• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.55-60
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• 2002

The recent trend in electronic devices has been towards light weight, low cost, high performance and improved reliability. Passive components are very important parts of microelectronic devices. The number of passive components used in hand held devices and computers continue to increase. To achieve improvements in costs, component density, performance, and reliability, embedding of these passive components into the printed circuit boards (PCBs) is required. This paper introduces the embedding of passive components, and discusses the remained challenges in the commercialization of this technique.

• IE interfaces
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• v.18 no.3
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• pp.297-307
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• 2005

PCB assembly is a complicated and difficult process to optimize due to the necessity of simultaneous consideration of component’s rack assignment and board mounting sequencing. An efficient PCB assembly method is developed by using neighboring positioned identical components information as well as quantity and size of the components. It is found that same type of components are located closely each other by checking real PCBs and interviewing with PCB designers in practice. Better performance of the developed procedure is obtained along with more number of total components and more number of neighboring positioned identical components cases. Simulation models are developed using Visual C++ for performance evaluation purposes of the suggested heuristic.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.71-72
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• 2015

본 논문에서는 CPW(Coplanar waveguide) 급전되는 평면 루프 슬롯을 2.45 GHz 대역 Wi-Fi용으로 소형화 설계하는 방법에 대해 연구하였다. 제안된 구조는 직사각형 형태의 CPW 급전 루프 슬롯 안테나를 기본형으로 하여 내부 패치에 슬롯을 좌우 대칭으로 여러 개 수직 방향으로 배치한 안테나이며, FR4 기판의 한 면에 인쇄된다. 여러 가지 파라미터 값들이 안테나의 특성에 미치는 영향을 관찰하고 기존 루프 슬롯 안테나를 소형화하는 방법에 대해 연구하였다. FR4 기판에 $80mm{\times}50mm$ 크기로 2.45 GHz 대역용으로 설계된 안테나의 특성을 시뮬레이션을 통해 분석하였다.

• Proceedings of the KIEE Conference
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• 2000.07d
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• pp.3075-3077
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• 2000

이동통신단말기 등의 표시소자로 사용되는 LCD(Liquid Crystal Diode)나 LED(Light Emitting Diode)의 표현의 한계를 극복하고 보다 많은 정보를 표시할 수 있는 가상의 화면을 구성하기 위한 400dpi급 LED array 칩과 이를 구동하기 위한 driver 칩을 패키징하는 방법에 대하여 연구하였다. 연성 인쇄회로기판(flexible Printed Circuit) 기판 위에 칩을 실장하여 제품의 소형화와 경량화 그리고 전선을 대체하여 신뢰성을 높일 수 있도록 설계하였고 알루미늄 wire bonding법으로 각각의 칩을 연결하는데 있어 고려해야할 패키지의 조건에 대하여 연구하였다. 본 연구의 목적은 휴대용 이동통신단말기의 경박단 소화를 위한 패키징 기술을 확보하는데 있다.

• Proceedings of the KIEE Conference
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• 2001.07d
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• pp.2735-2737
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• 2001

비젼 검사시스템에서 기판에 존재하는 납 형상의 패턴을 분류함으로써 사전에 불량을 줄일 수 있다. 이러한 경우 대부분의 불량은 부정확한 납의 위치 및 두께로 인해 발생하게 되는데, 이러한 문제를 해결하기 위해 주어진 경계 내에 불분명하게 형성된 납의 형태 및 두께를 정상과 불량으로 분류하기 위해 무게중심점에 기초한 정합과 XOR연산을 이용한 비젼 검사시스템을 제안하였다. 제안한 비젼 검사시스템을 인쇄회로기판상의 납땜형상 패턴에 적용하여 제안한 방법의 성능을 검증하였다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.677-680
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• 2008

The paper deals with the analysis of radiation characteristics of antenna in the multi-layered media structures. The dyadic Green's function for three layer medium is complex because the Green's functions belonging to the kernel of the integral equation are expressed as Sommerfeld integrals, in which surface wave effects are automatically included. When certain condition are met, the integral can be evaluated approximated by the method of Saddle-point integration. In this study, we propose a method to calculate a radiation pattern for several antennas by using the method of Saddle-point integration. Numerical results show how the radiation characteristics are affected by parameter of dielectric media.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.100-103
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• 2003

In this paper, the characteristics of an inverted-F antenna for the 2.4GHz local wireless communication system have been analysed in terms of the variation of design parameters. The antenna can be integrated on printed circuit board, and the characteristics in terms of the variation of the gap between feed line and shorting stub, gap between antenna's leg and ground plane, antenna leg's width, substrate's height and dielectric constant are analysed. By using these characterization plot of design parameter, the tuning techniques are proposed to design optimum antenna. The designed antenna has 6.4% frequency bandwidth for VSWR under 1.5 and 3dB gain.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.6
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• pp.1103-1108
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• 2003

In this paper, the characteristics of an inverted-F antenna for the 2.4GHz local wireless communication system have been analysed in terms of the variation of design parameters. The antenna can be integrated on printed circuit board, and the characteristics in terms of the variation of the gap between feed line and shorting stub, gap between antenna's leg and ground plane, antenna leg's width, substrate's height and dielectric constant are analysed. By using these characterization plot of design parameter, the tuning techniques are proposed to design optimum antenna. The designed antenna has 6.4 % frequency bandwidth for VSWR under 1.5 and 3dB gain.

• Laser Solutions
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• v.15 no.3
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• pp.7-10
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• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• Journal of the Korean Ceramic Society
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• v.34 no.3
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• pp.233-240
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• 1997

The Ru-based thick film resistor(TFR) for sintering at 90$0^{\circ}C$ was synthesized to prepare the LCR net-work. These compositions of pyrochlore could be prepared by decreasing the amount of PbO and increasing alumina and silica contents of glass frit. In this study, the sheet resistances of the TFTs. which sint-ered at 90$0^{\circ}C$ after printing on alumina substrate, the sheet resistances of the TFRs on inductor and capa-citor substrate and the interphase between TFR and substrate were observed. And the changes of the sheet resistance were obtained with the contents of RuO2. In case of the TFR sintered at 90$0^{\circ}C$, the sheet resis-tances on alumina substrates were in the range of 103~106$\Omega$/$\square$, but the sheet resistances of TFR on in-ductor and capacitor substrate were not obtained.