• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.5
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• pp.2015-2022
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• 2012

This paper is about the analysis and design of avionics equipment's housing and PCB(Printed Circuit Board) such as air data computer. Avionics equipment's structural design as well as electrical properties is very critical and should be proved from design phase by analysis method. First, analyze the static load and vibration requirement for the installed equipment, and then proved it satisfy with its requirement using the computational structural analysis. Commercial tools were used for computation and the rib design of housing was verified and the placement of electrical component was proposed using the PCB's local displacement information.

• Clean Technology
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• v.2 no.1
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• pp.47-52
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• 1996

The solvent extraction method was applied on a spent solution containing copper, which was produced in a printed circuit board process, to recover copper and to reuse the etching solution. Lix 64 N ($\alpha$-Hydroxyoxime + $\beta$-Hydroxybenzophenone Oxime) was used as a solvent. The acidic spent copper solution was mixed with and alkaline copper solution to pH=2. The solvent including 30 volume% of Lix 64 N extracted 17.1gr/l of copper from the mixed spent copper solution. In the continuous bench scale experiment, 4 stages for extraction, 2 stages for stripping and 4 stages for washing were used. Recovered copper was recycled as copper sulfate and the raffinate was reused as copper etchant. The percentage of copper recovery and the purity of copper sulfate were higher than 99.9%, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.69-75
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• 2001

Photoimageable thick film technology is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process. Line resolution of 25 $\mu\textrm{m}$ width and 25 $\mu\textrm{m}$ space could be obtained by laminating green sheet, printing photoimageable Ag paste, exposing the test patterns, developing, and co-firing. In case of using the alumina substrate, 20 $\mu\textrm{m}$ fine line could be also obtained by similar process. Test results showed that exposing power density and developing time were the most important processing parameters for the fine line formation. Microstrip and series gap resonators with well-defined line morphology and good transmission characteristics in high frequency were formed by this new technology, and thereby dielectric constant and loss of test substrate were calculated.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.26 no.12
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• pp.600-604
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• 2014

Longitudinal heat conduction is known to be an important factor in the design of a printed circuit heat exchanger(PCHE) for cryogenic applications. Parasitic heat conduction through the heat exchanger frame needs to be considered because it is known to decrease the effectiveness of the heat exchanger. In this paper, a conjugate heat transfer problem in a simple counter-flow PCHE is analyzed by a computational fluid dynamics simulation. The effect of longitudinal conduction in a straight channel is compared with the theoretical effectiveness-NTU relationship that assumes a "thin" heat exchanger frame. The calculation results suggest that the theoretical model is valid in the present calculation conditions where NTU is < 13.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.27 no.8
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• pp.426-431
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• 2015

The advantages of a printed circuit heat exchanger (PCHE) are the compactness and efficiency derived from its heat-transfer characteristics; furthermore, a PCHE for which a diffusion bonding method was used during production can be applied to extreme environments such as a cryogenic condition. In this study, a micro-channel PCHE fabricated by diffusion bonding was investigated in a cryogenic environment regarding its thermal performance and the pressure drop. The test rig consists of an LN2 storage tank, vaporizers, heaters, and a cold box, whereby the vaporized cryogenic nitrogen flows in hot and cold streams. The overall heat-transfer coefficients were evaluated and compared with traditional correlations. Lastly, we suggested the modified heat-transfer correlations for a PCHE in a cryogenic condition.

