• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2008.10a
• /
• pp.398-400
• /
• 2008

In this work, an air-bending test using magnesium alloy ZK60 sheet was carried out at the various temperatures from room temperature to $300^{\circ}C$ in order to investigate the effect of grain size on the spring-back characteristic. It was found out from experiments that the amount of spring-back was nearly zero at all temperature range when the specimens with grain sizes of 14.66 and $60.71{\mu}m$ were bent by $90^{\circ}$. On the other hand, the spring-back amount dramatically increased at room temperature and phenomenon of spring-go was observed at high temperature when the specimen with submicro grain size of $0.98{\mu}m$ was bent by $90^{\circ}$. From this kind of different spring-back characteristics according to the grain size, it was confirmed that the grain size of material is one of the important factors which have an effect on the spring-back.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.3
• /
• pp.63-67
• /
• 2016

In this paper, we present an indirect method of elastic modulus measurement for various lamination layers formed on polymer-based compliant substrates. Although the elastic modulus of every component is crucial for mechanically reliable microelectronic devices, it is difficult to accurately measure the film properties because the lamination layers are hardly detached from the substrate. In order to resolve the problem, 3-point bending test is conducted with a film-substrate specimen and area transformation rule is applied to the cross-sectional area of the film region. With known substrate modulus, a modulus ratio between the film and the substrate is calculated using bending stiffness of the multilayered specimen obtained from the 3-point bending test. This method is verified using electroplated copper specimens with two types of film-substrate structure; double-sided film and single sided film. Also, common dielectric layers, prepreg (PPG) and dry film solder resist (DF SR), are measured with the double-sided specimen type. The results of copper (110.3 GPa), PPG (22.3 GPa), DF SR (5.0 GPa) were measured with high precision.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.19 no.5
• /
• pp.347-355
• /
• 1999

A feasibility investigation on vibration-based nondestructive evaluation of thermal stress-induced micro-failure in the free edge region of thin composite laminates(1mm thick) has been carried out. The failure occurrence and damage zone, which were predicted by the three-dimensional finite-element thermal stress analysis, were observed using the ultrasonic C-scan and optical microscopy. Analysis of the vibration spectrum measured from the laminate beam specimens by the vibration sweep test exhibited that the obvious decrease in resonancy frequency and some considerable increase in damping factor were associated with the micro-failure formation. The vibration technique utilizing short beam and high resonant frequency was found to be very sensitive to the thermal stress-induced damage in the thin laminates.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.49 no.8
• /
• pp.661-669
• /
• 2021

A mechanical stiffener has been mainly applied on a PCB to secure fatigue life of a solder joint of an electronic components in spaceborne electronics by minimizing bending displacement of the PCB. However, it causes an increase of mass and volume of the electronics. The high damping PCB implemented by multi-layered viscoelastic tapes of a previous research was effective for assuring the fatigue life of the solder joint, but it also has a limitation to decrease accommodation efficiency for the components on the PCB. In this study, we proposed high damping PCB with a multi-layered superelastic shape memory alloy stiffener for spatialminimized, light-weighted, high-integrated structure design of the electronics. To investigate the basic characteristics of the proposed PCB, a static load test, a free vibration test were performed. Then, the high damping characteristic and the design effectiveness of the PCB were validated through a random vibration test.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.48 no.5
• /
• pp.383-390
• /
• 2020

Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.

• Journal of Aerospace System Engineering
• /
• v.15 no.1
• /
• pp.86-94
• /
• 2021

PCB-based deployable solar panel is mainly used for CubeSat due to its lightweight and easy of electrical connection. However, as the size of solar panel increases, there is a limit to ensuring the structural safety of solar cells due to excessive dynamic displacement under launch vibration environment. In previous mechanical designs, for the minimization of dynamic deflection, panel stiffness is increased by applying additional stiffeners made of various materials such as aluminum or composite. However, it could have disadvantages for CubeSat design requirements due to limited mass and volumes. In this study, a high-damping 6U solar panel was proposed. It had superior damping characteristic with a multi-layered stiffener laminated with viscoelastic acrylic tapes. Basic characteristics of this solar panel were measured through free-vibration tests. Design effectiveness of the solar panel was validated through qualification-level launch vibration test. Based on test results, vibration characteristics of a typical PCB solar panel and the high-damping laminated solar panel were predicted and a comparative analysis was performed.

• Computational Structural Engineering
• /
• v.8 no.4
• /
• pp.87-97
• /
• 1995

For the same configuration of two-dimensional finite element models, 6-node element exhibits stiffer bending stiffness than 8-node element. This is true in the relation between 16-node element and 20-node element for three-dimensional model. This stiffening phenomenon comes from the elimination of several mid nodes from full-node elements. Therefore, this may be called 'relative stiffness stiffening phenomenon'. It seems that there are a couple of ways to correct the stiffening effect, however, we could find only one effective method-the method of modification of Gauss sampling points-which passes the patch test and does not alter other kinds of stiffness, such as extensional stiffness. The quantity of modification is a function of Poisson's ratios of the constituent materials. We could obtain two modification equations, one for plane stress case and the other for plane strain case. This method can be extended to 3-dimensional solid elements. Except the exact plane strain cases, most 3-dimensional plates could be modeled successfully with 16-node element modified by the equation for the plane stress case. The effectiveness of the modification method is checked by applying it to several examples with excellent improvements. In numerical examples, beams with various boundary conditions are subjected to static and time-dependent loads. Free and forced motion analyses of beams and plates are also tested. The beam and plate may be composed of isotropic multilayers as well as a single layer.