• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.69-72
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• 2000

기판과의 동시소성에 의한 고주파 MCM-C(Multi-Chip-Module-Cofired)용 저항을 제작하고 6 GHz 까지의 RF 특성을 측정하였다. 기판은 저온 소성용 기판으로서 총 8층으로 구성하였으며, 7층에 저항체 및 전극을 인쇄하고 Via를 통하여 기판의 최상부까지 연결되도록 하였다 저항체 Pastes, 저항체의 크기, Via의 길이 변화에 따라서 저항의 RF 특성은 고주파일수록 더욱 DC 저항값에서부터 변화되는 양상을 보였다. 내부저항의 등가회로를 구현한 결과, 저항은 전송선로, Capacitance 성분이 혼재되어 있는 것으로 나타났으며 전극의 형태에 따라 Capacitance 성분이 많은 차이를 나타내었다.

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• Proceedings of the KAIS Fall Conference
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• 2004.06a
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• pp.86-88
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• 2004

본 연구에서는 고주파 이동통신 기기용 칩형 세라믹 안테나의 사용을 위한 저유전율 및 저온동시소성이 가능한 CaO-B2O3-SiO2계 유리를 제조하고자 하였다. 제조된 CaO-B2O3-SiO2계 유리는 열분석을 통하여 낮은 연화온도를 갖는 안정한 유리조성을 선정하였다. 유리분말을 이용하여 성형된 샘플은 소결온도에 따른 특성을 조사하였다. 소결온도변화에 따라 유전율(${\epsilon}_r$)은 4-4.5값을 나타냈으며, 유전손실(tan$\delta$)은 <$0.1\%$ 보였으나, 품질계수(Q$\times$f)는 큰 변화폭을 보였다.

• Korean Journal of Materials Research
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• v.33 no.12
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• pp.537-549
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• 2023

The sintering shrinkage behaviors of low temperature cofired ceramics (LTCC) and resistors were compared using commercial LTCC and thick-film resistor pastes, and factors influencing the camber of cofired resistor/LTCC bi-layers were also investigated. The onset of sintering shrinkage of the resistor occurred earlier than that of LTCC in all resistors, but the end of sintering shrinkage of the resistor occurred earlier or later than that of LTCC depending on the composition of the resistor. The sintering shrinkage end temperature and the sintering shrinkage temperature interval of the resistor increased as the RuO₂/glass volume ratio of the resistor increased. The camber of cofired resistor/LTCC bi-layers was obtained using three different methods, all of which showed nearly identical trends. The camber of cofired resistor/LTCC bi-layers was not affected by either the difference in linear shrinkage strain after sintering between LTCC and resistors or the similarity of sintering shrinkage temperature ranges of LTCC and resistors. However, it was strongly affected by the RuO₂/glass volume ratio of the resistor. The content of Ag and Pd had no effect on the sintering shrinkage end temperature or sintering shrinkage temperature interval of the resistor, or on the camber of cofired resistor/LTCC bi-layers.

• Journal of the Korean Ceramic Society
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• v.41 no.8
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• pp.599-604
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• 2004

The LTCCs (Low-Temperature Co-fired Ceramics) are very important for electronic industry to build smaller RF modules and to fulfill the necessity for miniaturization of devices in wireless communication industry. The dielectric materials with sintering temperature $T_{sint}$＜90$0^{\circ}C$ are required. In this study, BaO-N $d_2$ $O_3$-Ti $O_2$ (BNT ： 20∼40 wt％) for ceramic materials and L $a_2$ $O_3$- $B_2$ $O_3$-Ti $O_2$ (LBT ： 80∼60 wt％) for crystallizable glasses were used. The glass/ceramic composites were investigated for sintering behavior, phase evaluation, densities, interface reaction and microwave dielectric properties. It was found that the addition LBT glass frist significantly lowered the sintering temperature to below 90$0^{\circ}C$ and the densification with increasing addition LBT glass frist developed rapidly which was meant to be namely 90％ of relative density. The sintered bodies ekhibited applicable dielectric properties, namely 15 for $\varepsilon$$_{r}$,, 10000 GHz for Q＊ $f_{0}$. The results suggest that the composites have good potential as a new candidate for LTCC materials.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.81-85
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• 2000