• Journal of the Korean Institute of Intelligent Systems
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• v.14 no.1
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• pp.20-27
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• 2004

We propose the character recognition system for Gerber files. The Gerber file is the vector-formatted drawing file for PCB manufacturing, which includes various symbols, figures and characters. Also, the characters are written in horizontal, vertical, and reverse-vortical directions. In this paper, we newly propose the Gerber-character recognition system to recognize all of component names located in PCB. To improve the performance, we develop the multiple recognizers by neural networks and the verifier considering the structural features. The developed system has been installed to the auto-programming software for PCB assembly and inspection machines.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.9
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• pp.2003-2008
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• 2013

In this paper, a design method for a ultra-wideband printed semi-circular-shaped dipole antenna operating in the band of 1-15 GHz is studied. The effects of the gap between the two arms of the semi-circular-shaped dipole and the radius of the semi-circle on the input reflection coefficient and gain characteristics are examined to obtain the optimal design parameters. The optimized printed semi-circular-shaped dipole antenna is fabricated on an FR4 substrate and the experimental results show that the antenna has a desired extremely wideband characteristic with a frequency band of 1-15 GHz (175%) for a VSWR < 2.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.187-187
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• 2011

최근 디스플레이 산업과 태양전지 등의 이차 전지 산업이 발달함에 따라 원가절감과 공정단계의 단순화를 위하여 다이렉트 패터닝 인쇄에 대한 연구가 관심을 받고 있으며, 나노전자부품 제작이 요구되는 전기/전자 소자들은 수백 nm에서부터 수십 ${\mu}$m 수준까지 다양한 해상도의 패턴으로 구성되므로 미세패턴이 가능한 정전수력학 잉크젯프린팅 방식은 기존의 인쇄 방식과 달리, 정전기력을 이용하여 인쇄를 하는 방식으로, 수KV의 고전압을 인가하여 잉크를 대전시키고, 대전된 잉크는 대부의 전기적 반발력에 의해 액적이나 액실로 분열하게 된다. 전하를 띤 액적 또는 액실은 정전기력을 받아 기판 쪽으로 이동을 하게 되는데, 이때 액적의 전하량에 의해 액적의 이동속도와 이동경로가 영향을 받게 된다. 본 연구에서는 잉크의 전기전도도에 따른 액적의 전하량을 계산하여 전기전도도와 액적의 전하량과의 관계를 ANASYS 시뮬레이션과 운동경로 분석을 통해 확인하였다. 전기전도도가 0.307s/m~5.6s/m인 잉크에 따른 액적의 전하량을 계산하였으며, 전기전도도가 변화에 따라. 전하량이 $0.5{\times}10^{-13}C{\sim}2.5{\times}10^{-13}C$ 으로 변화하는 것을 확인하였다.

• Resources Recycling
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• v.23 no.6
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• pp.30-39
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• 2014

The trajectories of PCB(Printed Circuit Board) particles in the corona discharge electrostatic separation was simulated. The PCB particles are prepared by crushing bare board, which disassembled from electronic components, consist mostly of copper and FR-4(Flame Retardant Level-4) Firstly, a model was established for calculating of detachment points of PCB particles from the rotating electrode in separator. The model of detachment points was derived from equilibrium of force such as gravity force, centrifugal force, electrostatic force. The trajectories of particles after detachment was calculated by acceleration derived from time-integrating method of motion equation. In this simulation, particle size, supplied voltage, rotation speed of rotating roll electrode and angle of induction electrode were adopted as variables. While the trajectories of FR-4 particles were affected by all variables, rotation speed of rotating roll electrode was dominant variables affecting trajectories of copper particles.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.43-49
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• 2015

By the trends of electronic package to be smaller, thinner and more integrative, organic printed circuit board is required to be finer Cu trace pitch. This paper reports on a study of failure mechanism for PCB with fine Cu trace pitch using biased HAST. In weibull analysis of the biased HAST lifetime, it is found that the acceleration factor (AF) of between $135^{\circ}C/90%RH/3.3V$ and $130^{\circ}C/85%RH/3.3V$ is 2.079. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $Cu_xO/Cu(OH)_2$ colloids and Cu dendrites were formed at anode (+) and at cathode (-), respectively. Thus, this gives the evidence that Cu dendrites formed at cathode by $Cu^{2+}$ ion migration lead to a short failure between a pair of Cu nets.