• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.8
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• pp.869-874
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• 2014

It is possible to fabricate a three-dimensional (3D) shape using the solid freeform fabrication (SFF) technology. However, there are several problems in applying conventional SFF technologies to the direct manufacturing of a product. Hence, multimaterial SFF is gaining attention. Moreover, a 3D circuit device that is different from a conventional two-dimensional PCB can also be fabricated using multimaterial SFF. In this study, a hybrid system using fused deposition modeling and direct writing was designed for 3D circuit device fabrication.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.12 s.189
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• pp.7-15
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• 2006

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.211.2-211.2
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• 2005

• Proceedings of the KAIS Fall Conference
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• 2002.05a
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• pp.55-58
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• 2002

본 논문은 쾌속제작법을 이용한 임의형상을 가공하는 새로운 방법의 개념을 소개하고 있다. 본 시스템은 레이저 절단, 이송, 적층, 소결의 단계를 통하여 세라믹재료로 된 임의형상을 가공할 수 있다. 시스템을 구성하는 주요장비로는 레이저발생장치, X-Y테이블, 이송시스템, 그리고 전기로 등이 있다. 이 시스템을 사공하면 표면의 거칠기가 매끄러운 형상을 상대적으로 짧은 시간에 제작할 수 있는 장점이 있다. 또, 2차 공정을 거치지 않고, 바로 물체를 제작할 수 있어 효율성이 높다고 할 수 있다. 제작된 모형은 바로 조립되어 사용할 수 있기 때문에 응용분야가 다양하다.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.212.1-212.1
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• 2005

• Journal of the Korean Society for Precision Engineering
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• v.25 no.7
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• pp.27-32
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• 2008

• Journal of the Korean Society for Precision Engineering
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• v.25 no.7
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• pp.33-38
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• 2008

• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.168-176
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• 2006

Nowadays, Three dimensional printing (3DP) technique that is one of solid freeform fabrication (SFF) technology has been notable issue, and has been applied by various fields. The SFF system can fabricate three dimensional objects of solid freeform with high speed and low cost using ink jet printing technology. In this research, a SFF system to analyze 3DP process technology is developed. We applied sliding mode control with sliding perturbation observer (SMCSPO) algorithm and minimized position error to the developed SFF system. We analyzed and optimized process variables such as jetted volume, layer thickness, powder bed and so on experimentally. Also. the dimensional error of a developed SFF system is evaluated. Finally, the feasibility of application to bio manufacturing is presented through successful fabrication of teeth and cranium model.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.7
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• pp.602-609
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• 2008

This paper presents experimental optimization of process parameters for a newly developed SFF(Solid Freeform Fabrication) system. Two critical process parameters, layering thickness and curing period, which have a large effect on the quality of the product, are optimized through experiments. Specimens are produced using layering thicknesses of 60, 80, 100, 120, 140, and $160\;{\mu}m$ and curing periods of 0, 10, 20, and 30 minutes under the same processing conditions, i.e., build-room temperature, feed-room temperature, roller speed, laser power, scan speed, and scan spacing. The specimens are tested to compare and analyze performance indices such as thickness accuracy, flatness, stress-strain characteristics, and porosity. The experimental result indicates that layering thickness of $80{\sim}100\;{\mu}m$ and curing period of $20{\sim}30$ minutes are recommended for the developed industrial SFF system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.3 no.2
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• pp.126-130
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• 2002

This paper presents the basic concept of new solid freeform fabrication system using rapid prototyping method. The system could fabricate an arbitrary ceramic form by laser cutting, transferring, stacking, and sintering of each slide. The system consists mainly of laser apparatus. X-Y table, a slide transferring system, and electric oven. The system could fabricate an object that has smooth surface with comparatively short period of time. The system is effective in terms of its direct fabrication capability without second mechanical process. The fabricated shape could directly be used as part of a whole assembly and therefore its method could be applied to various application areas.