• Title/Summary/Keyword: 저압공정

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Behavior of Hazardous Organic Compounds in Low-Pressure Nanofiltration Process (저압 나노여과 공정에서의 유해성 유기물질의 거동)

  • Oh, Jeong-Ik;Lee, Seockheon;Lee, Bo-Young
    • Journal of Korean Society of Water and Wastewater
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    • v.18 no.2
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    • pp.165-173
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    • 2004
  • Behavior of hazardous organic compounds including bisphenol A, phtalic acid, and phosphoric acid in low pressure nanofiltration process were investigated. In the case of NTR729HF, rejection of all target organic compounds except 2-H-Benzothiazol and 2-isopropyl phenol was more than 90%. The lowest rejection for 2-H-Benzothiazol was observed in another membranes. The UTC60 and UTC20 showed similar rejection characteristics of hazardous organic compounds. Although the rejection of Bisphenol A, n-buthyl benzenesulfoneamide, N-ethyl-p-toluensulfonamide, 2-H-benzothiazol, p-t-butylphenol and 2-isopropyl phenol was less than 30%, the rejection of tributyl phosphate, triethyl phosphate, camphor, 2,2,4 trimethyl 1,3 pentandiol and diphenyl amine was more than 90% in the case of UTC60 and UTC20. The rejection characteristics of various hazardous organic compounds were converted into one parameter Ks, which was proposed in the diffusion-convection model. The Ks of hazardous organic compounds were discussed by comparing with their solute size represented by Stokes radius. The diffusion convection model considering Ks was successful to interpret rejection characteristics of hazardous organic compounds by low-pressure nanofiltration membranes.

Development of particle focusing device to monitor various low pressure processes (다양한 조건의 저압 공정 모니터링을 위한 입자 집속 장치 개발)

  • Kim, Myungjoon;Kim, Dongbin;Kang, Sang-Woo;Kim, Taesung
    • Particle and aerosol research
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    • v.13 no.2
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    • pp.53-63
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    • 2017
  • As semiconductor process was highly integrated, particle contamination became a major issue. Because particle contamination is related with process yields directly, particles with a diameter larger than half pitch of gate should be controlled. PBMS (Particle beam mass spectrometry) is one of powerful nano particle measurement device. It can measure 5~500 nm particles at ~ 100 mtorr condition in real time by in-situ method. However its usage is restricted to research filed only, due to its big device volume and high price. Therefore aperture changeable aerodynamic lenses (ACALs) which can control particle focusing characteristics by changing its aperture diameter was proposed in this study. Unlike conventional aerodynamic lenses which changes particle focusing efficiency when operating condition is changed, ACALs can maintain particle focusing efficiency. Therefore, it can be used for a multi-monitoring system that connects one PBMS and several process chambers, which greatly improves the commercialization possibility of the PBMS. ACALs was designed based on Stokes number and evaluated by numerical method. Numerical analysis results showed aperture diameter changeable aerodynamic lenses can focus 5 to 100 nm standard particles at 0.1 to 10 torr upstream pressure.

Removal of Fe Impurities on Silicon Surfaces using Remote Hydrogen Plasma (리모트 수소 플라즈마를 이용한 Si 표면 위의 Fe 불순물 제거)

  • Lee, C.;Park, W.;Jeon, B.Y.;Jeon, H.T.;Ahn, T.H.;Back, J.T.;Shin, K.S.;Lee, D.H.
    • Korean Journal of Materials Research
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    • v.8 no.8
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    • pp.751-756
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    • 1998
  • Effects of remote hydrogen plasma cleaning process parameters on the removal of Fe impurities on Si surfaces and the Fe removal mechanism were investigated. Fe removal efficiency is enhanced with decreasing the plasma exposure time and increasing the rf-power. The optimum plasma exposure time and rf-power are 1 min and 100W. respectively, in the range below 10 min and 100W. Fe removal efficiency is better under lower pressures than higher pressures, and the optimum $\textrm{H}_2$ flow rate was found to be 20 and 60sccm, respectively, under a low and a high pressure. The post-RHP(remote hydrogen plasma) annealing enhanced metallic contaminants removal efficiency, and the highest efficiency was achieved at $600^{\circ}C$. According to the AFM analysis results Si surface roughness was improved by 30-50%, which seems to be due to the removal of particles by the plasma cleaning. Also. Fe impurities removal mechanisms by remote hydrogen plasma are discussed.

