하였을 때와 비교하였다. 알루미나 테잎의 제조조건 빛 적층조건을 변화시켜 이에 따른 면수축 제어 특성의 변화를 고찰하였다. 실험결과 알루미나 테잎의 고형분 용량과 부착층의 두께가 면수축 제어를 위하여 고려되어야할 주요 인자임을 확인할 수 있었다.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.4
• /
• pp.35-41
• /
• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of the Korean Ceramic Society
• /
• v.31 no.4
• /
• pp.381-388
• /
• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.225-229
• /
• 2005

We have designed micro-fuel processor system, which consists of a steam reforming area and a PROX(preferential oxidation) area. Micro-fuel processor system generates $H_2$ rich gas from a methanol. In our experiment, we have integrated micro-fuel processor system using low temperature cofired ceramics (LTCC) process because LTCC is superior to other materials principally due to their high thermal and chemical stability, simpler fabrication processes, and lower materials cost. Therefore, we have studied and integrated micro-fuel processor system containing embedded heaters, cavities, and 3D structures of micro-channel with LTCC. Also we have optimized the LTCC process.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.03a
• /
• pp.71-71
• /
• 2003

최근 통신용 전자부품의 소형화, 저가격화, 고기능화의 요구가 점점 더 증대되고 있으며 이를 위해서 기판의 배선밀도를 높이는 것과 개별 부품 또는 모듈의 크기와 무게를 줄이는 것이 절실히 필요하다. 본 연구에서는 저융점의 phosphate계 유리 프릿의 첨가를 통해 LTCC (Low Temperature Co-fired Ceramic) 에 적용 가능한 조성을 개발하고자 하였다. 마이크로파 용 유전재료로서 널리 사용되고있는 BNT (BaO-Nd$_2$O$_3$-TiO$_3$) 계 세라믹스에 저융점 유리 프릿의 양을 10-30wt% 범위로 변화시키면서 900-110$0^{\circ}C$ 범위에서 소결하여 이에 따른 수축률 변화와 상대밀도의 변화를 조사하였다 유리 프릿으로 P$_2$O$_{5}$-ZnO-BaO-Nd$_2$O$_3$ 계, P$_2$O$_{5}$-SnO-ZnO 계 2가지 조성의 유리를 사용하였다 그 결과로 소결체의 상대밀도는 소성온도가 900-110$0^{\circ}C$ 로 증가함에 따라 85-96% 로 증가하였고, 그 수축률은 소결온도 100$0^{\circ}C$ 에서 급격히 증가하였다. 이러한 결과는 저온 동시소성 세라믹 조성의 사용을 위해 좋은 결과가 예상된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.39-39
• /
• 2008

이동통신 시스템의 소형화, 다기능화 추세에 따라 이동통신 부품들의 모듈화, 고집적화 추세로 급진전되고 있어, 고집적 세라믹 기판 모듈 제작을 위한 핵심공정 기술인 그린시트의 층간 정밀도 및 소성후 수축율 제어의 중요성이 증대되고 있다. 본 연구에서는 일축가압 이용한 PAS(Pressure Assisted Sintering) 법과 Al2O3를 희생층으로 이용한 Constrained Sintering법을 혼합하여 저온 동시소성 세라믹 기판의 x-y 축 수축율을 zero로 제어하고자하였다. $Al_2O_3$/LTCC/$Al_2O_3$인 샌드위치 구조로 세라믹 시트를 적층하여 Load 값과, LTCC 두께에 따른 x-y축, z축 소성 수축율 및 Edge Curvature의 Radius와 warpage 현상을 관찰하고, 이때 미세구조 및 밀도를 측정하였다. 그 결과 symmetic한 구조일 때 소성온도 $900^{\circ}C$에서 $Al_2O_3$ 두께가 $30{\mu}m$ 이상일 때 LTCC의 글라스가 $Al_2O_3$에 Infiltration 되는 두께는 $30{\mu}m$를 나타내었다. 또한 $Al_2O_3$ 두께 $500{\mu}m$, LTCC 두께 $2,000{\mu}m$, Load값이 800g/$cm^2$ 일 때 x-y 축 수축율<1%, z축 수축율 40%, 소결밀도는 2.99g/$cm^3$로 우수한 무수축 기판 특성을 나타내었다.

• Journal of the Korean Ceramic Society
• /
• v.41 no.8
• /
• pp.599-604
• /
• 2004

The LTCCs (Low-Temperature Co-fired Ceramics) are very important for electronic industry to build smaller RF modules and to fulfill the necessity for miniaturization of devices in wireless communication industry. The dielectric materials with sintering temperature $T_{sint}$＜90$0^{\circ}C$ are required. In this study, BaO-N $d_2$ $O_3$-Ti $O_2$ (BNT ： 20∼40 wt％) for ceramic materials and L $a_2$ $O_3$- $B_2$ $O_3$-Ti $O_2$ (LBT ： 80∼60 wt％) for crystallizable glasses were used. The glass/ceramic composites were investigated for sintering behavior, phase evaluation, densities, interface reaction and microwave dielectric properties. It was found that the addition LBT glass frist significantly lowered the sintering temperature to below 90$0^{\circ}C$ and the densification with increasing addition LBT glass frist developed rapidly which was meant to be namely 90％ of relative density. The sintered bodies ekhibited applicable dielectric properties, namely 15 for $\varepsilon$$_{r}$,, 10000 GHz for Q＊ $f_{0}$. The results suggest that the composites have good potential as a new candidate for LTCC materials.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.28 no.1
• /
• pp.38-43
• /
• 2018

Ceramic membrane has been widely used for water treatment due to its advantages of eco-friendly property and low energy consumption. However, high porosity of ceramic membrane higher than 40 % may cause a problem of strength, when it is applied to a water treatment module. In order to solve this problem, the strength of the membrane edge was improved by using the ceramic glaze. Four different glaze compositions for low temperature sintering was selected to minimize the deformation of the membrane microstructure. After coating with low temperature glaze, cracks were observed due to differences in thermal expansion coefficient between the membrane and glaze. Thus, the thermal expansion coefficient of glaze was controlled by addition of cordierite and petalite. As a results, the compressive strength of the ceramic membrane, which was coated with the optimized glaze composition, was increased from $27N/m^2$ to $117N/m^2$, indicating that the glaze coating can improve the disadvantages of the fragile ceramic membrane.