• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.2
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• pp.80-86
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• 2000

Although polishing process take 30-50% of whole process of manufacturing die and mold it has not been fully automat-ed yet. Considering current trend of manufacturing it is necessary to study on polishing automation. To accomplish automation reliable database must be developed. For developing it polishing mechanism should be defined and a general empirical formula that can be applied widely should be created. In this paper it is found that polishing process must be separated into 2 process such as removing cusp and getting fine surface process and the polishing parameter which is com-posed of major machining parameters and normalization of data can be applied efficiently in making reliable database.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.6
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• pp.96-102
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• 2000

The finishing process for dies and molds is an important process because it has influence on final quality of products. And it is difficult to automatize finishing process so that the process has depended on expert's skill until now. However, recently a study on development of die automatic finishing machine has been progressed, and actually this machine is applied to fabrication of die. But the research about tooling system is not enough and finishing tool must have high machining efficiency and adaptability of curved surface. So, this study investigated the application of conductive elastic tool which is composed of metal-resin bonded pellet and elastic backing material. The metal-resin bonded pellet is used to finish the surface by conventional mechanical grinding or electro-chemial grinding method. And elastic backing material is used to follow the curved surface. So conductive elastic tool has long lifetime, uniform removal rate and adaptability of curved surface.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.56.2-56.2
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• 2011

최근 철강, 알루미늄, 이종재료의 접합 등 용접이 어려운 부분에 구조용 접착제의 적용이 증가하고 있는 추세이다. 이를 위해 변성 에폭시레진을 활용한 고접합 강도, 고인성의 구조용 접착제가 연구되어 지고 있다. 피착제의 표면처리는 접합부의 접합강도를 향상시키는 방법으로 알려져 있으나 최근의 구조용 접착제는 표면 전처리 없이도 우수한 접착 특성을 보이는 것으로 기대되고 있다. 본 연구에서는 변성레진에 대해서 각종 표면처리가 접합부 특성에 미치는 영향을 조사하였다. 피착제로는 자동차용 냉연강판인 SPRC440을 사용하였고, 전처리로는 무처리 상태, SiC연마지를 이용한 연마, 아르곤 및 산소가스를 이용한 마이크로웨이브 플라즈마 표면처리, 산세 등의 표면처리를 실시하였다. 에폭시 접착제는 변성 에폭시 레진과 경화제 및 촉매제를 이용하여 직접 포뮬레이션하였다. 단일 겹치기 전단강도 시험과 T-Peel 시험은 각각 ASTM D 1002 규격에 따라 준비하였으며 인장 시험 후 파면은 SEM으로 관찰하였다.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.327-331
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• 2001

In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.8-13
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• 2000

Die polishing technology is very critical to determine quality and performance of the final products. Die polishing processes have not been automated because the automation requires a great deal of experience and skill of experts. Thus, to implement a fully automated polishing process, the development of polishing status monitoring system replacing the skill of experts is critical. AE is known to be closely related to material removal rate(MRR). As the surface is rougher, MRR gets larger and AE increased. The surface roughness can be indirectly estimated using the AE signal measured during automatic die polishing process. In this study, The polishing state monitoring system using AEms signal was developed. This system can be not only to monitor the abnormal state but also to estimate a state of surface roughness of polishing surface qualitatively.

• 전기의세계
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• v.39 no.6
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• pp.14-19
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• 1990