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Process Simulation of HCNG Refueling System (HCNG 충전 시스템 공정모사)

  • Kim, Sang-Min;Han, Jeong-Ok;Lee, Yeong-Cheol;Lee, Joong-Seong;Kim, Yong-Cheol;Chae, Jeong-Min;Hong, Seong-Ho
    • Journal of the Korean Institute of Gas
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    • v.17 no.5
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    • pp.1-7
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    • 2013
  • In this study, simulation work of HCNG refueling system was performed. The hydrogen was produced from steam reforming process by natural gas. The conversion of natural gas is increased as SCR is increased. but it was no significant difference more than 3 of SCR and fuel throughput is increased as GHSV is increased. Both conversion and fuel throughput levels was optimized when the $1700h^{-1}$ of GHSV. CNG was compressed from low pressure natural gas. For the mixing of $H_2$ and CNG is mixed with the high pressure conditions such as 400bar of $H_2$ and 250bar of natural gas. Single-stage compression was required more power than multi stage. So, multi stage compression was suggested for high pressure compression. We calculated the intermediate pressure to minimize total required power of compressors. The intermediate pressure for $H_2$ and natural gas were derived at 61 and 65 bar, respectively.

Continuous Mediated Electrochemical Oxidation of Ethylene Glycol by Co(III)/Co(II) and Fe(III)/Fe(II) Redox Systems (Co(III)/Co(II) 및 Fe(III)/Fe(II) 산화환원계에 의한 에텔렌글리콜의 연속 매개전해 산화)

  • Kim, Ik-Seong;Park, Seung-Cho
    • Applied Chemistry for Engineering
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    • v.16 no.5
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    • pp.635-640
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    • 2005
  • Mediated electrochemical oxidation (MEO) is an aqueous process which oxidizes organics electrochemicallly at low temperatures and pressures. The useful process can be used to treat mixed wastes containing hazardous organics. This paper have studied MEO of ethylene glycol (EG) in nitric acids by Fe(III)/Fe(II) and Co(III)/Co(II) system. It investigated current density, supporting electrolyte concentration, hydraulic retention time, removal efficiency of EG by MEO. Removal efficiency of EG by MEO was superior in Co(III)/Co(II) redox system than Fe(III)/Fe(II) redox system, where MEO removal efficiency was 100 percent. In case of EG, the reactions were fast and good yields of carbon dioxide formation was observed.

CMOS Voltage down converter using the self temperature-compensation techniques (자동 온도 보상 기법을 이용한 CMOS 내부 전원 전압 발생기)

  • Son, Jong-Pil;Kim, Soo-Won
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.12 s.354
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    • pp.1-7
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    • 2006
  • An on chip voltage down converter (VDC) using the self temperature-compensation techniques is proposed. At a different gate bias voltage, PMOSFET shows different source to drain current characteristic according to the temperature variation. The proposed VDC can reduce its temperature dependency by the source to drain current ratio of two PMOSFET with different gate bias respectively. Proposed circuit is fabricated in Dongbu-anam $0.18{\mu}m$ CMOS process and experimental results show its temperature dependency of $-0.49mV/^{\circ}C$ and external supply dependency of 6mV/V. Total current consumption is only $1.1{\mu}A@2.5V$.

Stress characteristics of multilayer polysilicon for the fabrication of micro resonators (마이크로 공진 구조체 제작을 위한 다층 폴리실리콘의 스트레스 특성)

