Development of warpage repair equipment for Printed Circuit Board (인쇄회로기판 휨 수정 장치 개발)

• Jeong, J.Y.;Park, I.S.;Park, K.H.;Kwon, D.H.;Lim, S.J.
• • Proceedings of the Korean Society of Precision Engineering Conference
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  • 2012.05a
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  • pp.873-874
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  • 2012
• PDF

Feasibility study on projection ablation of high-density printed circuit board (고밀도 인쇄 회로 기판 소재의 projection ablation 패터닝 기초 연구)

• Sohn, H.;Lee, H.;Park, J.S.
• • Proceedings of the Korean Society of Precision Engineering Conference
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  • 2013.05a
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  • pp.607-608
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  • 2013
• PDF

Study on trimming properties of resistors printed in PCB by using UV DPSS laser (UV DPSS Laser를 이용한 인쇄회로기판 저항체의 트리밍 가공특성에 대한 연구)

• Shin, S.H.;Park, H.C.;Ryu, K.H.;Nam, G.J.
• • Proceedings of the Korean Society of Precision Engineering Conference
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  • 2010.05a
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  • pp.731-732
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  • 2010
• PDF

An Automatic Inspection of SMT Rectangular Chips based on PCA Algorithm (PCA 알고리즘을 기반으로 한 SMT 각칩의 자동 검사 방법)

• 고경철;고국원;김종형;최현주;김재선
• • Journal of the Korean Society for Precision Engineering
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  • v.20 no.11
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  • pp.23-31
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  • 2003
• PDF KSCI

반도체 및 인쇄 회로 기판 보호를 위한 내열성 점착제에 대한 연구

• Lee, Jun-Hyeong;Yu, Su-Yong;Kim, Sang-Gyu;Mun, Myeong-Jun;Lee, Min-Gyu
• • Proceedings of the Korean Environmental Sciences Society Conference
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  • 2007.05a
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  • pp.554-557
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  • 2007
• PDF

Inkijet printing of PEDOT/PSS pattern on ITO substrate (잉크젯을 이용한 ITO 기판위의 PEDOT/PSS 패턴 인쇄)

• Kim, M.K.;Hwang, J.Y.;Lee, S.H.;Kang, H.S.;Kang, K.T.;Cho, J.Y.
• • Proceedings of the Korean Society of Precision Engineering Conference
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  • 2008.06a
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  • pp.135-136
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  • 2008
• PDF

Development of 3-D Inspection Technology for Solder Paste Using PMP method (위상천이법을 이용한 납 도포상태의 3차원 검사기술 개발)

• 김종형;한세현;고국원;고경철
• • Journal of the Korean Society for Precision Engineering
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  • v.20 no.10
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  • pp.12-21
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  • 2003
• PDF KSCI

The Recent trend on the Numerical Analysis of EMI in PCB (PCB에 EMI 수치해석에 관한 최근동향)

• 장인범;김진사;이수길;이준웅
• • Electrical & Electronic Materials
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  • v.10 no.9
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  • pp.952-959
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  • 1997
• PDF

Characteristics of Laser Processing for Build-up Films of Printed Circuit Board (인쇄회로기판용 빌드업 필름의 레이저 가공 특성)

• Kang, J.W.;Park, S.M.;Sohn, H.K.;Yun, D.Y.;Park, S.J.
• • Proceedings of the Korean Society of Precision Engineering Conference
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  • 2011.06a
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  • pp.167-168
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  • 2011
• PDF

Technology for Ecovering Valuable Metals from Printed Circuit Boards of the Used Computer (폐컴퓨터의 PCBs로부터 유가금속 회수기술)

• Lee, Jae-Chun;Jeong, Jin-Ki
• • Journal of the Korean Society for Precision Engineering
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  • v.17 no.8
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  • pp.26-40
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  • 2000
• PDF

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