마이크로파대역에서 우수한 유전적 특성을 가지며 소결이 90$0^{\circ}C$ 이하에서 가능하여 Ag와 동시 소결이 가능한 유전체 조성을 개발하여 RF MCM-C(Multi-chip Module on Ceramic) 제조를 위한 유전체 테잎 제조에 대한 기초적인 실험과 Ag 전극과 동시소성에 대한 반응성 실험을 하였다. 본 실험에 앞서 개발된 유전체 조성의 마이크로대역에서의 유전특성은 유전율 24, 품질계수 30,000 이상, 공진주파수 온도계수 37 ppm/$^{\circ}C$ 이었고 소결온도는 85$0^{\circ}C$이었다. 이 유전체를 이용결함 없는 테잎 제조를 위한 유기용매의 선택, 바인더 및 가소제의 량 및 비에 따른 테잎의 소결 전 .후의 상태를 비교.분석하여 최적의 조성비를 결정하였다. 테잎과 은전극과의 반응성 실험결과 은과 유전체의 상호확산은 거의 이루어지지 않음을 확인하였다.

• Journal of the Korean Ceramic Society
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• v.40 no.2
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• pp.172-177
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• 2003

Effect of glass addition on the low-temperature sintering and microwave dielectric properties of $BaTi_4O_9$-based ceramics were studied to develop the materials for the functional substrate of low-temperature co-fired ceramics. When 10 wt% of glass was added, sufficient densification was obtained and the relative density more than 98% was reached at the sintering temperature of$875{\circ}C$. The microwave dielectric properties were k=32, Q＊f=9000 GHz, ${ au}_f$=10 ppm/${\circ}C$. As the amount of glass increased, phase decompositions from $BaTi_4O_9;to;BaTi_5O_{11};and;Ba_4Ti_{13}O_{30}$ was observed.

• Applied Chemistry for Engineering
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• v.18 no.4
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• pp.350-355
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• 2007

The effect of moisture in flue gas on SCR reaction of NMO (Natural Manganese Ore) was studied. The experiments were performed over NMO with NO, $NH_3$ at independent condition or simultaneous condition. $NH_3$ can be oxidized at low temperature by the lattice oxygen in NMO catalyst. The concentration of NO and $NO_2$ by $NH_3$ oxidation with moisture is higher above $300^{\circ}C$ than that without moisture. Moisture would competitively adsorb with NO and $NH_3$ on NMO catalyst. It caused poor NOx conversion to compete against $H_2O$. Besides the NOx conversion efficiency was reduced at below $250^{\circ}C$ because of the dipped $H_2O$ competitively adsorbed $NH_3$. The reactivity of NMO varied with the calcination temperature and the optimum calcination temperature was $400^{\circ}C$ regardless $H_2O$.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.482.1-482.1
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• 2014

고효율 셀 및 생산 단가 절감은 결정질 실리콘 태양전지에서 가장 중요시되고 있는 이슈이다. 그 중 박형 실리콘 웨이퍼를 사용하는 공정은 고효율 및 생산단가의 절감을 만족시킬수 있는 방안으로 개발되고 있으며, 전면 전극 재료인 Ag를 다른 금속 재료로 대체하는 방법 또한 단가 절감을 위한 방안으로 연구가 진행 중이다. 하지만 박형 웨이퍼를 기존 공정에 적용할 시 전후면 전극 형성을 위한 고온의 소성 공정 때문에 웨이퍼의 휨 현상이 문제가 되고 있다. Cu 금속 분말의 저온 분사법을 결정질 실리콘 태양전지 전면전극 형성에 적용할 경우, 박형 실리콘 웨이퍼에 적용하는 문제와 Ag 전극의 대체 전극 사용 문제를 동시에 해결할 수 있는 대안이 될 것으로 사료된다. 본 연구에서는 Cold spray법을 사용하여 결정질 실리콘 태양전지 에미터 위에 Cu 전면 전극을 형성하였으며 반복되는 증착 횟수에 따른 전기적 특성 및 형상학적 특성 등을 평가하였다. 전극 형성 전의 Cu 분말 크기는 1~10 마이크론 이었으며, 주사전자현미경을 이용하여 전극의 형상 및 종횡비를 측정하였다. 또한 transfer length method (TLM) 패턴을 실리콘 웨이퍼 표면에 형성하여 접촉 저항 특성 및 전극의 비저항을 평가하였다.