  • Choi, C.A.;Lee, C.S.;Jang, W.I.;Hong, Y.S.;Lee, J.H.;Sohn, B.K.
    • Journal of Sensor Science and Technology
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    • v.8 no.1
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    • pp.53-62
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    • 1999
  • Micro polysilicon actuators, which are widely used in the field of MEMS (Microelectromechanical System) technology, were fabricated using polysilicon thin layers. Polysilicon deposition were carried out to have symmetrical layer structures with a LPCVD (Low Pressure Chemical Vapor Deposition) system, and we have measured physical characteristics by micro test patterns, such as bridges and cantilevers to verify minimal mechanical stress and stress gradient in the polysilicon layers according to the methods of mutilayer deposition, doping, and thermal treatment, also, analyzed the properties of each specimen, which have a different process condition, by XRD, and SIMS etc.. Finally, the fabricated planar polysilicon resonator, symmetrically stacked to $6.5{\mu}m$ thickness, showed Q of 1270 and oscillation ampitude of $5{\mu}m$ under DC 15V, AC 0.05V, and 1000 mtorr pressure. The developed micro polysilicon resonator can be utilized to micro gyroscope and accelerometer sensor.

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Fabrication of oxide semiconductor thin film gas sensor array (산화물 반도체 박막 가스센서 어레이의 제조)

  • 이규정;김석환;허창우
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.4 no.3
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    • pp.705-711
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    • 2000
  • A thin film oxide semiconductor micro gas sensor array which shows only 60 mW of power consumption at an operating temperature of $300^{\circ}C$ has been fabricated using microfabrication and micromachining techniques. Excellent thermal insulation of the membrane is achieved by the use of a double-layer structure of $0.1\mum\; thick\; Si_3N_4 \;and\; 1 \mum$ thick phosphosilicate glass (PSG) prepared by low-pressure chemical-vapor deposition (LPCVD) and atmospheric-pressure chemical-vapor deposition (APCVD), respectively. The sensor array consists of such thin film oxide semiconductor sensing materials as 1 wt.% Pd-doped $SnO_2,\; 6 wt.% A1_2O_3-doped\; ZnO,\; WO_3$/ and ZnO. Baseline resistances of the four sensing materials were found to be stable after the aging for three days at $300^{\circ}C$. The thin film oxide semiconductor micro gas sensor array exhibited resistance changes usable for subsequent data processing upon exposure to various gases and the sensitivity strongly depended on the sensing layer materials.

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A Study on the Cyclic Pressure Function in Freeze Drying of Foodstuff (식품의 냉동 건조에서 주기 압력 함수에 대한 연구)

  • Mun, Jae-Choel;Kim, Soo-Ho;Hwang, Kap-Sung;Hong, Song-Sun
    • Applied Chemistry for Engineering
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    • v.8 no.1
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    • pp.1-7
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    • 1997
  • We show that the usage of the cyclic pressure function in the freeze drying is more effective than the drying rate of the constant pressure process. The ultimate object of this process is to reduce energy costs by shortening the drying time. In this work, the concept of cyclic pressure function to decrease the drying time and the effects of the following factors on drying rate are considered ; pulse type, size in amplitude of pressure, size of intermediate time. Temperature for drying has always been maintained constantly at $20^{\circ}C$ and the pulse type could have found to give useful results than the constant pressure by altering chamber pressure from low pressure to high pressure Also, when the amplitude of the pulse is 0.4 torr and the intermediate time is six hour the drying rate was increased considerably.

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Nano-bending method for the measurement of the Poisson's ratio of MEMS thin films (MEMS 박막의 푸와송 비 측정을 위한 미소굽힘기법)

  • 김종훈;김정길;연순창;전윤광;한준희;이호영;김용협
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.31 no.2
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    • pp.57-62
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    • 2003
  • Nano-bending method is presented to measure the Poisson's ratio of thinfilms for MEMS (Micro-Electro-Mechanical Systems) applicaiton. The douvle-ring specimen is designed and fabricated based on the surface micromachining process to facilitate the measurement of the Poisson's ratio. The Poisson's ratio can be obtained through analyzing the linear load-displacement relationship of the double ring specimen subjected to nano-indenter loading. The Present nano-bending mehod is an in-situ measurement approach due to the compatibility to the surface micromachining process. The Poisson's ratio is locally obtained at the location of the double ring specimen with micro dimension. To validate the nano-bending method, the Poisson's ratio of LPCVD (Low Pressure Chemical Vapor Deposition) poly-silicon with thickness of 2.3㎛ is investigated. Experimental results reveal that the Poisson's ratio of the poly-silicon film is 0.2569. The standard deviation of the nano-bending measurement for the stiffness of double ring specimens is 2.66%.