1. CAD system과 PROPS를 접속하여 CADsystem에서 Design된 surface를 사용할 수 있으며 Robot Kinematics를 graphic library화하여 surface배치 수상 및 path generation 및 animation을 통하여 가공작업을 위한 로보트 운동을 simulation할 수 있게 되었다. 2. Denavit-hartenberg transformation form에 의해 여러 Robot Kinematic을 일반적인 형식으로 library화 하였다. 3. 금형 가공의 공정들을 Menu로 만들어서 Expert system을 도입, 손쉽게 Interactive한 작업을 할 수 있게 하였다. 4. 차후의 연구 목표는 로보트 Calibration S/W의 개발 및 실현 그리고 Expert System을 이용한 Robot Program Generator의 완성을 통한 전체 Off-line programming System을 정립하는데 있다. 이를 위해서 더 실제적인 Tool Path Generation과 Expert System을 이용한 가공 조건의 결정 및 User Interface를 위한 Window가 개발되어야 한다. 5. 1차년도에 개발된 Robotonomic Tool System의 유연성을 확장시킨다. 실험결과를 바탕으로 공정 자동화 시스템을 확장시킨다. 6. 연마공정자동화에 필수적인 공구 및 공구 Tip의 표준화 및 자동교환장치를 개발한다. 7. 금형연마 Cell의 구성요소들간의 Interface 및 System Controller에서의 집적화를 시킨다.

• Journal of the Korean Vacuum Society
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• v.7 no.2
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• pp.88-93
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• 1998

The fabrication process and emission characteristics of gated silicon field emitter arrays(FEAs) using chemical-mechanical-polishing (CMP) method are described. Novel fabrication techniques consisting of two-step dry etching with oxidation of silicon and CMP processes were developed for the formation of sharp tips and clear-cut edged gate electrodes, respectively. The gate height and aperture could be easily controlled by varying the polishing time and pressure in the CMP process. We obtained silicon FEAs having self-aligned and clear-cut edged gate electrode opening by eliminating the dishing problem during the CMP process with an oxide mask layer. The tip height of the finally fabricated FEAs was about 1.1 $\mu$m and the end radius of the tips was smaller than 100 $\AA$. The emission current meaured from the fabricated 2809 tips array was about 31 $\mu$A at a gate voltage of 80 V.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.45-54
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• 2000

The effect of electropolishing far stamped leadframe on the removal of the edge burr and residual stress relief was examined. The present study showed that the electropolishing could be used for enhanced surface quality of stamped leadframes. The electropolishing was performed at the condition of 60% phosphoric acid electrolyte, 5 ampere of current and 3 cm electrode gap at $70^{\circ}C$ for 2 minutes for Alloy42 type leadframe, and $50^{\circ}C$ for 1.5 minutes for C-194 type leadframe. The FWHM values from X-ray diffraction showed that residual stress of electropolished leadframe recovered to the level of as-received raw materials and surface roughness measured by using AFM tuned out to be improved by 0.079 $\mu\textrm{m}$ and 0.014 $\mu\textrm{m}$ ($R_{rms}$) far alloy 42 and C-194 type leadframes, respectively. The plated thickness using XRF showed the improved uniformity in thickness variation by 0.4~0.5 $\mu\textrm{m}$ and grain growth, which is favorable for interface adhesion, was also observed from the bake test samples. We could certify dimensional stability of leadframe with inspection by means of 3D-topography and hardness measurements.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.314-318
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• 2002

Recently, new polishing tool which was made by magnetic intelligent compound(Magic) was invented. The distribution of abrasives in this new tool can be controlled by magnetic field. Therefore, we can make a special polishing tool which has well arranged abrasives after cooling. In this study, 3 dimensional polishing machine was developed in order to polish complicated - shaped inner surfaces of molds. The performance of developed machine was investigated by measuring the roughness of polished surface using new polishing tool.

• 제어로봇시스템학회:학술대회논문집
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• 1992.10a
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• pp.71-74
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• 1992

This paper describes the automation of the surface grinder for a grinding wheel by application of programmable logic controller(PLC) with a position sensor, and a limit switch. The control system is designed to provide feeding a workpiece on the turn table and pressing it by the upper disk automatically. In this development the automation of checking the thickness of a grinding wheel is most important. In order to measure the relative displacement, the proximity sensors were employed and the sensitivities of the sensors were investicated and discussed the superiority. It has been shown by model experiment that the automation system of the surface grinder is performed satisfactory.