• Journal of Sensor Science and Technology
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• v.7 no.1
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• pp.39-44
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• 1998

Low reflectance optical fiber mirrors in the continuous length of the single mode fiber were fabricated using mechanical splices and pieces of fiber coated with $TiO_{2}$ dielectric film at the cleaved end. When fiber mirrors of refelctance of about 1% were produced, the insertion loss ranged from 0.055dB to 0.3dB and the average insertion loss was 0.15 dB. These mirrors could be produced easy in the field.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.12 no.6
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• pp.37-43
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• 2013

In this paper, an UWB (Ultra Wide Band) band-pass filter with open stubs using SIR (Stepped Impedance Resonator) structure is presented. The proposed band pass filter (BPF) has SIR structure instead of open stubs for UWB application with low insertion loss. The bandwidth of the proposed BPF is 103 % at the center frequency of 5.8GHz and the insertion and return losses are 0.17dB and 13.1dB, respectively. Also, the entire size of the proposed band-pass filter is $21.6{\times}17.8mm^2$.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.2
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• pp.33-43
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• 2002

현대의 레이다나 통신 시스템에 있어 위상 배열안테나는 필수 구성요소이고 이러한 위상 배열 안테나에는 수 천개의 독립적인 위상제어기가 사용되어지고 있다. 따라서 대량생산이 가능하면서도 성능이 우수한 저손실, 저가격의 True-Time Delay (TTD)를 지원하는 위상천이기가 크게 요구되고 있는 실정이다. 최근 몇 년 동안 MEMS 공정을 이용한 저손실 RF 스위칭 소자와 가변 캐패시터가 성공적으로 개발되었으며 이러한 저손실의 MEMS 스위칭 소자를 이용한 위상천이기 구현이 가능하게 되었다. 본 논문에서는 크기나 전력소모, 삽입손실 등에서 우수한 고주파 특성을 갖는 RF MEMS (Micro-Electro Mechanical System) 스위치에 대해서 간략히 언급하고 이를 이용한 위상천이기와 기존의 위상천이기를 비교 분석하였다.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.97-101
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• 2021

In this study, Insertion loss according to the structural variant of interposer to Through Silicon Via (TSV) and Redistributed Layer (RDL) was studied through design of experiment. 3-Factors was considered as a variant, TSV depth, TSV diameter, RDL width with factor arrangement method and the response surface method from 400 MHz to 20 GHz. As a result, it was confirmed that as the frequency increased, the effect of RDL width was decreased and the effect of TSV depth and TSV diameter was increased. Also within the analysis range, to increasing RDL width, decreasing TSV depth, and fixing TSV diameter about 10.7 ㎛ was observed optimal result of Insertion loss.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.2
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• pp.107-114
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• 2009

In this paper, high efficiency amplifier configuration is proposed using the reconfigurable power divider. In order to enhance average efficiency of linear power amplifiers for wireless communication, it is required to increase efficiency in low output power region. The proposed power divider operates in two modes, high power mode and low power mode, according to output power. In each mode, it allows impedance matches and low loss, which is made possible by employing two $\lambda/4$ coupled lines and two switches. The fabricated power divider shows the return loss ($S_{11}$) and insertion loss ($S_{21}$) of -16.49 dB and -0.83 dB, respectively, in low power mode. In high power mode, the measured return loss ($S_{11}$) and insertion loss ($S_{31}$) are -16.28 dB and -0.73 dB, respectively. This result successfully demonstrates the reconfigurability of the proposed power divider.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.9
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• pp.6-12
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• 2011

In this paper, we propose a design method for a reliable and improved field-installable optical connectors(FIOC) which are needed for long-distance and low loss FTTH configuration. To this end, we optimize the angle of splicing between the inner fiber and the field fiber of the FIOC, so that the low loss connection of optical fibers is possible without using any angle alignment tools as well as angled cleavers. More precisely, we set the cutting angle of the inner filber and the field fiber to be $2^{\circ}$ by using an angled cleaver and $0^{\circ}{\sim}1^{\circ}$ by using a general fiber cutter, respectively. Splicing these two optical fibers without any further adjustment, we can keep the insertion loss within 0.3dB and the reflection loss within -60dB.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.47 no.7
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• pp.128-134
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• 2010

In this paper, a high-power 20-way stripline power divider with low insertion loss and low side lobe level is successfully designed, fabricated and measured as a feed network for an S-band linear array antenna having Dolph-Chebyshev current distribution which has a narrow beam width and very low side lobe level (SLL). The 20-way stripline power divider consists of an 8-way power divider, three 4-way power dividers and three ring hybrids. It utilizes a T-junction structure as a basic element for power dividing. Notches and modified input/output N-to-stripline transitions are used for improving insertion loss and return loss. The fabricated power divider shows insertion loss less than 0.3 ㏈ and rms phase mismatch less than 8o in the full bandwidth. A final 40-way power divider is synthesized by combining symmetrically two 20-way power dividers and is expected to have SLL over 40 dB, based on the measured results of the 20-way power divider.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.3
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• pp.60-68
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• 2001

본 논문에서는 최근 초소형 기술로 각광받고 있는 MEMS(MicroElectroMechanical System) 기술을 이용한 무선통신 분야의 응용을 제고한다. RF ME- MS 기술은 기존의 기술들에 비해 크기나 전력소모, 삽입손실 등에서 우수한 고주파 특성을 갖는 소자 나 부품을 만들 수 있으며 특히 휴대용 단말기에 적 용 가능한 RE 부품들 즉 저손실 전송선로, 스위치, High Q inductor, 안테나 등의 주요 부품에 대한 연 구가 많이 이루어지고 있다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.7
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• pp.809-818
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• 2007

Generally, carriers on which microwave circuits are mounted are used as building blocks of MIC module for the convenience of MIC assembly and the unit module characterization. However the interconnection of the microstrip-based carriers by wire bonding causes the serious problem of mismatch and results in the higher insertion loss as frequency becomes higher. The gap and the depth between carriers are considered as the main reason of the degradation. The CPW can be the solution to cope with such problem considering its field are dominantly concentrated on the top plane. In this paper, we propose and demonstrate the CBFGCPW to microstrip transition with the low insertion loss that can be applied without causing the MIC carrier interconnection problem.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.8 no.5
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• pp.452-461
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• 1997

In this paper, we present a computer-aided design(CAD) technique for minimizing the phase shift in microstrip PIN diode attenuators due to the junction capacitance in the equivalent circuit model of PIN diode. Microstrip PIN diode attenuators use the characteristics which the reactance of microstrip line changes from inductive to capacitive as the frequency sweeps across the band. Microstrip PIN diode attenuator designed utilizes the quarter-wavelength transmission line terminating with the half-moon radial stub, which is designed for negligible phase shifting effect over the intersted bandwidth. The attenuator has similar phase shift at 0 dB and 10 dB of attenuation within average $1.27^{\circ}$ between 1.2GHz and 1.9GHz. The input and output return losses between 1.4 GHz and 1.9 GHz are less than 10 dB over the attenuation range of 0 dB and 10 dB.