• Korean Journal of Materials Research
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• v.6 no.7
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• pp.700-708
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• 1996

Electroless plating technique was utilized to flip chip bonding to improve surface mount characteristics. Each step of plating procedure was studied in terms pf pH, plating temperature and plating time. Al patterned 4 inch Si wafers were used as substrstes and zincate was used as an activation solution. Heat treatment was carried out for all the specimens in the temperature range from room temperature to $400^{\circ}C$ for $30^{\circ}C$ minutes in a vacuum furnace. Homogeneous distribution of Zn particles of size was obtained by the zincate treatment with pH 13 ~ 13.5, solution concentration of 15 ~ 25% at room temperature. The plating rates for both Ni-P and Au electroless plating steps increased with increasing the plating temperature and pH. The main crystallization planes of the plated Au were found to be (111) a pH 7 and (200) and (111) at pH 9 independent of the annealing temperature.

• Applied Microscopy
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• v.38 no.4
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• pp.279-284
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• 2008

The phase change materials have been extensively used as an optical rewritable data storage media utilizing their phase change properties. Recently, the phase change materials have been spotlighted for the application of non-volatile memory device, such as the phase change random access memory. In this work, we have investigated the crystallization behavior and microstructure analysis of In-Sb-Te (IST) thin films deposited by RF magnetron sputtering. Transmission electron microscopy measurement was carried out after the annealing at $300^{\circ}C$, $350^{\circ}C$, $400^{\circ}C$ and $450^{\circ}C$ for 5 min. It was observed that InSb phases change into $In_3SbTe_2$ phases and InTe phases as the temperature increases. It was found that the thickness of thin films was decreased and the grain size was increased by the bright field transmission electron microscopy (BF TEM) images and the selected area electron diffraction (SAED) patterns. In a high resolution transmission electron microscopy (HRTEM) study, it shows that $350^{\circ}C$-annealed InSb phases have {111} facet because the surface energy of a {111} close-packed plane is the lowest in FCC crystals. When the film was heated up to $400^{\circ}C$, $In_3SbTe_2$ grains have coherent micro-twins with {111} mirror plane, and they are healed annealing at $450^{\circ}C$. From the HRTEM, InTe phase separation was occurred in this stage. It can be found that $In_3SbTe_2$ forms in the crystallization process as composition of the film near stoichiometric composition, while InTe phase separation may take place as the composition deviates from $In_3SbTe_2$.

• Journal of the Korea institute for structural maintenance and inspection
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• v.9 no.3
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• pp.203-212
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• 2005

Cellulose insulation is primarily manufactured from recycled newsprint and treated with fire retardants for the fire resistance. Thanks to the fire retardants, it is not combustible and flammable. In addition to that, Its thermal resistance is much better than that of fiberglass or rock wool. It is made from waste paper and easily decayed when it is demolished, and it has small embodied energy. So it is very environment-friendly building material. For broader use of cellulose insulation in buildings in Korea, it is necessary to test its physical performance to compare the results with the requirements on the Korean Building Code. To this end, apparent thermal conductivity (ka) measurements of Korean-made loose-fill cellulose insulations were recently completed using equipment that was built and operated in accordance with ASTM C 518 and the fire resistance was tested in accordance with ASTM C 1485. Korean loose-fill cellulose has thermal conductivity about 5% greater than the corresponding U.S. product at the same density. This is likely due to differences in the recycled material being used. Both spray-applied and loose-fill cellulose insulation lose about 1.5% of their thermal resistivity for $5.5^{\circ}C$ increase in temperature. The fire resistance of cellulose insulation is increased in linear proportion to the increase of the rate of fire retardant. Thanks to the high fire resistance, cellulose insulation can be used as a substitution of Styrofoam or Urethane foam which is combustible. The thermal conductivity of cellulose insulation was $0.037-0.043W/m{\cdot}K$ at the mean specimen temperature from $4-43^{\circ}C$. It corresponds to the thermal resistance of "Na Grade" according to the Korean Building Code. The effect of chemical content on thermal conductivity was negligible for all but the chemical-free specimen which had the highest value for the thermal conductivity over the temperature range tested. The thermal resistance of cellulose insulation is better than that of fiberglass or rock wool, and its fire resistance is higher than that of Styrofoam or Urethane foam. Therefore it can be substituted for those above considering its physical performance. Cellulose insulation is no more expensive than Styrofoam or rock wool, so it is recommended to use it more widely in Korea.